PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
First Claim
Patent Images
1. A printed wiring board, comprising:
- an outermost interlayer resin insulation layer;
an outermost conductive layer formed on the outermost interlayer resin insulation layer and including a plurality of alignment marks;
a connection wiring structure connecting the alignment marks; and
a solder-resist layer formed on the outermost interlayer resin insulation layer and the outermost conductive layer,wherein the solder-resist layer has a plurality of openings exposing the alignment marks, respectively, and each of the alignment marks has an electroless plated film formed on each of the alignment marks.
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Abstract
A printed wiring board includes an outermost interlayer resin insulation layer, n outermost conductive layer formed on the outermost interlayer resin insulation layer and including multiple alignment marks, a connection wiring structure connecting the alignment marks, and a solder-resist layer formed on the outermost interlayer resin insulation layer and the outermost conductive layer. The solder-resist layer has openings exposing the alignment marks, respectively, and each of the alignment marks has an electroless plated film formed on each of the alignment marks.
23 Citations
20 Claims
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1. A printed wiring board, comprising:
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an outermost interlayer resin insulation layer; an outermost conductive layer formed on the outermost interlayer resin insulation layer and including a plurality of alignment marks; a connection wiring structure connecting the alignment marks; and a solder-resist layer formed on the outermost interlayer resin insulation layer and the outermost conductive layer, wherein the solder-resist layer has a plurality of openings exposing the alignment marks, respectively, and each of the alignment marks has an electroless plated film formed on each of the alignment marks. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A method for manufacturing a printed wiring board, comprising:
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forming on an outermost interlayer resin insulation layer an outermost conductive layer including a plurality of alignment marks; forming a connection wiring structure such that the connection wiring structure connects the alignment marks; forming a solder-resist layer on the outermost interlayer resin insulation layer and the outermost conductive layer; forming a plurality of openings in the solder-resist layer such that the openings expose the alignment marks, respectively; and forming an electroless plated film in the opening of the solder-resist layer such that each of the alignment marks has the electroless plated film formed on each of the alignment marks. - View Dependent Claims (17, 18, 19, 20)
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Specification