ANISOTROPIC HEAT DISSIPATION IN A BACKLIGHT UNIT

• US 20140049985A1
• Filed: 08/19/2013
• Published: 02/20/2014
• Est. Priority Date: 08/17/2012
• Status: Abandoned Application

• Current Assignee: Wah Hong Industrial Corp.
• Original Assignee: Chiu-Lang Lin, Ko-Chun Chen
• Inventors: CHEN, Ko-Chun, LIN, Chiu-Lang
• Application Number:
  US13/970,221
• Publication Number:
  US 20140049985A1
• Time in Patent Office: Days
• US Class Current: 362/611
• CPC Class Codes: G02B 6/0085 Means for removing heat created by the light source from the package heat extraction or cooling elements for semiconductor light sources in general H01L33/64
• CPC Class Codes: G02F 1/1336 Illuminating devices
• CPC Class Codes: G09F 13/04 Signs, boards or panels, illuminated from behind the insignia

Abstract

A backlight unit with a light source, a light guiding plate, a reflective film and an anisotropic heat dissipation layer is disclosed. At least some embodiments provide a display panel including the backlight unit and methods for reducing the temperature of a backlight unit by the anisotropic heat dissipation layer.

Claims

1. A backlight unit, comprising:

a light source;

a light guide plate;

a reflective film; and

a means for anisotropically dissipating heat.

2. The backlight unit of claim 1, further comprising:

a printed circuit board positioned below said light source, wherein

the reflective film is configured to reflect heat.

3. The backlight unit of claim 1, wherein the reflective film has a reflectivity of at least 70%.

4. The backlight unit of claim 1, further comprising:

a housing; and

means for electrically insulating at least one of (i) the light guide plate, (ii) the reflective film and (iii) the means for anisotropically dissipating heat from the housing.

5. The backlight unit of claim 1, wherein the means for anisotropically dissipating heat is substantially free of binder, curing agent and filler.

6. A method for reducing the temperature of a backlight unit, which comprises the following actions:

(a) conducting heat from a light source to a light guide plate;

(b) conducting the heat conducted to the light guide plate from said light guide plate to said reflective film and said anisotropic heat dissipation layer; and

(c) dissipating the heat through the planar direction of said anisotropic heat dissipation layer.

7. The method of claim 6, wherein said anisotropic heat dissipation layer is graphite.

8. A method for reducing the temperature of a backlight unit, which comprises the following actions:

(a) conducting heat from a light source to a printed circuit board;

(b)conducting the heat conducted to the printed circuit board to a reflective film, wherein a portion of the heat is reflected into the ambient air by said reflective film; and

(c) a portion of the heat is dissipated to an anisotropic heat dissipation layer through the planar direction.

9. The method of claim 8, wherein said anisotropic heat dissipation layer is graphite.