On The Enhancements of Planar Based RF Sensor Technology

• US 20140049250A1
• Filed: 03/14/2013
• Published: 02/20/2014
• Est. Priority Date: 08/16/2012
• Status: Active Grant

• Current Assignee: MKS Instruments Incorporated
• Original Assignee: MKS Instruments Incorporated
• Inventors: COUMOU, David J., BROWN, Dennis M., BROOKS, Raymond
• Granted Patent: US 9,291,649 B2
• Time in Patent Office: Days
• US Class Current: 324/127
• CPC Class Codes: G01R 15/181 using coils without a magnetic core, e.g. Rogowski coils
• CPC Class Codes: G01R 19/00 Arrangements for measuring currents or voltages or for indicating presence or sign thereof G01R5/00 takes precedence; for measuring bioelectric currents or voltages A61B5/24
• CPC Class Codes: H01F 2038/305 with toroidal magnetic core
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H01F 38/30 Constructions
• CPC Class Codes: H05H 1/46 using applied electromagnetic fields, e.g. high frequency or microwave energy H05H1/26 takes precedence
• CPC Class Codes: H05H 2242/24 Radiofrequency or microwave generators

Abstract

A radio frequency sensor system includes a printed circuit board (PCB). The PCB includes a first exterior layer, a second exterior layer, a first interior layer, a second interior layer, and an inner perimeter that defines an aperture through the PCB. The PCB also includes a first loop. The first loop includes a first plurality of sensor pads coupled to a first plurality of vias by a first plurality of traces. The first plurality of sensor pads is arranged on the inner perimeter. The PCB also includes a second loop. The second loop includes a second plurality of sensor pads coupled to a second plurality of vias by a second plurality of traces. The second plurality of sensor pads is arranged on the inner perimeter. A core ring is embedded within the first interior layer proximal to the first plurality of sensor pads, the first plurality of vias, and the first plurality of traces. A center conductor, for carrying RF current, extends through the aperture. The first and second loops generate an electrical signal based on the first and second plurality of sensor pads, the first and second plurality of vias, the first and second plurality of traces, and the core ring.

Claims

1. A radio frequency (RF) sensor system comprising:

a printed circuit board (PCB) including a first exterior layer, a second exterior layer, a first interior layer, a second interior layer, and an inner perimeter that defines an aperture through the PCB;

a first loop comprising a first plurality of sensor pads coupled to a first plurality of vias by a first plurality of traces, the first plurality of sensor pads being arranged on the inner perimeter;

a second loop comprising a second plurality of sensor pads coupled to a second plurality of vias by a second plurality of traces, the second plurality of sensor pads being arranged on the inner perimeter; and

a core ring embedded within the first interior layer proximal to the first plurality of sensor pads, the first plurality of vias, and the first plurality of traces;

wherein a center conductor for carrying RF current extends through the aperture and the first and second loops generate an electrical signal based on the first and second plurality of sensor pads, the first and second plurality of vias, the first and second plurality of traces, and the core ring.

2. The RF sensor system of claim 1 wherein the core ring consists of a medium with a greater permeability than air.

3. The RF sensor system of claim 1 wherein the core ring consists of a ferromagnetic material.

4. The RF sensor system of claim 1 wherein the core ring has a coefficient of thermal expansion equal to the coefficient of expansion of the first and second exterior layers and the first and second interior layers.

5. The RF sensor system of claim 1 wherein the core ring has a coefficient of thermal expansion of less than the coefficient of expansion of the first and second exterior layers and the first and second interior layers.

6. The RF sensor system of claim 1 wherein at least one of a plurality of characteristics of the plurality of vias is selectively adjusted based on a resonance of the RF sensor.

7. The RF sensor system of claim 1 further comprising a second PCB including a third exterior layer, a fourth exterior layer, a third interior layer, a fourth interior layer, and an second inner perimeter that defines a second aperture through the second PCB;

a third loop comprising a third plurality of sensor pads coupled to a third plurality of vias by a third plurality of traces, the third plurality of sensor pads being arranged on the second inner perimeter; and

a fourth loop comprising a fourth plurality of sensor pads coupled to a fourth plurality of vias by a fourth plurality of traces, the fourth plurality of sensor pads being arranged on the second inner perimeter.

8. The RF sensor system of claim 7 wherein the fourth exterior layer is electrically bound to the first exterior layer.

9. The RF sensor system of claim 8 wherein the first plurality of sensor pads, the second plurality of sensor pads, third plurality of sensor pads, and the fourth plurality of sensor pads are electronically connected in series.

10. The RF sensor system of claim 8 wherein the first plurality of sensor pads, the second plurality of sensor pads, third plurality of sensor pads, and the fourth plurality of sensor pads are electronically connected in parallel.

11. A radio frequency (RF) sensing method comprising:

defining an aperture through a printed circuit board (PCB), wherein the PCB includes a first exterior layer, a second exterior layer, a first interior layer, a second interior layer, and an inner perimeter;

coupling a first loop comprising a first plurality of sensor pads to a first plurality of vias by a first plurality of traces, arranging the first plurality of sensor pads on the inner perimeter;

coupling a second loop comprising a second plurality of sensor pads to a second plurality of vias by a second plurality of traces, arranging the second plurality of sensor pads on the inner perimeter; and

embedding a core ring within the first interior layer proximal to the first plurality of sensor pads, the first plurality of vias, and the first plurality of traces;

wherein a center conductor for carrying RF current extends through the aperture and the first and second loops generate an electrical signal based on the first and second plurality of sensor pads, the first and second plurality of vias, the first and second plurality of traces, and the core ring.

12. The RF sensing method of claim 11 wherein the core ring consists of a medium with a greater permeability than air.

13. The RF sensing method of claim 11 wherein the core ring consists of a ferromagnetic material.

14. The RF sensing method of claim 11 wherein the core ring has a coefficient of thermal expansion equal to the coefficient of expansion of the first and second exterior layers and the first and second interior layers.

15. The RF sensing method of claim 11 wherein the core ring has a coefficient of thermal expansion of less than the coefficient of expansion of the first and second exterior layers and the first and second interior layers.

16. The RF sensing method of claim 11 wherein at least one of a plurality of characteristics of the plurality of vias is selectively adjusted based on a resonance of the RF sensor.

17. The RF sensing method of claim 11 further comprising defining a second aperture a second PCB, wherein the second PCB includes a third exterior layer, a fourth exterior layer, a third interior layer, a fourth interior layer, and a second inner perimeter;

coupling a third loop comprising a third plurality of sensor pads to a third plurality of vias by a third plurality of traces, the third plurality of sensor pads being arranged on the second inner perimeter; and

coupling a fourth loop comprising a fourth plurality of sensor pads to a fourth plurality of vias by a fourth plurality of traces, the fourth plurality of sensor pads being arranged on the second inner perimeter.

18. The RF sensing method of claim 17 further comprising electrically binding the fourth exterior layer to the first exterior layer.

19. The RF sensing method of claim 18 further comprising electrically connected in series the first plurality of sensor pads, the second plurality of sensor pads, third plurality of sensor pads, and the fourth plurality of sensor pads.

20. The RF sensing method of claim 18 further comprising electrically connecting in parallel the first plurality of sensor pads, the second plurality of sensor pads, third plurality of sensor pads, and the fourth plurality of sensor pads.