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PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

  • US 20140083747A1
  • Filed: 09/27/2013
  • Published: 03/27/2014
  • Est. Priority Date: 09/27/2012
  • Status: Active Grant
First Claim
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1. A printed wiring board, comprising:

  • an outermost interlayer resin insulation layer;

    an outermost conductive layer formed on the outermost interlayer resin insulation layer and including a plurality of alignment marks;

    a connection wiring structure connecting the alignment marks; and

    a solder-resist layer formed on the outermost interlayer resin insulation layer and the outermost conductive layer,wherein the solder-resist layer has a plurality of openings exposing the alignment marks, respectively, and each of the alignment marks has an electroless plated film formed on each of the alignment marks.

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