CHASSIS WITH SEPARATE THERMAL CHAMBER FOR SOLID STATE MEMORY

• US 20140063721A1
• Filed: 08/28/2012
• Published: 03/06/2014
• Est. Priority Date: 08/28/2012
• Status: Active Grant

• Current Assignee: JP Morgan Chase Bank, N.A. (JP Morgan Chase & Co)
• Original Assignee: Skyera, Inc. (Western Digital Corporation)
• Inventors: Danilak, Radoslav, Herman, Pinchas
• Granted Patent: US 8,929,066 B2
• Time in Patent Office: Days
• US Class Current: 361/679.31
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: H05K 7/1487 Blade assemblies, e.g. blade cases or inner arrangements within a blade
• CPC Class Codes: H05K 7/20727 within server blades for removing heat from heat source

Abstract

A chassis for a network storage system contains a first thermal chamber that houses conventional electronic components and a second thermal chamber that houses non-volatile solid state memory such as flash memory. A cooling system keeps the electronics in first thermal chamber below their maximum junction temperature. Meanwhile, a temperature regulating system maintains the solid state memory in the second thermal chamber within a range of a preferred operating temperature selected to extend the lifetime and/or improve the reliability of the solid state memory. Thus, the chassis provides dual zone temperature control to improve performance of the network storage system.

Claims

1. A network storage system for providing data access to a plurality of connected computing devices, the network storage system housed within a chassis, the network storage system comprising:

a first thermal chamber within the chassis, comprising;

a plurality of electronic components housed within the first thermal chamber, the plurality of electronic components configured to send and receive data from the connected computing devices; and

one or more heat sinks thermally coupled to the electronic components, the heat sinks for dissipating heat generated by the plurality of electronic components;

a first set of fans for generating a first airflow within the first thermal chamber, the first airflow passing through the heat sinks to transport the heat generated by the plurality of electronic components away from the plurality of electronic components and to maintain the electronic components below a first temperature;

a second thermal chamber within the chassis, the second thermal chamber substantially thermally isolated from the first chamber, and comprising;

a plurality of solid state storage devices communicatively coupled to the plurality of electronic components, the plurality of solid state storage devices configured to store data accessible to the connected computing devices; and

one or more heat spreaders, each heat spreader thermally coupled to at least one of the plurality of solid state storage devices; and

a second set of fans for generating a second airflow through the second thermal chamber, the second airflow passing over the heat spreaders to transport heat to and from the heat spreaders such that the solid state storage devices are maintained within a fixed range of a second temperature, wherein the second temperature is higher than the first temperature.

2. The network storage system of claim 1, further comprising an airflow deflector for guiding the second airflow over a portion of the first airflow while maintaining physical isolation between the first airflow and the second airflow.

3. The network storage system of claim 1, wherein the second temperature is between 67°

C. and 73°

C.

4. The network storage system of claim 1, further comprising one or more heating elements in the second thermal chamber, the one or more heating elements placed within the second airflow for actively generating heat in order to raise a temperature of the solid state storage devices to within the fixed range of the second temperature.

5. The network storage system of claim 1, wherein the chassis comprises a rack-mount form factor, the chassis having a front panel and a rear panel, and wherein the first thermal chamber is bounded by a portion of the front panel and a wider portion of the rear panel, the wider portion of the rear panel exposing a plurality of connectors housed in the first thermal chamber.

6. The network storage system of claim 1, further comprising:

a third thermal chamber comprising a power supply device; and

a third set of fans for generating a third airflow through the third thermal chamber, the third airflow for maintaining the power supply device below a third temperature.

7. The network storage system of claim 1, further comprising a sheet of insulating material covering a side of the second thermal chamber.

8. A chassis for a storage system, the chassis comprising:

a first thermal chamber within the chassis for housing one or more electronic components;

a first cooling system within the chassis, the first cooling configured to maintain the electronic components housed in the first thermal chamber below a first temperature;

a second thermal chamber within the chassis, the second thermal chamber for housing a plurality of solid state storage devices, the second thermal chamber substantially thermally isolated from the first thermal chamber; and

a temperature regulating system within the chassis, the temperature regulating system configured to maintain the solid state storage devices housed in second thermal chamber within a fixed range of a second temperature.

9. The chassis of claim 8, wherein the temperature regulating system comprises one or more fans for generating an airflow through the second thermal chamber, the airflow causing air to move past the plurality of solid state storage devices and spread thermal energy through the second thermal chamber.

10. The chassis of claim 9, further comprising an airflow deflector for isolating the airflow through the second thermal chamber from airflow through a portion of the first thermal chamber.

11. The chassis of claim 8, wherein the second temperature is between 67°

C. and 73°

C.

12. The chassis of claim 8, wherein the temperature regulating system comprises one or more heating elements for actively raising the temperature of the solid state storage devices when the temperature drops below the fixed range.

13. The chassis of claim 8, wherein the temperature regulating system comprises one or more cooling elements for actively cooling the temperature of the solid state storage devices to within the fixed range when the temperature rises above the fixed range, wherein the fixed range is below an ambient temperature.

14. The chassis of claim 8, wherein the chassis is of a rack-mount form factor having a front panel and a rear panel, and wherein the first thermal chamber is bounded by a portion of the front panel and a wider portion of the rear panel, the wider portion of the rear panel exposing a plurality of connectors housed in the first thermal chamber.

15. The chassis of claim 8, further comprising:

a third thermal chamber for housing a power supply device; and

a second cooling system configured to maintain the power supply device housed in the third thermal chamber below a third temperature.

16. The chassis of claim 8, wherein at least one side of the second thermal chamber is covered with an insulating material.

17. The chassis of claim 8, wherein the solid state storage devices are arranged into one or more clusters, and wherein the solid state storage devices in each cluster are thermally coupled to each other by a heat spreader configured to spread heat between the solid state storage devices.

18. A thermal chamber within a chassis of a storage system, comprising:

a plurality of solid state storage devices;

a temperature regulating system configured to maintain the solid state storage devices within a fixed range of a temperature, the temperature regulating system comprising;

a cooling device for lowering the temperature of the solid state storage devices; and

a heating device for raising the temperature of the solid state storage devices; and

a sheet of thermal insulating material covering a side of the thermal chamber to thermally isolate the thermal chamber from the rest of the storage system.

19. The thermal chamber of claim 18, further comprising one or more heat spreaders, each heat spreader thermally coupled to at least one solid state storage device.

20. The thermal chamber of claim 18, wherein the cooling device is a set of fans configured to generate an airflow within the first thermal chamber.

21. The thermal chamber of claim 18, wherein the temperature is between 67°

C. and 73°

C.