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LEADFRAMES, AIR-CAVITY PACKAGES, AND ELECTRONIC DEVICES WITH OFFSET VENT HOLES, AND METHODS OF THEIR MANUFACTURE

  • US 20140061883A1
  • Filed: 08/31/2012
  • Published: 03/06/2014
  • Est. Priority Date: 08/31/2012
  • Status: Active Grant
First Claim
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1. A device comprising:

  • a leadframe feature having a first surface, a second surface opposed to the first surface, and a vent hole formed between the first surface and the second surface, wherein a cross-sectional area of the vent hole varies substantially between the first surface and the second surface.

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