ELECTRONIC MODULE, ELECTRONIC DEVICE, AND MOBILE UNIT

• US 20140063753A1
• Filed: 08/29/2013
• Published: 03/06/2014
• Est. Priority Date: 08/30/2012
• Status: Abandoned Application

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: CHINO, Taketo
• Application Number:
  US14/013,772
• Publication Number:
  US 20140063753A1
• Time in Patent Office: Days
• US Class Current: 361/729
• CPC Class Codes: H05K 9/00 Screening of apparatus or components against electric or magnetic fields devices for absorbing radiation from an antenna H01Q17/00
• CPC Class Codes: H05K 9/002 with localised screening

Abstract

An electronic module includes: a first substrate having first surface on which a first sensor element is provided and a second surface on which a circuit element is provided; a second substrate having a third surface on which a second sensor element is provided; a third substrate having a fifth surface on which a third sensor element is provided; a first connecting portion connecting the first substrate and the second substrate to each other; and a second connecting portion connecting the first substrate and the third substrate to each other. A shield layer is provided between the first sensor element and the circuit element.

Claims

1. An electronic module comprising:

a first substrate having a first surface on which a first sensor element is provided and a second surface on which a circuit element is provided;

wherein a shield layer is provided between the first sensor element and the circuit element.

2. The electronic module according to claim 1, comprising:

a second substrate provided with a second sensor element; and

a connecting portion which connects the first substrate and the second substrate with each other.

3. The electronic module according to claim 1, comprising a supporting portion having plural fixing surfaces,

wherein the first substrate is fixed to the fixing surface.

4. The electronic module according to claim 3, wherein the supporting portion has an opening which accommodates one of the first sensor element and the circuit element.

5. The electronic module according to claim 3, wherein the first sensor element is arranged on the side of the supporting portion, and the circuit element is arranged on the side opposite to the supporting portion.

6. The electronic module according to claim 5, comprising a pedestal for fixing the supporting portion thereon,

wherein the circuit element is fixed to the pedestal.

7. The electronic module according to claim 1, wherein the circuit element has a first circuit portion provided on the second surface and a second circuit portion provided on the first circuit portion, and

a separation layer is provided between the first circuit portion and the second circuit portion.

8. The electronic module according to claim 7, wherein the first circuit portion includes an analog circuit which amplifies an output signal from at least one of the first sensor element and the second sensor element, and

the second circuit portion includes a digital circuit which converts the output signal amplified by the analog circuit to a digital signal.

10. An electronic device equipped with the electronic module according to claim 1.

12. A mobile unit equipped with the electronic module according to claim 1.

9. An electronic module comprising:

a first circuit portion; and

a second circuit portion stacked on the first circuit portion and electrically connected to the first circuit portion;

wherein a separation layer is provided between the first circuit portion and the second circuit portion.

11. An electronic device equipped with the electronic module according to claim 9.

13. A mobile unit equipped with the electronic module according to claim 9.