CONDUCTIVE BUS STRUCTURE FOR INTERFEROMETRIC MODULATOR ARRAY

• US 20140063588A1
• Filed: 03/04/2013
• Published: 03/06/2014
• Est. Priority Date: 09/27/2004
• Status: Active Grant

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: Qualcomm MEMS Technologies Incorporated (Qualcomm, Inc.)
• Inventors: Chui, Clarence, Sampsell, Jeffrey B.
• Granted Patent: US 9,086,564 B2
• Time in Patent Office: Days
• US Class Current: 359/295
• CPC Class Codes: B81B 3/0086 Electrical characteristics, e.g. reducing driving voltage, improving resistance to peak voltage
• CPC Class Codes: G02B 26/001 based on interference in an adjustable optical cavity interference filters G02B5/28; devices or arrangements using multiple reflections in spectrometry or monochromators G01J3/26
• CPC Class Codes: G09G 3/3466 based on interferometric effect
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing

Abstract

Embodiments of an interferometric modulator are disclosed having various enhancements and features including a conductive bus. In certain embodiments, the interferometric modulator has a first conductive layer suspended over a second electrode layer. In certain embodiments, a second conductive layer is provided over the first conductive layer. One of the first and/or second conductive buses may further connect to the first electrode layer and/or the second electrode layer. Other disclosed features can be incorporated into embodiments of the interferometric modulator to improve response time, power consumption, and image resolution.

Claims

1. An electromechanical device, comprising:

an array of structures, each structure including a first electrode layer and a movable layer having a second electrode layer and a reflective surface, the movable layer deformable in a direction towards the first electrode layer in response to a voltage applied across the first electrode layer and the second electrode layer;

the first electrode layers of the array electrically connected in series in a first direction;

the second electrode layers of the array electrically connected in series in a second direction; and

a conductive bus structure electrically connected to either the first electrode layers in parallel with the electrical connections between the first electrode layers in the first direction, or the second electrode layers in parallel with the electrical connections between the second electrode layers in the second direction.