METHOD FOR TREATING Cu THIN SHEET

• US 20140079891A1
• Filed: 09/20/2013
• Published: 03/20/2014
• Est. Priority Date: 03/24/2011
• Status: Active Grant

• Current Assignee: NGK Insulators Limited
• Original Assignee: NGK Insulators Limited
• Inventors: MURAMATSU, Naokuni, AOSHIMA, Shoju
• Granted Patent: US 9,676,060 B2
• Time in Patent Office: Days
• US Class Current: 427/554
• CPC Class Codes: B22F 2007/047 non-pressurised baking of the paste or slurry containing metal powder
• CPC Class Codes: B22F 2998/00 Supplementary information concerning processes or compositions relating to powder metallurgy
• CPC Class Codes: B22F 2998/10 Processes characterised by the sequence of their steps
• CPC Class Codes: B22F 3/105 by using electric current other than for infrared radiant energy, laser radiation or plasma B22F3/11 takes precedence; by ultrasonic bonding B22F3/115 takes precedence
• CPC Class Codes: B22F 3/22 for producing castings from a slip
• CPC Class Codes: B22F 7/04 with one or more layers not made from powder, e.g. made from solid metal
• CPC Class Codes: B23K 2103/05 Stainless steel
• CPC Class Codes: B23K 2103/12 Copper or alloys thereof
• CPC Class Codes: B23K 2103/18 Dissimilar materials
• CPC Class Codes: B23K 2103/26 Alloys of Nickel and Cobalt and Chromium
• CPC Class Codes: B23K 26/32 taking account of the properties of the material involved
• CPC Class Codes: B23K 26/342 Build-up welding
• CPC Class Codes: B23K 35/007 at least one of the workpieces being of copper or another noble metal
• CPC Class Codes: B23K 35/0244 Powders, particles or spheres; Preforms made therefrom
• CPC Class Codes: B23K 35/025 Pastes, creams, slurries
• CPC Class Codes: B23K 35/3033 Ni as the principal constituent
• CPC Class Codes: C22C 1/0433 Nickel- or cobalt-based alloys
• CPC Class Codes: C22C 1/0458 Alloys based on titanium, zirconium or hafnium
• CPC Class Codes: C22C 16/00 Alloys based on zirconium
• CPC Class Codes: C22C 19/056 with the maximum Cr content being at least 10% but less than 20%
• CPC Class Codes: C22C 19/058 : without Mo and W
• CPC Class Codes: C22C 19/07 : based on cobalt
• CPC Class Codes: C22C 29/06 : based on carbides, but not containing other metal compounds
• CPC Class Codes: C22C 29/14 : based on borides
• CPC Class Codes: C22C 29/16 : based on nitrides containing cubic BN or wurtzitic BN and diamond C22C26/00
• CPC Class Codes: C22C 32/0052 : only carbides
• CPC Class Codes: C22C 45/10 : with molybdenum, tungsten, niobium, tantalum, titanium, or zirconium or Hf as the major constituent
• CPC Class Codes: C22C 9/00 : Alloys based on copper
• CPC Class Codes: C22C 9/06 : with nickel or cobalt as the next major constituent
• CPC Class Codes: C23C 24/10 : with intermediate formation of a liquid phase in the layer

Abstract

A method for treating a Cu thin sheet is provided. The method comprises the steps of: supplying a slurry in which a diffusion bonding aid (DBA), such as Ni powder, and a reinforcing material (RM), such as a carbide base metal compound, are dispersed in a solvent to a predetermined portion on a Cu or Cu base alloy thin sheet, drying the supplied slurry, and applying a laser to induce melting, solidification, and fixation, so as to form a buildup layer. In the method, the weight ratio of DBA to RM is specified to be 80:20 to 50:50, and the median diameters D₅₀ of both DBA and RM employed fall within 0.1 to 100 μm, the median diameter D₅₀ of DBA is larger than the median diameter D₅₀ of RM, and both the distribution ratio D₉₀/D₁₀ of DBA and the distribution ratio D₉₀/D₁₀ of RM are 4.0 or less.

Claims

1. A method for treating a Cu thin sheet, comprising the steps of:

supplying a slurry in which a diffusion bonding aid and a reinforcing material are dispersed in a solvent to a predetermined portion on a Cu or Cu base alloy thin sheet, drying the supplied slurry, and applying a laser to induce melting, solidification, and fixation, so as to form a buildup layer,

wherein (a) a Ni or Ni—

Cr alloy powder is used as the diffusion bonding aid,

(b) a carbide base metal compound, a nitride base metal compound, or a boride base metal compound is used as the reinforcing material, and the weight ratio of the diffusion bonding aid to the reinforcing material is specified to be 80;

20 to 50;

50, and

(c) the median diameters D₅₀ of both the diffusion bonding aid and the reinforcing material fall within 0.1 to 100 μ

m, the median diameter D₅₀ of the diffusion bonding aid is larger than the median diameter D₅₀ of the reinforcing material, and both the distribution ratio D₉₀/D₁₀ of the diffusion bonding aid and the distribution ratio D₉₀/D₁₀ of the reinforcing material are 4.0 or less.

2. A method for treating a Cu thin sheet, comprising the steps of:

supplying a slurry in which a diffusion bonding aid and a reinforcing material are dispersed in a solvent to a predetermined portion on a Cu or Cu base alloy thin sheet, drying the supplied slurry, and applying a laser to induce melting, solidification, and fixation, so as to form a buildup layer,

wherein (a) a Ni or Ni—

Cr alloy powder is used as the diffusion bonding aid,

(b) a stainless steel alloy, a hastelloy Ni base alloy, or a stellite Co base alloy is used as the reinforcing material, and the weight ratio of the diffusion bonding aid to the reinforcing material is specified to be 50;

50 to 1;

99, and

(c) the median diameters D₅₀ of both the diffusion bonding aid and the reinforcing material fall within 0.1 to 100 μ

m, the median diameter D₅₀ of the diffusion bonding aid is larger than the median diameter D₅₀ of the reinforcing material, and both the distribution ratio D₉₀/D₁₀ of the diffusion bonding aid and the distribution ratio D₉₀/D₁₀ of the reinforcing material are 4.0 or less.

3. A method for treating a Cu thin sheet, comprising the steps of:

supplying a slurry in which a diffusion bonding aid and a reinforcing material are dispersed in a solvent to a predetermined portion on a Cu or Cu base alloy thin sheet, drying the supplied slurry, and applying a laser to induce melting, solidification, and fixation, so as to form a buildup layer,

wherein (a) a Ni or Ni—

Cr alloy powder is used as the diffusion bonding aid,

(b) Zr—

Cu—

Al—

Ni Zr base alloy is used as the reinforcing material, and the weight ratio of the diffusion bonding aid to the reinforcing material is specified to be 50;

50 to 5;

95, and

(c) the median diameters D₅₀ of both the diffusion bonding aid and the reinforcing material fall within 0.1 to 100 μ

m, the median diameter D₅₀ of the diffusion bonding aid is larger than the median diameter D₅₀ of the reinforcing material, and both the distribution ratio D₉₀/D₁₀ of the diffusion bonding aid and the distribution ratio D₉₀/D₁₀ of the reinforcing material are 4.0 or less.