Contact bumps methods of making contact bumps

• US 20140084460A1
• Filed: 12/02/2013
• Published: 03/27/2014
• Est. Priority Date: 08/10/2012
• Status: Active Grant

• Current Assignee: Smartrac Technology GmbH (Avery Dennison Corporation)
• Original Assignee: Smartrac Technology GmbH (Avery Dennison Corporation)
• Inventors: Nieland, Carsten, Kriebel, Frank
• Granted Patent: US 9,215,809 B2
• Time in Patent Office: Days
• US Class Current: 257/737
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: H01L 21/76885 By forming conductive members before deposition of protective insulating material, e.g. pillars, studs
• CPC Class Codes: H01L 2224/03 Manufacturing methods
• CPC Class Codes: H01L 2224/0345 Physical vapour deposition [PVD], e.g. evaporation, or sputtering
• CPC Class Codes: H01L 2224/03462 Electroplating
• CPC Class Codes: H01L 2224/03464 Electroless plating
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/05552 in top view
• CPC Class Codes: H01L 2224/05567 the external layer being at least partially embedded in the surface
• CPC Class Codes: H01L 2224/05624 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/05647 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/05655 Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/0566 Iron [Fe] as principal constituent
• CPC Class Codes: H01L 2224/05664 Palladium [Pd] as principal constituent
• CPC Class Codes: H01L 2224/05666 Titanium [Ti] as principal constituent
• CPC Class Codes: H01L 2224/05669 Platinum [Pt] as principal constituent
• CPC Class Codes: H01L 2224/05671 Chromium [Cr] as principal constituent
• CPC Class Codes: H01L 2224/11462 Electroplating
• CPC Class Codes: H01L 2224/11464 Electroless plating
• CPC Class Codes: H01L 2224/1161 : Physical or chemical etching
• CPC Class Codes: H01L 2224/11622 : Photolithography
• CPC Class Codes: H01L 2224/1182 : Applying permanent coating, e.g. in-situ coating
• CPC Class Codes: H01L 2224/13006 : Bump connector larger than the underlying bonding area, e.g. than the under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/13011 : comprising apertures or cavities, e.g. hollow bump
• CPC Class Codes: H01L 2224/13012 : in top view
• CPC Class Codes: H01L 2224/13014 : being circular or elliptic
• CPC Class Codes: H01L 2224/13017 : being non uniform along the bump connector
• CPC Class Codes: H01L 2224/13019 : at the bonding interface of the bump connector, i.e. on the surface of the bump connector
• CPC Class Codes: H01L 2224/13022 : the bump connector being at least partially embedded in the surface
• CPC Class Codes: H01L 2224/131 : with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/13109 : Indium [In] as principal constituent
• CPC Class Codes: H01L 2224/13111 : Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/13124 : Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/13144 : Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/13147 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/13155 : Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/13164 : Palladium [Pd] as principal constituent
• CPC Class Codes: H01L 2224/13599 : Material
• CPC Class Codes: H01L 2224/16113 : the whole bump connector protruding from the surface
• CPC Class Codes: H01L 2224/16145 : the bodies being stacked
• CPC Class Codes: H01L 2224/16225 : the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 : the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/73104 : the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73204 : the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/81 : using a bump connector
• CPC Class Codes: H01L 2224/81191 : wherein the bump connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81193 : wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81201 : Compression bonding
• CPC Class Codes: H01L 2224/81206 : Direction of oscillation
• CPC Class Codes: H01L 2224/81345 : Shape, e.g. interlocking features
• CPC Class Codes: H01L 2224/81385 : Shape, e.g. interlocking features
• CPC Class Codes: H01L 2224/814 : with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/8149 : with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/81898 : Press-fitting, i.e. pushing the parts together and fastening by friction, e.g. by compression of one part against the other
• CPC Class Codes: H01L 2224/83 : using a layer connector
• CPC Class Codes: H01L 2224/83862 : Heat curing
• CPC Class Codes: H01L 2224/9211 : Parallel connecting processes
• CPC Class Codes: H01L 2224/92125 : the second connecting process involving a layer connector
• CPC Class Codes: H01L 2224/94 : at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
• CPC Class Codes: H01L 23/49811 : Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 24/03 : Manufacturing methods
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/11 : Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 24/94 : at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H05K 1/18 : Printed circuits structurally associated with non-printed electric components H05K1/0201, H05K1/023, H05K1/0243, and H05K1/16 take precedence
• CPC Class Codes: H05K 2201/1059 : Connections made by press-fit insertion
• CPC Class Codes: H05K 2201/10674 : Flip chip
• CPC Class Codes: H05K 2201/10954 : Other details of electrical connections
• CPC Class Codes: H05K 2203/0278 : Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
• CPC Class Codes: H05K 2203/041 : Solder preforms in the shape of solder balls
• CPC Class Codes: H05K 3/301 : by means of a mounting structure H05K3/325 takes precedence
• CPC Class Codes: H05K 3/325 : by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor adaptations of leads inserted in holes for press-fit connections H05K3/308
• CPC Class Codes: Y10T 29/49018 : with other electrical component
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

Contact bumps between a contact pad and a substrate can include recesses and protrusions that can mate with the material of the substrate. The irregular mating surfaces between the contact bumps and the contact pads can enhance the bonding strength of the contacts, for example, against shear and tension forces, especially for flexible systems such as smart cards.

Claims

1. A bump connection comprising

a contact pad,

The contact pad comprises a lateral surface;

a contact bump,

The contact bump is coupled to the lateral surface,

The contact bump comprises a first surface and a second surface,

The first surface faces the second surface,

The first surface comprises a recess or a protrusion,

The second surface forms an angle with a direction perpendicular to the lateral surface.

2. A bump connection as in claim 1

The first surface surrounds the second surface, or

The second surface surrounds the first surface, or

The first surface is disposed next to the second surface.

3. A bump connection as in claim 1

The bump connector is configured to form a hollow chamber and a middle portion disposed in the hollow chamber,

The hollow chamber and the middle portion comprises the first and second surfaces.

4. A bump connection as in claim 1

The material in the substrate is configured to be mated or interlocked with the recess or protrusion.

5. A bump connection as in claim 1

The contact bump comprises at least a first and a second extended portions,

The first extended portion comprises the first surface, The second extended portion comprises the second surface.

6. A bump connection as in claim 1

The first extended portion surrounds the second extended portion, or

The second extended portion surrounds the first extended portion, or

The first extended portion is disposed next to the second portion.

7. A bump connection as in claim 1

The first extended portion comprises a sharp tip, or

The second extended portion comprises a sharp tip.

8. A bump connection as in claim 1

wherein first and second extended portions form a mushroom shape.

9. A bump connection as in claim 1

The substrate comprises a terminal end of an antenna.

10. A bump connection as in claim 1

The bump connection is formed in an RFID device between a chip and an antenna.

12. A bump connection as in claim 1

The second extended portion forms a hollow chamber which surrounds the first portion.

13. A bump connection as in claim 1

wherein first and second extended portions form a mushroom shape.

14. A bump connection as in claim 1

The bump connection is formed in an RFID device between a chip and an antenna.

16. A method as in claim 1

The material of the substrate flows in a lateral direction to fill the recess or a space above the protrusion.

17. A method as in claim 1 further comprising

vibrating the bump connector.

18. A method as in claim 17

The vibration is in a direction parallel or perpendicular to the lateral surface.

19. A method as in claim 1 further comprising

forming an electronic component, The electronic component comprises the first contact pad, The first contact pad comprises the bump connector;

forming a second component, The second component comprises a contact surface, The bump connector is pressed on the contact surface of the second component.

20. A method as in claim 1 further comprising

forming an RFID chip, wherein the RFID chip comprises the first contact pad;

forming the bump connector coupled to the lateral surface of the first contact pad;

forming an antenna, wherein the bump connector is pressed on a surface of the antenna.

11. A bump connection comprising

a contact pad,

The contact pad comprises a lateral surface;

a substrate;

a bump connector electrically connecting the contact pad and the substrate,

The bump connector is coupled to the lateral surface of the contact pad,

The bump connector comprises a first extended portion and a second extended portion,

The first and second extended portions are at least partially embedded in the substrate,

The second extended portion at least partially surrounds the first extended portion,

The first or the second extended portion comprises a recess or a protrusion,

The first and second extended portions are at least partially embedded in the substrate passing the recess or the protrusion,

The first or the second extended portion facing the recess or the protrusion forms an angle with a direction perpendicular to the lateral surface, which is operable to push the material of the substrate to mate with the recess or protrusion.

15. A method for forming a bump interconnect between a first contact pad and a substrate, the method comprising

pressing a bump connector on the substrate,

The bump connector is coupled to a lateral surface of the first contact pad,

The bump connector comprises a first extended portion having a first surface and a second extended portion having a second surface,

The first surface faces the second surface,

The first surface comprises a recess or a protrusion,

The second surface forms an angle with a direction perpendicular to the lateral surface,

The pressing is operable to displace the material in the substrate to interlock with the recess or protrusion of the bump connector.