CHASSIS WITH SEPARATE THERMAL CHAMBER FOR SOLID STATE MEMORY
First Claim
1. A network storage system for providing data access to a plurality of connected computing devices, the network storage system housed within a chassis, the network storage system comprising:
- a first thermal chamber within the chassis, comprising;
a plurality of electronic components housed within the first thermal chamber, the plurality of electronic components configured to send and receive data from the connected computing devices; and
one or more heat sinks thermally coupled to the electronic components, the heat sinks for dissipating heat generated by the plurality of electronic components;
a first set of fans for generating a first airflow within the first thermal chamber, the first airflow passing through the heat sinks to transport the heat generated by the plurality of electronic components away from the plurality of electronic components and to maintain the electronic components below a first temperature;
a second thermal chamber within the chassis, the second thermal chamber substantially thermally isolated from the first chamber, and comprising;
a plurality of solid state storage devices communicatively coupled to the plurality of electronic components, the plurality of solid state storage devices configured to store data accessible to the connected computing devices; and
one or more heat spreaders, each heat spreader thermally coupled to at least one of the plurality of solid state storage devices; and
a second set of fans for generating a second airflow through the second thermal chamber, the second airflow passing over the heat spreaders to transport heat to and from the heat spreaders such that the solid state storage devices are maintained within a fixed range of a second temperature, wherein the second temperature is higher than the first temperature.
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Accused Products
Abstract
A chassis for a network storage system contains a first thermal chamber that houses conventional electronic components and a second thermal chamber that houses non-volatile solid state memory such as flash memory. A cooling system keeps the electronics in first thermal chamber below their maximum junction temperature. Meanwhile, a temperature regulating system maintains the solid state memory in the second thermal chamber within a range of a preferred operating temperature selected to extend the lifetime and/or improve the reliability of the solid state memory. Thus, the chassis provides dual zone temperature control to improve performance of the network storage system.
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Citations
21 Claims
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1. A network storage system for providing data access to a plurality of connected computing devices, the network storage system housed within a chassis, the network storage system comprising:
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a first thermal chamber within the chassis, comprising; a plurality of electronic components housed within the first thermal chamber, the plurality of electronic components configured to send and receive data from the connected computing devices; and one or more heat sinks thermally coupled to the electronic components, the heat sinks for dissipating heat generated by the plurality of electronic components; a first set of fans for generating a first airflow within the first thermal chamber, the first airflow passing through the heat sinks to transport the heat generated by the plurality of electronic components away from the plurality of electronic components and to maintain the electronic components below a first temperature; a second thermal chamber within the chassis, the second thermal chamber substantially thermally isolated from the first chamber, and comprising; a plurality of solid state storage devices communicatively coupled to the plurality of electronic components, the plurality of solid state storage devices configured to store data accessible to the connected computing devices; and one or more heat spreaders, each heat spreader thermally coupled to at least one of the plurality of solid state storage devices; and a second set of fans for generating a second airflow through the second thermal chamber, the second airflow passing over the heat spreaders to transport heat to and from the heat spreaders such that the solid state storage devices are maintained within a fixed range of a second temperature, wherein the second temperature is higher than the first temperature. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A chassis for a storage system, the chassis comprising:
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a first thermal chamber within the chassis for housing one or more electronic components; a first cooling system within the chassis, the first cooling configured to maintain the electronic components housed in the first thermal chamber below a first temperature; a second thermal chamber within the chassis, the second thermal chamber for housing a plurality of solid state storage devices, the second thermal chamber substantially thermally isolated from the first thermal chamber; and a temperature regulating system within the chassis, the temperature regulating system configured to maintain the solid state storage devices housed in second thermal chamber within a fixed range of a second temperature. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A thermal chamber within a chassis of a storage system, comprising:
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a plurality of solid state storage devices; a temperature regulating system configured to maintain the solid state storage devices within a fixed range of a temperature, the temperature regulating system comprising; a cooling device for lowering the temperature of the solid state storage devices; and a heating device for raising the temperature of the solid state storage devices; and a sheet of thermal insulating material covering a side of the thermal chamber to thermally isolate the thermal chamber from the rest of the storage system. - View Dependent Claims (19, 20, 21)
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Specification