CLOTH ELECTRONIZATION PRODUCT AND METHOD
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Accused Products
Abstract
Cloth electronic product, by which physiological information can be examined through cloth, includes a packaging cloth or a heat melt adhesive film as circuit, at least an electronic component, such as resistors, microprocessors and sensing assembly, etc., at least a transmission line to be connected with the conductive region of electronic component. Method of producing a cloth electronic product includes sewing the electronic component on packaging cloth or heat melt adhesive film after being connected with the transmission line, or connecting electronic component with the transmission line during the process of jointing of transmission or sewing of packaging cloth or heat melt adhesive film, and then sewing the packaging cloth on the clothing cloth or integrating the heat melt adhesive film into the packaging cloth or clothing cloth. Original structure of the heat melt adhesive film cannot be viewed and miniaturization effects can be produced.
47 Citations
67 Claims
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1-48. -48. (canceled)
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49. A cloth electronization method comprising:
- taking adhesive film as a substrate, at least one electronic component or at least one transmission line is sewn, stuck, or pasted onto the packaging cloth or the adhesive film to form a circuit board, then the circuit board is sewn, glued, or heated up and fixed to the cloth used for dresses or the adhesive film to realize the packaging and insulation of cloth electronization.
- View Dependent Claims (50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63)
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64. A cloth electronization method comprising:
- taking adhesive film as a substrate, at least one electronic component or at least one transmission line is sewn, stuck, or pasted onto the packaging cloth or the adhesive film to form a circuit board, then the circuit board is sewn, glued, or heated up and fixed to the cloth used for dresses or the hot melt adhesive film to realize the packaging and insulation of cloth electronization, where the circuit routing layout can be thermal printed or ink ejected on the packaging cloth or adhesive film, then the transmission lines are sewed, stuck or pasted on the packaging cloth or adhesive film;
or the transmission lines are sewn directly by a computerized sewing machine according to a pre-arranged routing plan on the adhesive film by sewing, wherein the transmission materials can also be printed while the circuit routing layout is thermal printed or ink ejected on the packaging cloth or adhesive film. The circuit routing layout can also be photo-projected on the packaging cloth or adhesive film such that the transmission lines can be e sewn, stuck or pasted along. - View Dependent Claims (65, 66)
- taking adhesive film as a substrate, at least one electronic component or at least one transmission line is sewn, stuck, or pasted onto the packaging cloth or the adhesive film to form a circuit board, then the circuit board is sewn, glued, or heated up and fixed to the cloth used for dresses or the hot melt adhesive film to realize the packaging and insulation of cloth electronization, where the circuit routing layout can be thermal printed or ink ejected on the packaging cloth or adhesive film, then the transmission lines are sewed, stuck or pasted on the packaging cloth or adhesive film;
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67. A cloth electronization method comprising:
- taking adhesive film as a substrate, at least one electronic component or at least one transmission line is sewn, stuck, or pasted onto the packaging cloth or the adhesive film to form a circuit board, where low temperature soldering tin is added to connect the transmission line of adhesive film with the conductive region of electronic component.
Specification