MICROWAVE ANNEALING APPARATUS AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
First Claim
1. A microwave annealing apparatus comprising:
- a housing configured to shield electromagnetic waves;
a first electromagnetic wave source configured to apply a first electromagnetic wave in a microwave region into the housing;
a second electromagnetic wave source configured to apply, into the housing, a second electromagnetic wave having a higher frequency than the first electromagnetic wave;
a susceptor configured to hold a semiconductor substrate, made of a material transparent to the first electromagnetic wave and provided in the housing;
a temperature measuring device configured to measure the temperature of the semiconductor substrate; and
a control unit configured to control powers of each of the first electromagnetic wave source and the second electromagnetic wave source in accordance with the temperature measured by the temperature measuring device.
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Accused Products
Abstract
According to one embodiment, a microwave annealing apparatus is provided, including a housing shielding electromagnetic waves, a first electromagnetic wave source configured to apply a first electromagnetic wave into the housing, a second electromagnetic wave source configured to apply, into the housing, a second electromagnetic wave having a higher frequency than the first electromagnetic wave, a susceptor configured to hold a semiconductor substrate, made of a material transparent to the first electromagnetic wave and provided in the housing, a temperature measuring device configured to measure the temperature of the semiconductor substrate, and a control unit configured to control the power of each of the first and second electromagnetic wave sources in accordance with the temperature measured by the temperature measuring device.
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Citations
17 Claims
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1. A microwave annealing apparatus comprising:
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a housing configured to shield electromagnetic waves; a first electromagnetic wave source configured to apply a first electromagnetic wave in a microwave region into the housing; a second electromagnetic wave source configured to apply, into the housing, a second electromagnetic wave having a higher frequency than the first electromagnetic wave; a susceptor configured to hold a semiconductor substrate, made of a material transparent to the first electromagnetic wave and provided in the housing; a temperature measuring device configured to measure the temperature of the semiconductor substrate; and a control unit configured to control powers of each of the first electromagnetic wave source and the second electromagnetic wave source in accordance with the temperature measured by the temperature measuring device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A microwave annealing apparatus comprising:
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a housing configured to shield electromagnetic waves; a susceptor configured to hold a semiconductor substrate, provided in the housing and having a heater for heating the semiconductor substrate; an electromagnetic wave source configured to apply, into the housing, an electromagnetic wave in a microwave region; a temperature measuring device configured to measure the temperature of the semiconductor substrate; and a control unit configured to control the power of the electromagnetic wave source in accordance with the temperature measured by the temperature measuring device. - View Dependent Claims (12, 13, 14, 15, 16)
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17. A method of manufacturing a semiconductor device, comprising:
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using a microwave annealing apparatus having a heating mechanism configured to heat a semiconductor substrate held in a housing shielding electromagnetic waves, an electromagnetic wave source configured to apply, into the housing, an electromagnetic wave in a microwave region, and a temperature measuring device configured to measure the temperature of the semiconductor substrate; driving the heating mechanism heating the semiconductor substrate before driving the electromagnetic source, thereby heating the semiconductor substrate; and turning off the heating mechanism or decreasing the power of the heating mechanism when the temperature measured by the temperature measuring device becomes a preset temperature, and driving the electromagnetic source thereafter, applying an electromagnetic wave to the semiconductor substrate, thereby annealing the semiconductor substrate.
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Specification