Wafer Level Embedded Heat Spreader

• US 20140077394A1
• Filed: 09/20/2012
• Published: 03/20/2014
• Est. Priority Date: 09/20/2012
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Chang, Wei Sen, Chiang, Tsung-Hsien, Hu, Yen-Chang, Hsiao, Ching-Wen
• Granted Patent: US 9,735,087 B2
• Time in Patent Office: Days
• US Class Current: 257/782
• CPC Class Codes: H01L 21/568 Temporary substrate used as encapsulation process aid H01L21/4832 and H01L21/566 take precedence
• CPC Class Codes: H01L 2224/12105 Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
• CPC Class Codes: H01L 2224/19 Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 2224/29139 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/73267 Layer and HDI connectors
• CPC Class Codes: H01L 2224/83005 being a temporary or sacrificial substrate
• CPC Class Codes: H01L 2224/92244 the second connecting process involving a build-up interconnect
• CPC Class Codes: H01L 23/4334 Auxiliary members in encapsulations H01L23/49568 takes precedence
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/20 Structure, shape, material or disposition of high density interconnect preforms
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation

Abstract

Disclosed herein are a device having an embedded heat spreader and method for forming the same. A carrier substrate may comprise a carrier, an adhesive layer, a base film layer, and a seed layer. A patterned mask is formed with a heat spreader opening and via openings. Vias and a heat spreader may be formed in the pattern mask openings at the same time using a plating process and a die attached to the head spreader by a die attachment layer. A molding compound is applied over the die and heat spreader so that the heat spreader is disposed at the second side of the molded substrate. A first RDL may have a plurality of mounting pads and a plurality of conductive lines is formed on the molded substrate, the mounting pads may have a bond pitch greater than the bond pitch of the die contact pads.

Claims

1. A device comprising:

a die disposed within a substrate at a first side of the substrate, and having a plurality of contact pads disposed on a first side of the die and exposed at the first side of the substrate, wherein the substrate contacts a portion of the first side of the die; and

a heat spreader disposed within the substrate at a second side of the substrate opposite the first side of the substrate, and in thermal contact with the die.

2. The device of claim 1, further comprising at least one via disposed in the substrate and extending from the first side of the substrate to the second side of the substrate opposite the first side.

3. The device of claim 2, further comprising a first redistribution layer (RDL) having a first side disposed on the first side of the substrate and in contact with a portion of the die, the first RDL having a plurality of RDL contact pads disposed at a second side of the first RDL opposite the first side, and at least one conductive line electrically connecting a contact pad on the die to at least one of the plurality of RDL contact pads, wherein the RDL contact pads have a bond pitch greater than the bond pitch of the plurality of contact pads disposed on the die.

4. The device of claim 2, further comprising:

a second RDL at the second side of the substrate, the second RDL having at least one conductive line.

5. The device of claim 4, wherein the second RDL extends from outside a first edge of the heat spreader, over the heat spreader and past a second edge of the heat spreader opposite the first edge.

6. The device of claim 4, wherein a portion of at least one conductive line is disposed over the heat spreader.

7. The device of claim 4, wherein the second RDL is disposed at a portion of the heat spreader, and wherein the second RDL has a heat exposure opening extending though the second RDL and exposing a portion of a surface of the heat spreader.

8. The device of claim 1, further comprising a die attachment layer disposed between and in contact with the second side of the die and the heat spreader.

9. A device comprising:

a die disposed within a substrate and having a plurality of contact pads disposed on a first side of the die, the contact pads having a surface substantially planar with the first side of the substrate, wherein the substrate contacts a portion of the first side of the die;

a die attachment layer disposed adjacent to a second side of the die

a heat spreader embedded within the substrate and having a first side disposed on the die attachment layer; and

a first RDL having a first side disposed on the contact pads of the die.

10. The device of claim 9, wherein the substrate is a molded substrate, and wherein the first RDL is further disposed on the first side of the molded substrate, the molded substrate contacting at least a portion of the first side of the die between two of the contact pads on the die.

11. The device of claim 9, further comprising:

a plurality of RDL contact pads disposed within the first RDL and at the second side of the RDL opposite the first side; and

at least one conductive line disposed within the first RDL and electrically connecting a contact pad on the first side of the die to at least one of the plurality of RDL contact pads;

wherein the RDL contact pads have a bond pitch greater than the bond pitch of the contact pads on the first side of the die.

12-20. -20. (canceled)

21. A device comprising:

a die embedded within a substrate and having portions of each of at least two sides in contact with the substrate, the die having a plurality of contact pads on a first side of the die, the plurality of contact pads exposed at the first side of the substrate; and

a die attachment layer disposed adjacent to a second side of the die

a heat spreader embedded within the substrate, a first side of the heat spreader exposed at a second side of the substrate opposite the first side of the substrate, and having a second side in thermal contact with the die, the second side of the heat spreader opposite the first side; and

a first RDL having a portion of first side contacting on the contact pads of the die.

22. The device of claim 21, wherein the first RDL has a plurality of RDL contact pads disposed at a second side of the first RDL opposite the first side, and wherein the first RDL further has at least one first conductive line electrically connecting a contact pad on the die to at least one of the plurality of RDL contact pads.

23. The device of claim 22, wherein the RDL contact pads have a bond pitch greater than the bond pitch of the plurality of contact pads disposed on the die.

24. The device of claim 22, further comprising a second RDL at the second side of the substrate, the second RDL having at least one second conductive line.

25. The device of claim 24, wherein a portion of at least one second conductive line is disposed directly over the heat spreader.

26. The device of claim 24, wherein the second RDL has a heat exposure opening extending though the second RDL and exposing a portion of a surface of the heat spreader.

27. The device of claim 24, further comprising one or more vias disposed in the substrate and extending from the first RDL to the second RDL.

28. The device of claim 27, wherein the first RDL further has at least one third conductive line electrically connecting one of the plurality of RDL contact pads to one of the one or more vias.

29. The device of claim 28, further comprising one or more package connecting structures each disposed on respective ones of the plurality of RDL contact pads.