ELECTRONIC SENSING SYSTEM WITH ENVIRONMENTAL SENSOR PATCH

• US 20140062510A1
• Filed: 08/31/2012
• Published: 03/06/2014
• Est. Priority Date: 04/25/2012
• Status: Active Grant

• Current Assignee: Eastman Kodak Company
• Original Assignee: Eastman Kodak Company
• Inventors: Cok, Ronald Steven, White, Christopher J.
• Granted Patent: US 8,941,396 B2
• Time in Patent Office: Days
• US Class Current: 324/691
• CPC Class Codes: G01D 5/12 using electric or magnetic means G01D5/06 takes precedence
• CPC Class Codes: G01D 5/14 influencing the magnitude of a current or voltage
• CPC Class Codes: G01D 5/16 by varying resistance
• CPC Class Codes: G01R 27/08 Measuring resistance by measuring both voltage and current

Abstract

An electronic sensing system has a transceiver with input and output pads, an excitation circuit connected to the output pad, and a detection circuit connected to the input pad. An electrically-conductive sensor patch has an electrical state that changes with exposure to a corresponding environmental factor. The detection circuit detects an electrical state of the input electrical-connection pad in response to the excitation signal and the electrical state of the sensor patch. A stack of one or more layers in order is disposed over the sensor patch in the detection region. Each layer is susceptible to a respective environmental factor, so that the sensor patch changes electrical state in response to exposure of the layer stack to the respective environmental factors of the one or more layer(s) in the selected order and subsequent exposure of the sensor patch to the corresponding environmental factor.

Claims

1. An electronic sensing system, comprising:

a substrate with a detection region;

a transceiver formed on a transceiver substrate separate from the substrate and affixed to the substrate, the transceiver including;

an output pad for making an electrical connection;

an excitation circuit adapted to provide an excitation signal to the output pad;

an input pad for making an electrical connection;

a detection circuit connected to the input pad; and

an interface responsive to a downlink signal to transmit an uplink signal representing the electrical state of the input pad;

a code circuit separate from the transceiver and disposed over the substrate, the code circuit including a sensor patch disposed over the substrate at least partly in the detection region, the sensor patch having an electrical state that changes with exposure to a corresponding environmental factor and being electrically conductive in an initial electrical state, the output pad and the input pad electrically connected to the code circuit so that the detection circuit detects an electrical state of the input pad in response to the excitation signal and the electrical state of the sensor patch; and

a layer stack disposed over the sensor patch in the detection region, the layer stack including one or more layer(s) in a selected order, each of the one or more layer(s) susceptible to a respective environmental factor, so that the sensor patch changes electrical state in response to exposure of the layer stack to the respective environmental factors of the one or more layer(s) in the selected order and subsequent exposure of the sensor patch to the corresponding environmental factor.

2. The electronic sensing system according to claim 1, wherein each layer in the layer stack is electrically insulating.

3. The electronic sensing system according to claim 1, wherein the layer stack includes a first layer and no other layers, the electronic sensing system further includes a seal lower in susceptibility to the respective environmental factors of the first layer and the sensor patch than the first layer and the sensor patch, respectively, and the seal is arranged so that the sensor patch is permitted to be exposed to the respective environmental factor only through a void in the first layer.

4. The electronic sensing system according to claim 1, wherein the layer stack includes a first-exposed layer and a plurality of buried layers arranged between the first-exposed layer and the substrate, and the electronic sensing system further includes a seal lower in susceptibility to the respective environmental factors of the sensor patch and each of the layers of the layer stack than the sensor patch and each of the layers of the layer stack, respectively, the seal arranged so that each buried layer is permitted to be exposed to the respective environmental factor only through respective void(s) in the one or more layer(s) of the layer stack farther from the substrate than that buried layer.

5. The electronic sensing system according to claim 1, wherein:

the layer stack includes only a first layer;

the sensor patch includes a second layer susceptible to the corresponding environmental factor;

the electronic sensing system further includes a seal lower in susceptibility to the respective environmental factors of the first and second layers than the first and second layers, respectively, and the seal is arranged so that the sensor patch is permitted to be exposed to the respective environmental factor only through a void in the first layer;

the seal and the first layer are arranged to define a cavity between them, the cavity sealed off from the environmental factor of the second layer by the seal and the first layer;

the second layer has a flow surface adjacent to the first layer, the flow surface having a shape, orientation, or composition that defines a flow pattern; and

the first layer is made fluid by exposure to the corresponding environmental factor, so that when the first layer becomes fluid, at least some of the resulting fluid travels substantially according to the flow pattern into the cavity to permit the second layer to be exposed to the corresponding environmental factor.

6. The electronic sensing system according to claim 5, wherein the resulting fluid travels into the cavity under the influence of gravity.

7. The electronic sensing system according to claim 5, wherein the first layer is susceptible to heat and has a selected thermal conductance greater than a thermal conductance of the seal.

8. The electronic sensing system according to claim 1, wherein:

the layer stack includes a first-exposed layer and includes a second-exposed layer arranged between the first-exposed layer and the sensor patch and adjacent to the first-exposed layer;

the electronic sensing system further includes a seal lower in susceptibility to the respective environmental factors of the sensor patch, the first-exposed layer, and the second-exposed layer than the sensor patch, the first-exposed layer, and the second-exposed layer, respectively, the seal arranged so that the second-exposed layer is permitted to be exposed to the respective environmental factor only through a void in one or more of the layers in the layer stack farther from the substrate than the second-exposed layer;

the seal and the layer stack are arranged to define a cavity between them, the cavity sealed off from the environmental factors of the sensor patch and the layer(s) in the layer stack by the seal and the first-exposed layer;

the layer stack is arranged so that the second-exposed layer has a flow surface adjacent to the first-exposed layer and having a shape, orientation, or composition that defines a flow pattern; and

the first-exposed layer is made fluid by exposure to the corresponding environmental factor, so that when the first-exposed layer becomes fluid, at least some of the resulting fluid travels substantially according to the flow pattern into the cavity to permit the second-exposed layer to be exposed to the corresponding environmental factor.

9. The electronic sensing system according to claim 8, wherein the layer stack further includes one or more buried layers arranged between the sensor patch and the second-exposed layer, and the seal is lower in susceptibility than each of the one or more buried layers to the respective environmental factor of that layer.

10. The electronic sensing system according to claim 1, wherein the layer stack includes a plurality of layers.

11. The electronic sensing system according to claim 1, wherein the code circuit electrically connects the output pad to the input pad through the sensor patch.

12. The electronic sensing system according to claim 11, wherein the electrical state of the input pad represents a detected resistance of the sensor patch.

13. The electronic sensing system according to claim 1, wherein the sensor patch includes an electrically-conductive layer susceptible to the corresponding environmental factor.

14. The electronic sensing system according to claim 1, wherein the sensor patch includes an electrically-insulating layer and a conductor arranged on a side of the layer closer to the substrate, the layer and the conductor susceptible to the corresponding environmental factor.

15. The electronic sensing system according to claim 1, wherein the sensor patch includes an electrically-insulating layer and a conductor arranged on a side of the layer closer to the substrate, the layer susceptible to the corresponding environmental factor and the conductor susceptible to a respective environmental factor different from the corresponding environmental factor of the layer.

16. The electronic sensing system according to claim 1, wherein the environmental factors are liquids or gasses.

17. An electronic sensing system, comprising:

a substrate with a detection region;

a transceiver formed on a transceiver substrate separate from the substrate and affixed to the substrate, the transceiver including an output pad for making an electrical connection, an excitation circuit adapted to provide an excitation signal to the output pad, an input pad for making an electrical connection, a detection circuit connected to the input pad, and an interface responsive to a downlink signal to transmit an uplink signal representing the electrical state of the input pad; and

a patch stack disposed over the substrate at least partly in the detection region, the patch stack including a plurality of sensor patches in a selected order, each having a conductance susceptible to a respective environmental factor, and being electrically conductive before exposure to the respective environmental factor;

wherein

the output pad is electrically connected to the input pad through the each of the plurality of sensor patches in parallel, so that the detection circuit detects an electrical state of the input pad in response to the excitation signal and the respective conductances of each of the plurality of the sensor patches.

18. The electronic sensing system according to claim 17, wherein the patch stack includes a first-exposed sensor patch and a plurality of buried sensor patches arranged between the first-exposed sensor patch and the substrate, and the electronic sensing system further includes a seal lower in susceptibility to each of the respective environmental factors than each respective sensor patch in the patch stack, the seal arranged so that each buried sensor patch is permitted to be exposed to the respective environmental factor only through a void in one or more sensor patches farther from the substrate than that buried sensor patch.

19. The electronic sensing system according to claim 17, wherein the output pad is electrically connected to the input pad through the plurality of sensor patches.

20. The electronic sensing system according to claim 17, wherein one of the plurality of sensor patches includes an electrically-conductive layer susceptible to the corresponding environmental factor.

21. The electronic sensing system according to claim 20, wherein a first one of the plurality of sensor patches in the patch stack includes an electrically-insulating layer arranged between the electrically-conductive layer of the first sensor patch and the electrically-conductive layer of an adjacent second sensor patch in the patch stack to electrically insulate those electrically-conductive layers from each other, wherein the electrically-insulating layer is susceptible to the corresponding environmental factor of the first sensor patch.

22. The electronic sensing system according to claim 17, wherein one of the sensor patches includes an electrically-insulating layer and a conductor arranged on a side of that electrically-insulating layer closer to the substrate, the layer and the conductor susceptible to the corresponding environmental factor.

23. The electronic sensing system according to claim 17, wherein one of the plurality of sensor patches includes an electrically-insulating layer and a conductor arranged on a side of that electrically-insulating layer closer to the substrate, the layer susceptible to the corresponding environmental factor and the conductor susceptible to a respective environmental factor different from the corresponding environmental factor of the layer.

24. The electronic sensing system according to claim 17, wherein the electrical state of the input pad represents a detected resistance of the sensor patches wired in parallel, and wherein the transceiver further includes a controller and a memory storing a plurality of thresholds, the controller adapted to compare the detected resistance to one or more of the plurality of thresholds and automatically transmit the uplink signal whenever the detected resistance crosses one of the plurality of thresholds.

25. The electronic sensing system according to claim 17, wherein the environmental factors are liquids or gasses.

26. The electronic sensing system according to claim 17, wherein:

the patch stack includes a first-exposed sensor patch and a second-exposed sensor patch between the first-exposed sensor patch and the substrate and adjacent to the first-exposed sensor patch;

the electronic sensing system further includes a seal lower in susceptibility to each of the respective environmental factors than each respective sensor patche in the patch stack, the seal arranged so that the second-exposed sensor patch is permitted to be exposed to the respective environmental factor only through a void in the first-exposed sensor patch;

the seal and the patch stack are arranged to define a cavity between them, the cavity sealed off from the environmental factors of the patches in the patch stack by the seal and the first-exposed sensor patch;

the patch stack is arranged so that the second-exposed sensor patch has a flow surface adjacent to the first-exposed sensor patch and having a shape, orientation, or composition that defines a flow pattern; and

the first-exposed sensor patch is made fluid by exposure to the corresponding environmental factor, so that when the first-exposed sensor patch becomes fluid, at least some of the resulting fluid travels substantially according to the flow pattern into the cavity to permit the second-exposed sensor patch to be exposed to the corresponding environmental factor.

27. The electronic sensing system according to claim 26, wherein the patch stack further includes one or more buried sensor patch(es) arranged between the substrate and the second-exposed sensor patch, and the seal is lower in susceptibility than each buried sensor patch to the respective environmental factor of that buried sensor patch.

28. The electronic sensing system according to claim 26, wherein the first-exposed sensor patch is susceptible to heat and has a selected thermal conductance greater than a thermal conductance of the seal.

29. The electronic sensing system according to claim 28, wherein the first-exposed sensor patch consists of an electrically-conductive material and zero or more inclusions that together do not reduce the conductivity of the electrically-conductive material by more than fifteen percent.