ORGANIC LIGHT EMITTING DISPLAY AND METHOD FOR MANUFACTURING THE SAME

• US 20140062909A1
• Filed: 12/12/2012
• Published: 03/06/2014
• Est. Priority Date: 08/29/2012
• Status: Active Grant

• Current Assignee: LG Display Co., Ltd.
• Original Assignee: LG Display Co., Ltd.
• Inventors: Choi, Ho-Won, Kim, Seung-Hyun
• Granted Patent: US 9,202,408 B2
• Time in Patent Office: Days
• US Class Current: 345/173
• CPC Class Codes: G06F 2203/04103 Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
• CPC Class Codes: G06F 2203/04111 Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
• CPC Class Codes: G06F 3/041 Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
• CPC Class Codes: G06F 3/0412 Digitisers structurally integrated in a display
• CPC Class Codes: G06F 3/0446 using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
• CPC Class Codes: G09G 3/32 semiconductive, e.g. using light-emitting diodes [LED]
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H10K 59/40 OLEDs integrated with touch screens
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass

Abstract

A organic light emitting display includes a plurality of touch pads spaced from one another in the touch pad portion, each of the touch pads including a metal pad layer and a transparent electrode pad layer connected to the metal pad layer via a plurality of first contact holes in a first insulating film, a dummy pad portion formed in the dead region of the first buffer layer, the dummy pad portion comprising a plurality of dummy pads corresponding to the touch pads, and a sealant comprising a plurality of conductive balls between the touch pad portion and the dummy pad portion.

Claims

1. An organic light emitting display comprising a transistor-organic light emitting diode array and a touch electrode array on a first buffer layer and a second buffer layer, respectively, that have an active region and a dead region and face each other, the organic light emitting display comprising:

a touch pad portion disposed in a part of the dead region of the second buffer layer;

a plurality of touch pads spaced from one another in the touch pad portion, each of the touch pads including a metal pad layer and a transparent electrode pad layer connected to the metal pad layer via a plurality of first contact holes in a first insulating film;

a dummy pad portion disposed in the dead region of the first buffer layer, the dummy pad portion comprising a each dummy pad corresponds to each touch pads; and

a sealant comprising a plurality of conductive balls between the touch pad portion and the dummy pad portion.

2. The organic light emitting display according to claim 1, wherein the plurality of first contact holes disposed in one touch pad are spaced from one another and are arrayed in m and n lines, and the plurality of first contact holes arrayed in odd and even lines are alternately disposed.

3. The organic light emitting display according to claim 1, wherein at least one of the plurality of conductive balls side-contact inside at least one of the plurality of first contact holes.

4. The organic light emitting display according to claim 3, wherein a width of each first contact hole is smaller than a diameter of each conductive ball, and the plurality of first contact holes correspond to one conductive ball.

5. The organic light emitting display according to claim 1, wherein the metal pad layer of the touch pad is directly on the second buffer layer, the first insulating film including the first contact holes is disposed on the metal pad layer, and the transparent electrode pad layer is connected to the metal pad layer through the first contact hole and is disposed on the first insulating film.

6. The organic light emitting display according to claim 5, wherein the transparent electrode pad layer comprises a first transparent electrode pad layer and a second transparent electrode pad layer.

7. The organic light emitting display according to claim 6, wherein the touch pad further comprises a metal pattern between the first contact holes.

8. The organic light emitting display according to claim 7, wherein the metal pattern is disposed between the first transparent electrode pad layer and the second transparent electrode pad layer.

9. The organic light emitting display according to claim 1, wherein the first insulating film comprises at least one organic film.

10. The organic light emitting display according to claim 1, wherein each dummy pad comprises a gate metal pad layer and a source pad layer connected to the gate metal pad layer via a plurality of second contact holes in a third insulating film including, on the first buffer layer.

11. The organic light emitting display according to claim 1, wherein the first insulating film includes a plurality of first contact hole sidewalls having a taper, the taper forming an angle of about 55 degree or less to a surface of the second buffer layer.

12. The organic light emitting display according to claim 1, wherein the transistor-organic light emitting diode array comprises:

a thin film transistor array including a thin film transistor in each of pixels defined in a matrix form in the active region of the first buffer layer;

an organic light emitting diode connected to the thin film transistor of each pixel; and

a protective layer formed on the first buffer layer such that the protective layer covers the organic light emitting diode.

13. The organic light emitting display according to claim 5, wherein the touch electrode array comprises:

a metal bridge disposed in the same layer as the metal pad layer on the second buffer layer;

a plurality of first transparent channel electrodes disposed in the same layer as the transparent electrode pad layer, the first transparent channel electrodes being electrically connected to the metal bridge while overlapping the metal bridge, and being spaced from one another in a first direction; and

a plurality of second transparent channel electrodes disposed in the same layer as the first transparent channel electrode, the second transparent channel electrodes traversing the metal bridge and being disposed in a second direction.

14. The organic light emitting display according to claim 6, wherein the touch electrode array comprises:

a metal bridge disposed in the same layer as the metal pad layer on the second buffer layer;

a plurality of first transparent channel electrodes disposed in the same layer as the transparent electrode pad layer, the first transparent channel electrodes being electrically connected to the metal bridge while overlapping the metal bridge, and being spaced from one another in a first direction; and

a plurality of second transparent channel electrodes disposed in the same layer as the first transparent channel electrode, the second transparent channel electrodes traversing the metal bridge and being disposed in a second direction; and

a common transparent electrode pattern covering the first and second transparent channel electrodes.

15. The organic light emitting display according to claim 14, further comprising:

a third insulating film disposed between the first and second transparent channel electrodes, and the common transparent electrode pattern.

16. The organic light emitting display according to claim 1, further comprising:

first and second etching stopper films on the rear surfaces of the first buffer layer and the second buffer layer, respectively.

17. The organic light emitting display according to claim 16, further comprising:

a film substrate attached to the rear surface of the first etching stopper film.

18. The organic light emitting display according to claim 17, further comprising:

a cover glass disposed on the upper surface of the second etching stopper film.

19. The organic light emitting display according to claim 1, wherein the first buffer layer and the second buffer layer comprise a laminate including a plurality of inorganic films.

20. The organic light emitting display according to claim 17, wherein the film substrate is a plastic insulating film.

21. The organic light emitting display according to claim 16, wherein the first etching stopper film and the second etching stopper film comprise one of a polyimide or photoacryl.

22. A method for manufacturing an organic light emitting display comprising:

forming a first etching stopper film and a first buffer layer on a first substrate, and forming a transistor-organic light emitting diode array having a transistor in each of pixels defined in a matrix form and an organic light emitting diode connected to the thin film transistor in an active region of the first buffer layer;

forming a second etching stopper film and a second buffer layer on a second substrate and forming a touch electrode array in the active region of the second buffer layer;

forming a touch pad portion in a part of the dead region of the second buffer layer, wherein the touch pad portion comprises a plurality of touch pads and each of the touch pads comprises a metal pad layer and a transparent electrode pad layer connected to each other via a plurality of first contact holes in a first insulating film;

forming a dummy pad portion in the dead region of the first buffer layer, wherein the dummy pad portion comprises a plurality of dummy pads, each dummy pad corresponding to each touch pad; and

applying a sealant including a conductive ball to the touch pad portion or the dummy pad portion, attaching an adhesive layer to the touch electrode array or the transistor-organic light emitting diode array and joining the first substrate to the second substrate.

23. The method according to claim 22, wherein at least one of the plurality of conductive balls side-contact inside at least one of the plurality of first contact holes.

24. The method according to claim 23, wherein a diameter of the first contact hole is smaller than a diameter of the conductive ball and the plurality of first contact holes correspond to one conductive ball.

25. The method according to claim 24, wherein the forming each touch pad of the touch pad portion comprises:

forming a metal pad layer on the second buffer layer;

forming a first insulating film comprising a plurality of first contact holes on the metal pad layer;

forming a transparent electrode pad layer on the first insulating film such that the transparent electrode pad layer is connected to the metal pad layer through the first contact hole.

26. The method according to claim 25, wherein the transparent electrode pad layer comprises a first transparent electrode pad layer and a second transparent electrode pad layer which are disposed in different layers.

27. The method according to claim 26, wherein the forming each touch pad comprises:

horizontally disposing a plurality of metal patterns between the first contact hole and vertically disposing the plurality of metal patterns between the first transparent electrode pad layer and the second transparent electrode pad layer.

28. The method according to claim 22, wherein the forming the dummy pad of the dummy pad portion comprises:

forming a gate metal pad layer on the first buffer layer;

forming a third insulating film including a plurality of second contact holes on the gate metal pad layer; and

forming a source pad layer on the third insulating film such that the source pad layer is connected through the second contact holes to the gate metal pad layer.

29. The method according to claim 22, wherein, after joining, the conductive ball is compressed to a predetermined to a thickness between the touch pad portion and the dummy pad portion.

30. The method according to claim 29, wherein, after joining, the dead region of the touch pad portion neighboring portion is spaced from the sealant by a predetermined distance.

31. The method according to claim 22, further comprising:

removing the first substrate and the second substrate; and

adhering a film substrate to an exposed surface of the first etching stopper film.

32. The method according to claim 31, wherein the removing the first substrate and the second substrate is carried out by etching or laser-irradiating the first substrate and the second substrate.