SIGNAL STABILIZATION IN A NON-RESISTIVE CONTACT SENSOR ASSEMBLY

• US 20140062508A1
• Filed: 03/15/2013
• Published: 03/06/2014
• Est. Priority Date: 08/31/2012
• Status: Active Grant

• Current Assignee: Rescon Ltd.
• Original Assignee: Rescon Ltd.
• Inventors: DAWSON, Thomas Andrew
• Granted Patent: US 9,239,347 B2
• Time in Patent Office: Days
• US Class Current: 324/686
• CPC Class Codes: A61B 2562/0214 Capacitive electrodes
• CPC Class Codes: A61B 5/24 Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
• CPC Class Codes: A61B 5/25 Bioelectric electrodes therefor
• CPC Class Codes: A61B 5/274 using snap or button fasteners
• CPC Class Codes: A61B 5/282 Holders for multiple electrodes for introduction into the body A61B5/287
• CPC Class Codes: A61B 5/6803 Head-worn items, e.g. helmets, masks, headphones or goggles
• CPC Class Codes: A61B 5/6804 Garments; Clothes
• CPC Class Codes: A61B 5/6893 Cars
• CPC Class Codes: A61B 5/6894 Wheel chairs
• CPC Class Codes: G01R 27/2605 Measuring capacitance capacitive sensors G01D5/24
• CPC Class Codes: G01R 29/12 Measuring electrostatic fields or voltage-potential

Abstract

A non-resistive contact sensor assembly includes an electric field sensor device, including a dry electrode component for receiving an electrical signal from an object of interest and a signal processing component for processing the electrical signal, and a casing in which the signal processing component is surrounded or embedded. The processing component may include communications capabilities.

Claims

1. A non-resistive contact sensor assembly, comprising:

a dry electrode component for receiving an electrical signal from an object of interest;

a signal processing component for processing the electrical signal, wherein;

the signal processing component includes an A/D converter that converts the electrical signal from the object of interest to a digitized signal, and

the dry electrode component and signal processing component together define an electric field sensor device; and

a casing in which the signal processing component is surrounded or embedded.

2. The non-resistive contact sensor assembly of claim 1, wherein the signal processing component further includes a bandwidth filter that filters the electrical signal from the object of interest prior to being converted to a digitized signal by the A/D converter for converting the electrical signal from the object of interest to a digitized signal.

3. The non-resistive contact sensor assembly of claim 1, wherein the signal processing component, including the A/D converter, is electrically shielded from the dry electrode component by an internal partition.

4. The non-resistive contact sensor assembly of claim 3, wherein the internal partition is provided in the form of a circuit board.

5. The non-resistive contact sensor assembly of claim 3, wherein the signal processing component is an A/D converter, and wherein the assembly further comprises at least one additional signal processing component, electrically shielded from the dry electrode component by the internal partition, for processing the output of the A/D converter.

6. The non-resistive contact sensor assembly of claim 3, further comprising an amplifier component that is distinct from the dry electrode component, and wherein the signal processing component is electrically shielded from the amplifier component by the internal partition.

7. The non-resistive contact sensor assembly of claim 3, wherein the internal partition is a structural extension of the casing.

8. The non-resistive contact sensor assembly of claim 3, wherein the signal processing component is a transmitter for transmitting a resulting digitized signal to another location.

9. The non-resistive contact sensor assembly of claim 8, wherein the transmitting occurs wirelessly.

10. The non-resistive contact sensor assembly of claim 8, wherein the transmitting occurs over a data cable physically connected to the assembly.

11. The non-resistive contact sensor assembly of claim 3, further comprising a circuit board on which the signal processing component is mounted, and wherein the circuit board is electrically shielded from the dry electrode component by the internal partition.

12. The non-resistive contact sensor assembly of claim 1, wherein the casing is part of a housing for the assembly, and wherein the dry electrode component is exposed to the exterior of the housing.

13. The non-resistive contact sensor assembly of claim 12, wherein the casing is electrically isolated from the dry electrode component.

14. The non-resistive contact sensor assembly of claim 1, wherein the dry electrode component is adapted to avoid resistive contact with a surface of the object of interest.

15. The non-resistive contact sensor assembly of claim 14, wherein the dry electrode component is adapted to avoid resistive contact with human skin.

16. The non-resistive contact sensor assembly of claim 1, wherein the casing is adapted to make direct resistive contact with a surface of the object of interest.

17. The non-resistive contact sensor assembly of claim 16, wherein the dry electrode component is adapted to avoid resistive contact with human skin.

18. The non-resistive contact sensor assembly of claim 1, wherein the assembly is in the form of a sensor head.

19. The non-resistive contact sensor assembly of claim 1, wherein the casing is electrically grounded.

20. The non-resistive contact sensor assembly of claim 19, wherein the casing is electrically grounded via a ground connection to a power cable physically connected to the assembly.

21. The non-resistive contact sensor assembly of claim 19, wherein the casing serves as a reference with regard to the electrical signal from the object of interest.

22. The non-resistive contact sensor assembly of claim 1, wherein the casing is a conductive casing that acts as an electrical reference with regard to the electrical signal from the object of interest.

23-52. -52. (canceled)