ABRASIVE AND POLISHING COMPOSITION

• US 20140051335A1
• Filed: 01/19/2012
• Published: 02/20/2014
• Est. Priority Date: 01/27/2011
• Status: Abandoned Application

• Current Assignee: Fujimi Incorporated
• Original Assignee: Fujimi Incorporated
• Inventors: Morinaga, Hitoshi, Tamai, Kazusei, Ishihara, Naoyuki, Yamada, Eiichi, Ishibashi, Tomoaki, Otsu, Taira, Takahashi, Youhei
• Application Number:
  US13/981,231
• Publication Number:
  US 20140051335A1
• Time in Patent Office: Days
• US Class Current: 451/41
• CPC Class Codes: B24B 37/044 characterised by the composition of the lapping agent
• CPC Class Codes: C09G 1/02 containing abrasives or grinding agents abrasives as such C09K3/14; polishing of semi-conductors H01L
• CPC Class Codes: C09K 3/1409 Abrasive particles per se preparation of diamond C01B32/25
• CPC Class Codes: C09K 3/1463 Aqueous liquid suspensions

Abstract

Provided is a polishing composition containing an abrasive and water. The abrasive content in the polishing composition is no less than 0.1% by mass. The abrasive contains zirconium oxide particles. The zirconium oxide particles have a specific surface area of from 1 to 15 m²/g. The zirconium oxide particles preferably have a purity of no less than 99% by mass. The polishing composition is used in, for example, polishing a hard and brittle material, such as sapphire, silicon nitride, silicon carbide, silicon oxide, glass, gallium nitride, gallium arsenide, indium arsenide, and indium phosphide.

Claims

1. An abrasive comprising zirconium oxide particles, wherein the zirconium oxide particles have a specific surface area of from 1 to 15 m²/g.

2. The abrasive according to claim 1, wherein the zirconium oxide particles have a purity of no less than 99% by mass.

3. The abrasive according to claim 1, wherein the zirconium oxide particles have an average primary particle size of 0.3 μ

m or less.

4. The abrasive according to claim 1, wherein the zirconium oxide particles have an average secondary particle size of from 0.1 to 5 μ

m.

5. The abrasive according to claim 1, wherein, of the zirconium oxide particles, the number of particles having a secondary particle size of no less than 5 μ

m is 10,000,000 or less per mL of an aqueous dispersion containing 1% by mass of the zirconium oxide particles.

6. A method of producing the abrasive according to claim 1, the method comprising dry powdering zirconium oxide particles.

7. A polishing composition comprising the abrasive according to claim 1 and water, wherein the content of the abrasive in the polishing composition is no less than 0.1% by mass.

8. The polishing composition according to claim 7, further comprising a cerium salt and/or a zirconium salt.

9. A method of polishing a hard and brittle material with the polishing composition according to claim 7.

10. A method of manufacturing a hard and brittle material substrate, the method comprising polishing a substrate using the method according to claim 9.