SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT

• US 20140049928A1
• Filed: 08/23/2012
• Published: 02/20/2014
• Est. Priority Date: 08/17/2012
• Status: Abandoned Application

• Current Assignee: Taiyo Yuden Company Limited (Taiyo Yuden Co)
• Original Assignee: Taiyo Yuden Company Limited (Taiyo Yuden Co)
• Inventors: Sawatari, Tatsuro, Mugiya, Eiji, Nakamura, Hiroshi
• Application Number:
  US13/593,131
• Publication Number:
  US 20140049928A1
• Time in Patent Office: Days
• US Class Current: 361/762
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 24/19 Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H05K 1/185 Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit semiconductor chips encapsulated by interconnect and support structures H01L23/5389, H01L24/00
• CPC Class Codes: H05K 3/4679 Aligning added circuit layers or via connections relative to previous circuit layers

Abstract

Provided is a substrate with a built-in electronic component that can avoid as much as possible the occurrence of malfunctions in the electronic component due to moisture entering, even when an electronic component, provided with a structure in which a terminal pad is present where a hole in the sealing part provided on the main body of a component is located, is built into the substrate. A SAW filter 12 built into a substrate 11 is provided with a structure that has terminal pads 12c to 12e on the bottom of respective holes 12f1 in a sealing part 12f. The lower surfaces of respective conductive vias 11d2 are connected to the upper surfaces of the terminal pads 12c to 12e through the respective holes 12f1 such that a ring-shaped gap CC is formed between outer surfaces of the conductive vias 11d2 and inner surfaces of the holes 12f1. Each ring-shaped gap CC is filled with a part that is integral with a first insulating layer 11c.

Claims

1. A substrate with a built-in electronic component, comprising:

a core layer;

an electronic component built in the core layer, the electronic component having a terminal pad where a hole in a sealing part provided on at least a portion of the electronic component is located;

a conductive via provided in an insulating layer that covers the sealing part, the conductive via being connected to the terminal pad; and

a reinforcing member that is in contact with an inner surface of the hole in the sealing part, a periphery of an opening of the hole in the sealing part, and at least a part of the terminal pad.

2. The substrate with a built-in electronic component according to claim 1,

wherein the electronic component has a structure in which the terminal pad is present on a bottom of the hole in the sealing part,

wherein the conductive via is connected to the terminal pad through the hole in the sealing part such that a ring-shaped gap is formed between an outer surface of the conductive via and the inner surface of the hole in the sealing part,

wherein the insulating layer has a filler part that is integrally formed therewith, the filler part filling the ring-shaped gap and being in contact with the outer surface of the conductive via, the inner surface of the hole in the sealing part, and a part that is not connected to the conductive via of the terminal pad, and

wherein the reinforcing member is constituted of the filler part of the insulating layer and a part of the insulating layer that is in contact with the periphery of the opening of the hole in the sealing part.

3. The substrate with a built-in electronic component according to claim 1,

wherein the electronic component comprises:

a relay pad on the bottom of the hole in the sealing part; and

a terminal element that has a substantially T-shaped cross section, the terminal element being integrally formed of;

a columnar part connected to the relay pad and in contact with the inner surface of the hole in the sealing part; and

a terminal pad that is larger than the columnar part and that is in contact with the periphery of the opening of the hole in the sealing part,

wherein the conductive via is connected to the terminal pad of the terminal element, and

wherein the reinforcing member is constituted of the columnar part and the terminal pad of the terminal element.

4. The substrate with a built-in electronic component according to claim 3,

wherein the conductive via is connected to the terminal pad such that a center line of the conductive via is offset from a center line of the columnar part of the terminal element.

5. The substrate with a built-in electronic component according to claim 1,

wherein the sealing part is made of a thermoplastic, and the insulating layer is made of a thermosetting plastic.

6. The substrate with a built-in electronic component according to claim 1,

wherein the electronic component is an elastic wave filter.