LASER ABLATION ADHESION PROMOTION

• US 20140071595A1
• Filed: 09/07/2012
• Published: 03/13/2014
• Est. Priority Date: 09/07/2012
• Status: Abandoned Application

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: DE JONG, Erik G., PILLIOD, Michael K., LOW, Chuan Keat, KROGDAHL, James R., BHATIA, Rimple
• Application Number:
  US13/607,513
• Publication Number:
  US 20140071595A1
• Time in Patent Office: Days
• US Class Current: 361/679.01
• CPC Class Codes: B29C 2791/009 Using laser curing using laser B29C2035/0838, welding using laser beams B29C65/16
• CPC Class Codes: B29C 65/4825 Pressure sensitive adhesives
• CPC Class Codes: B29C 65/4835 Heat curing adhesives
• CPC Class Codes: B29C 65/4845 Radiation curing adhesives, e.g. UV light curing adhesives
• CPC Class Codes: B29C 66/024 Thermal pre-treatments
• CPC Class Codes: B29C 66/1122 Single lap to lap joints, i.e. overlap joints B29C66/45, B29C66/472, B29C66/52272 take precedence
• CPC Class Codes: B29C 66/1222 comprising at least a lapped joint-segment
• CPC Class Codes: B29C 66/1224 comprising at least a butt joint-segment
• CPC Class Codes: B29C 66/30322 in the form of rugosity
• CPC Class Codes: B29C 66/3034 making use of additional elements, e.g. meshes
• CPC Class Codes: B29C 66/45 Joining of substantially the whole surface of the articles methods or apparatus for laminating B32B37/00
• CPC Class Codes: B29C 66/53461 joining substantially flat covers and/or substantially flat bottoms to open ends of container bodies
• CPC Class Codes: B29C 66/721 Fibre-reinforced materials B29C66/729 takes precedence
• CPC Class Codes: B29C 66/72143 Fibres of discontinuous lengths
• CPC Class Codes: B29C 66/73161 Roughness or rugosity
• CPC Class Codes: B29L 2031/3481 Housings or casings incorporating or embedding electric or electronic elements
• CPC Class Codes: B32B 2307/538 Roughness
• CPC Class Codes: B32B 2457/00 Electrical equipment
• CPC Class Codes: B32B 27/08 of synthetic resin
• CPC Class Codes: B32B 27/20 using fillers, pigments, thixotroping agents
• CPC Class Codes: B32B 7/12 : using interposed adhesives or interposed materials with bonding properties
• CPC Class Codes: C09J 5/02 : involving pretreatment of the surfaces to be joined
• CPC Class Codes: Y10T 428/24851 : Intermediate layer is discontinuous or differential

Abstract

A method for bonding two substrates can use a laser to ablate a bonding surface of at least one of the two substrates. In one embodiment, the laser can be used to produce a predetermined average surface roughness in a bonding surface region of one of the substrates. In another embodiment, the substrate can comprise a resin filled polymer. Ablating the surface of the bonding surface can increase the bond strength in the ablation region.

Claims

1. A method for bonding a first substrate to a second substrate, with an adhesive comprising:

preparing a first bond surface on the first substrate, the first bond surface less than the entire first substrate, by laser ablating the first bond surface;

disposing an adhesive on a first bond surface of the second substrate, wherein the first bond surface of the second substrate substantially corresponds to the first bond surface on the first substrate; and

bonding the second substrate to the first substrate by placing the adhesive disposed on the first bond surface of the second substrate in direct contact with the first bond surface of the first substrate.

2. The method of claim 1, wherein the average roughness of the first bond surface of the first substrate is increased to a predetermined average amount.

3. The method of claim 1, wherein the first substrate is a filled polymer resin.

4. The method of claim 3, wherein the laser ablation exposes filler material from the filled polymer resin.

5. The method of claim 4, wherein the second substrate is a substantially clear.

6. A method for bonding a first substrate to a second substrate, with an adhesive comprising:

preparing a first bond surface on the first substrate, the first bond surface less than the entire first substrate, by laser ablating the first bond surface on the first substrate;

preparing a first bond surface on the second substrate, the first bond surface less than the entire second substrate, by laser ablating the first bond surface on the second substrate;

disposing an adhesive on a first bond surface of the second substrate, wherein the first bond surface of the second substrate substantially corresponds to the first bond surface of the first substrate; and

,

positioning the adhesive to be in direct contact with the first bond surface of the first substrate.

7. The method of claim 6, wherein at least one of the first substrate or the second substrate the first substrate comprises a filled polymer resin and wherein the laser ablation removes a smooth resin finish and exposes at least a portion of the filler material

8. A housing for a portable electronic device comprising:

a rear cover including at least one opening and a laser ablated first bonding surface proximate to the at least one opening, wherein the rear cover is configured to contain electrical components for the portable electronic device;

a front cover configured to be substantially clear and sized to substantially fit into the at least one opening of the rear cover and configured to include a first bonding surface substantially matching the shape of the first bonding surface of the rear cover;

a display unit disposed within the rear cover, wherein the display unit is positioned behind the front cover so that at least a portion of the display is visible through the front cover; and

,

an adhesive applied on the first bonding surface of the rear cover, wherein the adhesive is placed in direct contact with the first bonding surface of the front cover.

9. The housing of claim 8, wherein the first bonding surface of the rear cover comprises a filled resin polymer.

10. The housing of claim 9, wherein the laser ablating removes at least a portion of the surface of the filled resin polymer.

11. The housing of claim 10, wherein the laser ablating exposes filler material included in the filled resin polymer.

12. The housing of claim 8, wherein the laser ablating increases an average roughness of the first bonding surface of the rear cover to a predetermined amount.

13. The housing of claim 8, wherein the first bonding surface of the front cover is laser ablated prior to the application of the adhesive.

14. A bonded assembly comprising:

a first substrate with a laser ablated first bonding surface, wherein the first bonding surface is less than the entire first substrate;

a second substrate with a first bonding surface corresponding to the shape of the first bonding surface of the first substrate; and

an adhesive layer disposed between the first bonding surface of the first substrate and first bonding surface of the second substrate.

15. The bonded assembly of claim 14, wherein the laser ablation increases the average surface roughness of the first bonding surface of the first substrate to a predetermined amount.

16. The bonded assembly of claim 15, wherein the first bonding surface comprises a filled polymer resin.

17. The bonded assembly of claim 16, wherein the laser ablation exposes at least a portion of the filler material in the filled polymer resin.

18. The bonded assembly of claim 14, wherein the first bonding surface of the second substrate is laser ablated prior to bonding with the first substrate.

19. The bonded assembly of claim 18, wherein the second substrate comprises a resin filled polymer.

20. The bonded assembly of claim 19, wherein the laser ablating exposes filler material on at least one of the first or the second substrates.