PACKAGED DEVICE EXPOSED TO ENVIRONMENTAL AIR AND LIQUIDS AND MANUFACTURING METHOD THEREOF
First Claim
Patent Images
1. A packaged device, comprising:
- a chip; and
a package body delimiting a chamber, at least a portion of the chip being located in the chamber, the package body including an air-permeable area having a plurality of holes and a liquid-repellent structure that together enable passage of air between an external environment and the chamber and block passage of liquids.
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0 Petitions
Accused Products
Abstract
A packaged device, wherein at least one sensitive portion of a chip is enclosed in a chamber formed by a package. The package has an air-permeable area having a plurality of holes and a liquid-repellent structure so as to enable passage of air between an external environment and the chamber and block the passage of liquids.
21 Citations
22 Claims
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1. A packaged device, comprising:
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a chip; and a package body delimiting a chamber, at least a portion of the chip being located in the chamber, the package body including an air-permeable area having a plurality of holes and a liquid-repellent structure that together enable passage of air between an external environment and the chamber and block passage of liquids. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method for manufacturing a packaged device, the method comprising:
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forming a package body delimiting a chamber; enclosing at least a portion of a chip in the package body with the chamber being located over a sensitive portion of the chip; forming an air-permeable area in the package body that includes forming a plurality of holes; and forming a liquid-repellent structure on the package body at the air-permeable area. - View Dependent Claims (12, 13, 14, 15, 16)
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17. A packaged device, comprising:
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a chip that includes a membrane; a package body having an inner chamber, a portion of the chip being located in the chamber of the package body, the package body including a structure having an inner surface located proximate the inner chamber and an outer surface, the structure including a plurality of holes that extend from the outer surface to the inner surface, the plurality of holes being configured to allow air to flow between an environment outside of the package body and the inner chamber, the outer surface of the structure having a roughened surface that is configured to prevent water droplets from being provided to the inner chamber. - View Dependent Claims (18, 19, 20, 21, 22)
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Specification