GROUP III NITRIDE WAFERS AND FABRICATION METHOD AND TESTING METHOD
First Claim
1. A wafer of group III nitride crystal sliced from a bulk group III nitride crystal having at least one x-ray diffraction peak for an incident beam at an angle less than 15 degrees to a surface of the wafer.
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Abstract
The invention provides, in one instance, a group III nitride wafer sliced from a group III nitride ingot, polished to remove the surface damage layer and tested with x-ray diffraction. The x-ray incident beam is irradiated at an angle less than 15 degree and diffraction peak intensity is evaluated. The group III nitride wafer passing this test has sufficient surface quality for device fabrication. The invention also provides, in one instance, a method of producing group III nitride wafer by slicing a group III nitride ingot, polishing at least one surface of the wafer, and testing the surface quality with x-ray diffraction having an incident beam angle less than 15 degree to the surface. The invention also provides, in an instance, a test method for testing the surface quality of group III nitride wafers using x-ray diffraction having an incident beam angle less than 15 degree to the surface.
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Citations
22 Claims
- 1. A wafer of group III nitride crystal sliced from a bulk group III nitride crystal having at least one x-ray diffraction peak for an incident beam at an angle less than 15 degrees to a surface of the wafer.
- 9. A method of fabricating a wafer of group iii nitride comprising (a) growing a bulk crystal of group III nitride, (b) slicing the bulk crystal into wafers, (c) polishing at least one surface of a wafer selected from said wafers until the wafer shows at least one x-ray diffraction peak for an incident beam at an angle less than 15 degrees to the surface.
- 17. A method of testing surface damage of a wafer of group III nitride sliced from a bulk group III nitride crystal comprising measuring x-ray diffraction peak with an incident beam at an angle less than 15 degrees to the damaged surface.
Specification