MEMS MICROPHONE
First Claim
Patent Images
1. A method, comprising:
- obtaining a first wafer;
forming vias and a cavity in the first wafer;
bonding a silicon-on-insulator (SOI) wafer to the first wafer;
removing material from at least one of the SOI wafer and the first wafer to create a released diaphragm;
depositing a piezoelectric stack in proximity to the released diaphragm;
etching diaphragm holes in the released diaphragm to create a micro-electro-mechanical-systems (MEMS) wafer;
bonding the MEMS wafer to an integrated circuit wafer; and
exposing the MEMS wafer to an ambient environment.
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Abstract
Mechanical resonating structures, as well as related devices and methods of manufacture. The mechanical resonating structures can be microphones, each including a diaphragm and a piezoelectric stack. The diaphragm can have one or more openings formed therethrough to enable the determination of an acoustic pressure being applied to the diaphragm through signals emitted by the piezoelectric stack.
31 Citations
16 Claims
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1. A method, comprising:
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obtaining a first wafer; forming vias and a cavity in the first wafer; bonding a silicon-on-insulator (SOI) wafer to the first wafer; removing material from at least one of the SOI wafer and the first wafer to create a released diaphragm; depositing a piezoelectric stack in proximity to the released diaphragm; etching diaphragm holes in the released diaphragm to create a micro-electro-mechanical-systems (MEMS) wafer; bonding the MEMS wafer to an integrated circuit wafer; and exposing the MEMS wafer to an ambient environment. - View Dependent Claims (2, 3)
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4. A microphone, comprising:
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a substrate; a diaphragm disposed over an opening in the substrate, wherein the diaphragm includes one or more openings therein; and a piezoelectric stack in proximity to the one or more openings in the diaphragm, wherein the piezoelectric stack is connectable with a conductor for determining acoustic pressure applied to the diaphragm, and wherein the microphone does not include a backplate. - View Dependent Claims (5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A microphone, comprising:
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a substrate having an opening; and a piezoelectric stack disposed over the opening in the substrate, wherein the piezoelectric layer has one or more openings therein, wherein the piezoelectric stack is connectable with a conductor for determining acoustic pressure applied thereto, wherein the microphone does not include a backplate, and wherein the piezoelectric stack comprises a first metal layer, a second metal layer, and a piezoelectric layer disposed therebetween.
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Specification