On The Enhancements of Planar Based RF Sensor Technology
First Claim
1. A radio frequency (RF) sensor system comprising:
- a printed circuit board (PCB) including a first exterior layer, a second exterior layer, a first interior layer, a second interior layer, and an inner perimeter that defines an aperture through the PCB;
a first loop comprising a first plurality of sensor pads coupled to a first plurality of vias by a first plurality of traces, the first plurality of sensor pads being arranged on the inner perimeter;
a second loop comprising a second plurality of sensor pads coupled to a second plurality of vias by a second plurality of traces, the second plurality of sensor pads being arranged on the inner perimeter; and
a core ring embedded within the first interior layer proximal to the first plurality of sensor pads, the first plurality of vias, and the first plurality of traces;
wherein a center conductor for carrying RF current extends through the aperture and the first and second loops generate an electrical signal based on the first and second plurality of sensor pads, the first and second plurality of vias, the first and second plurality of traces, and the core ring.
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Abstract
A radio frequency sensor system includes a printed circuit board (PCB). The PCB includes a first exterior layer, a second exterior layer, a first interior layer, a second interior layer, and an inner perimeter that defines an aperture through the PCB. The PCB also includes a first loop. The first loop includes a first plurality of sensor pads coupled to a first plurality of vias by a first plurality of traces. The first plurality of sensor pads is arranged on the inner perimeter. The PCB also includes a second loop. The second loop includes a second plurality of sensor pads coupled to a second plurality of vias by a second plurality of traces. The second plurality of sensor pads is arranged on the inner perimeter. A core ring is embedded within the first interior layer proximal to the first plurality of sensor pads, the first plurality of vias, and the first plurality of traces. A center conductor, for carrying RF current, extends through the aperture. The first and second loops generate an electrical signal based on the first and second plurality of sensor pads, the first and second plurality of vias, the first and second plurality of traces, and the core ring.
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Citations
20 Claims
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1. A radio frequency (RF) sensor system comprising:
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a printed circuit board (PCB) including a first exterior layer, a second exterior layer, a first interior layer, a second interior layer, and an inner perimeter that defines an aperture through the PCB; a first loop comprising a first plurality of sensor pads coupled to a first plurality of vias by a first plurality of traces, the first plurality of sensor pads being arranged on the inner perimeter; a second loop comprising a second plurality of sensor pads coupled to a second plurality of vias by a second plurality of traces, the second plurality of sensor pads being arranged on the inner perimeter; and a core ring embedded within the first interior layer proximal to the first plurality of sensor pads, the first plurality of vias, and the first plurality of traces; wherein a center conductor for carrying RF current extends through the aperture and the first and second loops generate an electrical signal based on the first and second plurality of sensor pads, the first and second plurality of vias, the first and second plurality of traces, and the core ring. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A radio frequency (RF) sensing method comprising:
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defining an aperture through a printed circuit board (PCB), wherein the PCB includes a first exterior layer, a second exterior layer, a first interior layer, a second interior layer, and an inner perimeter; coupling a first loop comprising a first plurality of sensor pads to a first plurality of vias by a first plurality of traces, arranging the first plurality of sensor pads on the inner perimeter; coupling a second loop comprising a second plurality of sensor pads to a second plurality of vias by a second plurality of traces, arranging the second plurality of sensor pads on the inner perimeter; and embedding a core ring within the first interior layer proximal to the first plurality of sensor pads, the first plurality of vias, and the first plurality of traces; wherein a center conductor for carrying RF current extends through the aperture and the first and second loops generate an electrical signal based on the first and second plurality of sensor pads, the first and second plurality of vias, the first and second plurality of traces, and the core ring. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification