WIRING BOARD

• US 20140063763A1
• Filed: 08/22/2013
• Published: 03/06/2014
• Est. Priority Date: 08/30/2012
• Status: Active Grant

• Current Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Original Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Inventors: Sato, Junji
• Granted Patent: US 8,867,225 B2
• Time in Patent Office: Days
• US Class Current: 361/761
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H05K 1/184 Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
• CPC Class Codes: H05K 1/185 Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit semiconductor chips encapsulated by interconnect and support structures H01L23/5389, H01L24/00
• CPC Class Codes: H05K 2201/10636 Leadless chip, e.g. chip capacitor or resistor
• CPC Class Codes: H05K 2203/1461 Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
• CPC Class Codes: H05K 3/4644 by building the multilayer layer by layer, i.e. build-up multilayer circuits making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A wiring board includes: a core layer having a through hole therethrough and comprising a first surface and a second surface opposite to the first surface; a first wiring layer formed on the first surface of the core layer and having a first opening which is communicated with the through hole, wherein an opening area of the first opening is larger than that of the through hole in a plan view; an electronic component disposed in the through hole and the first opening and having a first surface, and a second surface opposite to the first surface, the electronic component further having a pair of terminal on the first surface thereof; and a first resin layer filled in the through hole, the first opening and a gap between the pair of terminals so as to cover the second surface and the side surface of the electronic component.

Claims

1. A wiring board comprising:

a core layer having a through hole therethrough and comprising a first surface and a second surface opposite to the first surface;

a first wiring layer formed on the first surface of the core layer and having a first opening which is communicated with the through hole, wherein an opening area of the first opening is larger than that of the through hole in a plan view,

an electronic component disposed in the through hole and the first opening and comprising;

a first surface;

a second surface opposite to the first surface; and

a side surface between the first surface and the second surface, the electronic component further comprising a pair of terminals on the first surface thereof, wherein the first surface of the electronic component is located on a side of the first surface of the core layer and the second surface of the electronic component is located on a side of the second surface of the core layer; and

a first resin layer filled in the through hole, the first opening and a gap between the pair of terminals so as to cover the second surface and the side surface of the electronic component.

2. The wiring board of claim 1, further comprising:

a second resin layer which is formed on the first surface of the core layer, a surface of the first wiring layer, and surfaces of the pair of terminals of the electronic component.

3. The wiring board of claim 2, wherein the second resin layer is made of a resin different from the first resin layer.

4. The wiring board of claim 1, wherein

the first wiring layer further has a groove which is communicated with the first opening and extends outwardly from the first opening in the plan view.

5. The wiring board of claim 1, wherein

a surface of the first wiring layer, surfaces of the pair of terminals and a surface of the first resin layer are substantially flush with each other.

6. A semiconductor device comprising:

the wiring board of claim 1; and

a semiconductor element disposed on the wiring board.

7. The semiconductor device of claim 6,

wherein the wiring board further comprises:

a second resin layer which is formed on the first surface of the core layer, a surface of the first wiring layer, and surfaces of the pair of terminals of the electronic component.

8. The semiconductor device of claim 7, wherein the second resin layer is made of a resin different from the first resin layer.