SEMICONDUCTOR DEVICE

• US 20140084365A1
• Filed: 12/02/2013
• Published: 03/27/2014
• Est. Priority Date: 09/09/2010
• Status: Active Grant

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: NISHIWAKI, Tatsuya
• Granted Patent: US 8,884,364 B2
• Time in Patent Office: Days
• US Class Current: 257/330
• CPC Class Codes: H01L 29/0696 of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
• CPC Class Codes: H01L 29/407 Recessed field plates, e.g. trench field plates, buried field plates
• CPC Class Codes: H01L 29/41741 for vertical or pseudo-vertical devices
• CPC Class Codes: H01L 29/41766 with at least part of the source or drain electrode having contact below the semiconductor surface, e.g. the source or drain electrode formed at least partially in a groove or with inclusions of conductor inside the semiconductor H01L29/41733 - H01L29/41758 take precedence
• CPC Class Codes: H01L 29/4238 characterised by the surface lay-out
• CPC Class Codes: H01L 29/66734 with a step of recessing the gate electrode, e.g. to form a trench gate electrode
• CPC Class Codes: H01L 29/7813 with trench gate electrode, e.g. UMOS transistors trench gate electrodes per se H01L29/4236

Abstract

A semiconductor device includes: a drain layer; a drift layer provided on the drain layer; a base region provided on the drift layer; a source region selectively provided on a surface of the base region; a first gate; a field-plate; a second gate; a drain electrode; and a source electrode. The first gate electrode is provided in each of a plurality of first trenches via a first insulating film. The first trenches penetrate from a surface of the source region through the base region and contact the drift layer. The field-plate electrode is provided in the first trench under the first gate electrode via a second insulating film. The second gate electrode is provided in a second trench via a third insulating film. The second trench penetrates from the surface of the source region through the base region and contacts the drift layer between the first trenches.

Claims

1. A semiconductor device comprising:

a drain layer of a first conductivity type;

a drift layer of the first conductivity type provided on the drain layer;

a base region of a second conductivity type provided on the drift layer;

a source region of the first conductivity type selectively provided on a surface of the base region;

a first gate electrode contacting the source region, the base region, and the drift layer via a first insulating film;

a field-plate electrode provided under the first gate electrode via a second insulating film, the field-plate electrode contacting the drift layer via the second insulating film;

a second gate electrode contacting the source region, the base region, and the drift layer via a third insulating film, and the second gate electrode being positioned between the first gate electrodes;

a drain electrode connected to the drain layer; and

a source electrode connected to the source region and the base region.

2. The device according to claim 1, wherein

a lower end of the field-plate electrode is located at a position deeper than a lower end of the second gate electrode in the drift layer.

3. The device according to claim 1, wherein

an impurity concentration of the drift layer is not more than 1×

10¹⁷ (atoms/cm³).

4. The device according to claim 1, wherein

a pitch of the first gate electrodes is not less than 0.6 μ

m.

5. The device according to claim 1, wherein

a plurality of the second gate electrodes are provided between the first gate electrodes.

6. The device according to claim 1, wherein

when viewed from a direction perpendicular to a main surface of the drift layer, the first gate electrode and the second gate electrode extend in a first direction.

7. The device according to claim 1, wherein

when viewed from a direction perpendicular to a main surface of the drift layer,

some of the plurality of first gate electrodes extend in a first direction,

the other some of the plurality of first gate electrodes extend in a second direction substantially perpendicular to the first direction, and

the some of the plurality of first gate electrodes and the other some of the plurality of first gate electrodes cross each other.

8. The device according to claim 7, wherein

when viewed from a direction perpendicular to a main surface of the drift layer,

the second gate electrode is surrounded by the some of the plurality of first gate electrodes extending in the first direction and the other some of the plurality of first gate electrodes extending in the second direction.

9. The device according to claim 7, wherein

when viewed from a direction perpendicular to a main surface of the drift layer,

a plurality of second gate electrodes are provided,

some of the plurality of second gate electrodes extend in a first direction,

the other some of the plurality of second gate electrodes extend in a second direction substantially perpendicular to the first direction,

the some of the plurality of second gate electrodes and the other some of the plurality of second gate electrodes cross each other, and

some of the plurality of second gate electrodes and the other some of the plurality of first gate electrodes cross each other, and the other some of the plurality of second gate electrodes and some of the plurality of first gate electrodes cross each other.

10. The device according to claim 1, wherein

when viewed from a direction perpendicular to a main surface of the drift layer, a shape of the region surrounded by the second gate electrodes is one of a triangle, a quadrangle, a hexagon and a circle.

11. A semiconductor device comprising:

a drain layer of a first conductivity type;

a drift layer of the first conductivity type provided on the drain layer;

a drift region of a second conductivity type provided on the drift layer;

a source region of the first conductivity type provided on a surface of the base region;

a contact region contacting the source region and the base region;

a field-plate electrode provided under the contact region, and the field-plate electrode contacting the drift region via a second insulating film;

a gate electrode contacting the source region, the base region, and the drift layer via the third insulating film, and the gate electrode being positioned between the contact regions;

a drain electrode connected to the drain layer; and

a source electrode connected to the source region and the contact region.

12. The device according to claim 11, wherein

a lower end of the field-plate electrode is located at a position deeper than a lower end of the gate electrode in the drift layer.

13. The device according to claim 11, wherein

the contact region is connected to the field-plate electrode.

14. The device according to claim 11, wherein

an impurity concentration of the drift layer is not more than 1×

10¹⁷ (atoms/cm³).

15. The device according to claim 11, wherein

a pitch of the contact regions is not less than 0.6 μ

m.

16. The device according to claim 11, wherein

a plurality of the gate electrodes are provided between the contact regions.

17. The device according to claim 11, wherein

when viewed from a direction perpendicular to a main surface of the drift layer, the contact region and the gate electrode extend in a first direction.

18. The device according to claim 11, wherein

when viewed from a direction perpendicular to a main surface of the drift layer,

a plurality of the gate electrodes are provided,

some of the plurality of gate electrodes extend in a first direction,

the other some of the plurality of gate electrodes extend in a second direction substantially perpendicular to the first direction, and

the some of the plurality of gate electrodes and the other some of the plurality of gate electrodes cross each other.

19. The device according to claim 18, wherein

when viewed from a direction perpendicular to a main surface of the drift layer,

the contact region is surrounded by the some of the plurality of gate electrodes extending in the first direction and the other some of the plurality of gate electrodes extending in the second direction.

20. The device according to claim 11, wherein

when viewed from a direction perpendicular to a main surface of the drift layer, a shape of the region surrounded by the gate electrodes is one of a triangle, a quadrangle, a hexagon and a circle.