Apparatus for Cleaning a Semiconductor Substrate

• US 20140059789A1
• Filed: 10/16/2013
• Published: 03/06/2014
• Est. Priority Date: 12/30/2005
• Status: Abandoned Application

• Current Assignee: Lam Research Corporation
• Original Assignee: Lam Research Corporation
• Inventors: deLarios, John M., Mikhaylichenko, Katrina, Ravkin, Michael, Korolik, Mikhail, Redeker, Fred C., Freer, Erik M.
• Application Number:
  US14/055,850
• Publication Number:
  US 20140059789A1
• Time in Patent Office: Days
• US Class Current: 15/103.5
• CPC Class Codes: B05D 3/10 by other chemical means
• CPC Class Codes: B08B 3/00 Cleaning by methods involving the use or presence of liquid or steam B08B9/00 takes precedence
• CPC Class Codes: B08B 7/00 Cleaning by methods not provided for in a single other subclass or a single group in this subclass
• CPC Class Codes: B08B 7/02 by distortion, beating, or vibration of the surface to be cleaned B08B7/0007 takes precedence
• CPC Class Codes: C11D 17/0004 Non aqueous liquid compositions comprising insoluble particles
• CPC Class Codes: C11D 17/0013 Liquid compositions with insoluble particles in suspension C11D17/0021, C11D17/0026, C11D17/003 take precedence
• CPC Class Codes: C11D 17/0017 Multi-phase liquid compositions
• CPC Class Codes: C11D 2111/22 Electronic devices, e.g. PCBs or semiconductors
• CPC Class Codes: C11D 3/14 Fillers; Abrasives ; Abrasive compositions; Suspending or absorbing agents not provided for in one single group of C11D3/12; Specific features concerning abrasives, e.g. granulometry or mixtures dyes, pigments C11D3/40
• CPC Class Codes: C11D 9/02 on alkali or ammonium soaps
• CPC Class Codes: C23G 1/00 Cleaning or pickling metallic material with solutions or molten salts with organic solvents C23G5/02
• CPC Class Codes: C23G 1/18 Organic inhibitors
• CPC Class Codes: G03F 7/42 Stripping or agents therefor
• CPC Class Codes: G03F 7/423 containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds
• CPC Class Codes: H01L 21/02052 Wet cleaning only H01L21/02085 takes precedence
• CPC Class Codes: H01L 21/02057 Cleaning during device manufacture
• CPC Class Codes: H01L 21/02096 only mechanical cleaning
• CPC Class Codes: H01L 21/31133 by chemical means
• CPC Class Codes: H01L 21/67028 for cleaning followed by drying, rinsing, stripping, blasting or the like
• CPC Class Codes: H01L 21/67051 using mainly spraying means, e.g. nozzles
• CPC Class Codes: H01L 21/6708 : using mainly spraying means, e.g. nozzles
• CPC Class Codes: H01L 21/67086 : with the semiconductor substrates being dipped in baths or vessels
• CPC Class Codes: H01L 21/67092 : Apparatus for mechanical treatment or grinding or cutting, see the relevant groups in subclasses B24B or B28D
• CPC Class Codes: H01L 21/6715 : Apparatus for applying a liquid, a resin, an ink or the like H01L21/67126 takes precedence
• CPC Class Codes: Y10T 137/4891 : With holder for solid, flaky or pulverized material to be dissolved or entrained

Abstract

An apparatus for processing a substrate is provided. The apparatus includes a solid material having a support side and a contact side. The contact side has an outer surface, and the outer surface is configured to become softer relative to a remainder of the solid material when exposed to an activation solution. The apparatus includes a support structure configured to support the solid material from the support side of the solid material, such that the contact side of the solid material is oriented to face a surface of the substrate, when the substrate is present. Also provided is a gimbaled structure connected to the support structure. The gimbaled structure enabling the outer surface of the contact side to substantially align in a coplanar arrangement with the surface of the substrate, when the substrate is present. A force application structure is coupled to the gimbaled structure. The force application structure is configured for moving the solid material toward and away from the surface of the substrate, when the substrate is present, and further configured for applying a force that presses the outer surface of the solid material against the surface of the substrate, when the substrate is present.

Claims

1. An apparatus for processing a substrate, comprising:

a solid material having a support side and a contact side, the contact side having an outer surface, the outer surface configured to become softer relative to a remainder of the solid material when exposed to an activation solution;

a support structure configured to support the solid material from the support side of the solid material, such that the contact side of the solid material is oriented to face a surface of the substrate, when the substrate is present;

a gimbaled structure connected to the support structure, the gimbaled structure enabling the outer surface of the contact side to substantially align in a coplanar arrangement with the surface of the substrate, when the substrate is present; and

a force application structure coupled to the gimbaled structure, the force application structure configured for moving of the solid material toward and away from the surface of the substrate, when the substrate is present, and further configured for applying a force that presses the outer surface of the solid material against the surface of the substrate, when the substrate is present.

2. The apparatus of claim 1, wherein the gimbaled structure includes rotation structure to enable movement of the support structure in a least two axis of gimbal.

3. The apparatus of claim 1, wherein the gimbaled structure includes rotation structure to enable movement of the support structure in multiple dimensions.

4. The apparatus of claim 1, wherein the gimbaled structure includes rotation structure includes two or three pairs of pivots mounted on axes at right angles.

5. The apparatus of claim 1, wherein the solid material is selected from a group consisting of a fatty acid, an alkyl sulfonate, an alkyl phosphate, and an alkyl phosphonate.

6. The apparatus of claim 1, wherein the support structure includes a shaft through an axis of the solid material and wherein the solid material rotates around the axis.

7. The apparatus of claim 1, wherein the gimbaled structure is configured for rotation.

8. The apparatus of claim 1, further comprising:

a fluid delivery system for providing the activation solution to the surface of the substrate, when present.

9. The apparatus of claim 1, wherein the activation solution is alkaline or is a surfactant.

10. The apparatus of claim 1, wherein a component of the outer surface is ionized by the activation solution.

11. The apparatus of claim 1, wherein the outer surface is a planar surface.

12. The apparatus of claim 1, wherein the force causes a plastic deformation of the surface of the solid cleaning element, thereby depositing a layer of the solid cleaning element onto the substrate surface, the layer of the solid cleaning element is configured for rinsing off of the substrate surface.

13. The apparatus of claim 1, wherein the plastic deformation is at least partially caused by a lateral force.

14. An apparatus for processing a substrate, comprising:

a fatty acid puck having a support side and a contact side, the contact side having an outer surface, the outer surface configured to become softer relative to a remainder of the fatty acid puck when exposed to an activation solution;

a support structure configured to support the fatty acid puck from the support side of the fatty acid puck, such that the contact side of the fatty acid puck is oriented to face a surface of the substrate, when the substrate is present;

a gimbaled structure connected to the support structure, the gimbaled structure enabling the outer surface of the contact side to substantially align in a coplanar arrangement with the surface of the substrate, when the substrate is present; and

a force application structure coupled to the gimbaled structure, the force application structure configured for moving of the fatty acid puck toward and away from the surface of the substrate, when the substrate is present, and further configured for applying a force that presses the outer surface of the fatty acid puck against the surface of the substrate, when the substrate is present.

15. The apparatus of claim 14, wherein the gimbaled structure includes rotation structure to enable movement of the support structure in multiple dimensions.

16. The apparatus of claim 14, wherein the support structure includes a shaft through an axis of the fatty acid puck and wherein the fatty acid puck rotates around the axis.

17. The apparatus of claim 14, wherein the gimbaled structure is configured for rotation, and wherein the force causes a plastic deformation of the surface of the fatty acid puck, thereby depositing a layer of the fatty acid puck onto the substrate surface, the layer of the fatty acid puck is configured for rinsing off of the substrate surface.

18. The apparatus of claim 14, further comprising:

a fluid delivery system for providing the activation solution to the surface of the substrate, when present, and the activation solution is alkaline or is a surfactant, and a component of the outer surface is ionized by the activation solution.

19. An apparatus for processing a substrate, comprising:

a bar material having a support side and a contact side, the contact side having an outer surface, the outer surface configured to become softer relative to a remainder of the bar material when exposed to an activation solution;

a support structure configured to support the bar material from the support side of the bar material, such that the contact side of the bar material is oriented to face a surface of the substrate, when the substrate is present;

a gimbaled structure connected to the support structure, the gimbaled structure enabling the outer surface of the contact side to substantially align in a coplanar arrangement with the surface of the substrate, when the substrate is present; and

a force application structure coupled to the gimbaled structure, the force application structure configured for moving of the bar material toward and away from the surface of the substrate, when the substrate is present, and further configured for applying a force that presses the outer surface of the bar material against the surface of the substrate, when the substrate is present.

20. The apparatus of claim 19, wherein the gimbaled structure is configured for rotation, and wherein the force causes a plastic deformation of the surface of the bar material, thereby depositing a layer of the bar material onto the substrate surface, the layer of the bar material is configured for rinsing off of the substrate surface, and further comprising,

a fluid delivery system for providing the activation solution to the surface of the substrate, when present, and the activation solution is alkaline or is a surfactant, and a component of the outer surface is ionized by the activation solution.