MICROPHONE ASSEMBLY

• US 20140064546A1
• Filed: 07/30/2013
• Published: 03/06/2014
• Est. Priority Date: 08/01/2012
• Status: Abandoned Application

• Current Assignee: Knowles Electronics Llc (Knowles Corporation)
• Original Assignee: Knowles Electronics Llc (Knowles Corporation)
• Inventors: Szczech, John B., Van Kessel, Peter, Loeppert, Peter V., Servis, Gregory B.
• Application Number:
  US13/954,223
• Publication Number:
  US 20140064546A1
• Time in Patent Office: Days
• US Class Current: 381/361
• CPC Class Codes: H01L 2224/48095 Kinked
• CPC Class Codes: H01L 2224/48464 the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H04R 1/021 incorporating only one transducer
• CPC Class Codes: H04R 1/04 Structural association of microphone with electric circuitry therefor in deaf-aid sets H04R25/00
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 19/04 Microphones H04R19/01 takes precedence
• CPC Class Codes: H04R 2201/003 Mems transducers or their use of the electrostatic type H04R19/005

Abstract

A microphone assembly includes a cover, a substrate, at least one wall disposed and between and attached to the cover and the substrate, an acoustic transducer acoustically sealed to the lid, and an interposer. The interposer and the acoustic transducer are electrically connected without using the lid as an electrical conduit. The transducer and interposer are disposed one above the other and the transducer is supported by the interposer or by a pedestal.

Claims

1. An microphone assembly comprising:

a cover having an acoustic port;

a substrate attached to the cover;

an acoustic transducer acoustically sealed to the acoustic port of the cover;

an interposer;

such that the interposer and the acoustic transducer are electrically connected together without using the cover as an electrical conduit; and

such that the transducer and interposer are disposed one above the other and the transducer is supported by the interposer or by a pedestal.

2. The microphone assembly of claim 1 wherein the cover comprises a wall and lid.

3. The microphone assembly of claim 1 wherein the acoustic transducer comprises a Microelectromechanical system (MEMS) device.

4. The microphone assembly of claim 1 wherein the imposer is an element selected from the group consisting of an application specific integrated circuit (ASIC), an integrated circuit, and a ceramic plate.

5. The microphone assembly of claim 1 wherein the transducer is disposed upon bumps and the bumps are disposed on the interposer.

6. The microphone assembly of claim 5 wherein the bumps provide an electrical connection between the transducer and the interposer.

7. The microphone assembly of claim 1 wherein a wire bond couples the interposer to conductive traces on the substrate.

8. The microphone assembly of claim 1 further comprising an opening in the cover comprising an etched nozzle.

9. The microphone assembly of claim 1 further comprising an opening in the cover and a nozzle or tube disposed in the opening.

10. The microphone assembly of claim 1 further comprising an opening in the cover and a grommet or gasket disposed in the opening.

11. An microphone assembly comprising:

a lid having an acoustic port;

a substrate;

at least one wall disposed and between and attached to the lid and the substrate;

an acoustic transducer acoustically sealed to the acoustic port of the lid;

an integrated circuit embedded in the substrate;

such that the integrated circuit and the acoustic transducer are electrically connected without using the cover as an electrical conduit; and

such that the transducer and integrated circuit are disposed one above the other.

12. The microphone assembly of claim 11 wherein the acoustic transducer comprises a Microelectromechanical system (MEMS) device.