HEAT TRANSFER ASSEMBLY WITH HEAT PIPE BRACE AND METHOD FOR ASSEMBLING A HEAT TRANSFER ASSEMBLY

• US 20140078673A1
• Filed: 09/19/2012
• Published: 03/20/2014
• Est. Priority Date: 09/19/2012
• Status: Active Grant

• Current Assignee: GE Intelligent Platforms Incorporated (Emerson Electric Company)
• Original Assignee: General Electric Company
• Inventors: Vincent, Laith Anthony
• Granted Patent: US 8,988,880 B2
• Time in Patent Office: Days
• US Class Current: 361/700
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20336 Heat pipes, e.g. wicks or capillary pumps
• CPC Class Codes: H05K 7/2049 Pressing means used to urge contact, e.g. springs

Abstract

An electronics device and method for assembling a heat transfer assembly of the same. An electronics device includes a circuit board, a chassis that houses the circuit board, a heat pipe configured to transfer heat from the circuit board to a wall of the chassis, and a brace configured to press the heat pipe against the wall. A brace includes a medial portion configured to contact a heat pipe and an end portion including a protrusion that is configured to be received in a depression of a chassis.

Claims

1. An electronics device, comprising:

a circuit board,

a chassis that houses the circuit board,

a heat pipe configured to transfer heat from the circuit board to a wall of the chassis, and

a brace configured to press the heat pipe against the wall.

2. The electronics device of claim 1, further comprising a coupling plate configured to couple a first end of the heat pipe to the circuit board.

3. The electronics device of claim 1, further comprising a thermal pad configured to couple a second end of the heat pipe to the wall.

4. The electronics device of claim 1, a length of the heat pipe that is in contact with the wall comprising a flattened cross-section.

5. The electronics device of claim 1, wherein the brace has a low thermal coefficient of expansion.

6. The electronics device of claim 1, wherein the brace is electrically non-conducting.

7. The electronics device of claim 1, the brace comprising a medial portion that is configured to contact the heat pipe, the medial portion comprising a notch that is configured to allow the heat pipe to enter an area between the brace and the wall.

8. The electronics device of claim 1, the brace comprising a medial portion that is configured to contact the heat pipe, wherein the medial portion has a length that is substantially equal to or greater than a length of the heat pipe that is in contact with the wall.

9. The electronics device of claim 1, the chassis comprising at least one mounting structure, the brace comprising a medial portion that is configured to contact the heat pipe and at least one end portion that is configured to be held in place by the mounting structure.

10. The electronics device of claim 9, wherein the at least one mounting structure includes two mounting structures and the at least one end portion includes two end portions.

11. The electronics device of claim 9, the end portion comprising a brace aperture.

12. The electronics device of claim 11, the mounting structure comprising a chassis aperture configured to align with the brace aperture.

13. The electronics device of claim 12, further comprising a lid configured to provide a wall of the chassis, the lid comprising at least one lid aperture, wherein the lid aperture is configured to align with the brace aperture and the chassis aperture.

14. The electronics device of claim 11, wherein the axis of the brace aperture is substantially parallel to the plane of the wall.

15. The electronics device of claim 9, the end portion comprising a protrusion and the mounting structure including a depression, wherein the depression is configured to receive the protrusion.

16. The electronics device of claim 15, further comprising a lid configured to provide a wall of the chassis, the brace comprising a top surface, wherein the lid is configured to contact the top surface of the brace when the brace is held in place by the mounting structure.

17. A brace configured to press a heat pipe against a wall of a chassis, comprising:

a medial portion configured to contact a heat pipe; and

at least one end portion comprising a protrusion that is configured to be received in a depression of a chassis.

18. The brace of claim 17, wherein the medial portion comprises a notch that is configured to allow a heat pipe to enter an area between the brace and a wall.

19. The brace of claim 17, wherein the end portion comprises a brace aperture that is configured to align with a chassis aperture when the protrusion is received in a depression of a chassis.

20. The brace of claim 17, further comprising a top surface that is configured to contact an inside surface of a lid.