LASER ABLATION ADHESION PROMOTION
First Claim
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1. A method for bonding a first substrate to a second substrate, with an adhesive comprising:
- preparing a first bond surface on the first substrate, the first bond surface less than the entire first substrate, by laser ablating the first bond surface;
disposing an adhesive on a first bond surface of the second substrate, wherein the first bond surface of the second substrate substantially corresponds to the first bond surface on the first substrate; and
bonding the second substrate to the first substrate by placing the adhesive disposed on the first bond surface of the second substrate in direct contact with the first bond surface of the first substrate.
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Abstract
A method for bonding two substrates can use a laser to ablate a bonding surface of at least one of the two substrates. In one embodiment, the laser can be used to produce a predetermined average surface roughness in a bonding surface region of one of the substrates. In another embodiment, the substrate can comprise a resin filled polymer. Ablating the surface of the bonding surface can increase the bond strength in the ablation region.
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Citations
20 Claims
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1. A method for bonding a first substrate to a second substrate, with an adhesive comprising:
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preparing a first bond surface on the first substrate, the first bond surface less than the entire first substrate, by laser ablating the first bond surface; disposing an adhesive on a first bond surface of the second substrate, wherein the first bond surface of the second substrate substantially corresponds to the first bond surface on the first substrate; and bonding the second substrate to the first substrate by placing the adhesive disposed on the first bond surface of the second substrate in direct contact with the first bond surface of the first substrate. - View Dependent Claims (2, 3, 4, 5)
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6. A method for bonding a first substrate to a second substrate, with an adhesive comprising:
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preparing a first bond surface on the first substrate, the first bond surface less than the entire first substrate, by laser ablating the first bond surface on the first substrate; preparing a first bond surface on the second substrate, the first bond surface less than the entire second substrate, by laser ablating the first bond surface on the second substrate; disposing an adhesive on a first bond surface of the second substrate, wherein the first bond surface of the second substrate substantially corresponds to the first bond surface of the first substrate; and
,positioning the adhesive to be in direct contact with the first bond surface of the first substrate. - View Dependent Claims (7)
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8. A housing for a portable electronic device comprising:
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a rear cover including at least one opening and a laser ablated first bonding surface proximate to the at least one opening, wherein the rear cover is configured to contain electrical components for the portable electronic device; a front cover configured to be substantially clear and sized to substantially fit into the at least one opening of the rear cover and configured to include a first bonding surface substantially matching the shape of the first bonding surface of the rear cover; a display unit disposed within the rear cover, wherein the display unit is positioned behind the front cover so that at least a portion of the display is visible through the front cover; and
,an adhesive applied on the first bonding surface of the rear cover, wherein the adhesive is placed in direct contact with the first bonding surface of the front cover. - View Dependent Claims (9, 10, 11, 12, 13)
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14. A bonded assembly comprising:
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a first substrate with a laser ablated first bonding surface, wherein the first bonding surface is less than the entire first substrate; a second substrate with a first bonding surface corresponding to the shape of the first bonding surface of the first substrate; and an adhesive layer disposed between the first bonding surface of the first substrate and first bonding surface of the second substrate. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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Specification