Contact bumps methods of making contact bumps
First Claim
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1. A bump connection comprisinga contact pad,The contact pad comprises a lateral surface;
- a contact bump,The contact bump is coupled to the lateral surface,The contact bump comprises a first surface and a second surface,The first surface faces the second surface,The first surface comprises a recess or a protrusion,The second surface forms an angle with a direction perpendicular to the lateral surface.
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Abstract
Contact bumps between a contact pad and a substrate can include recesses and protrusions that can mate with the material of the substrate. The irregular mating surfaces between the contact bumps and the contact pads can enhance the bonding strength of the contacts, for example, against shear and tension forces, especially for flexible systems such as smart cards.
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Citations
20 Claims
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1. A bump connection comprising
a contact pad, The contact pad comprises a lateral surface; a contact bump, The contact bump is coupled to the lateral surface, The contact bump comprises a first surface and a second surface, The first surface faces the second surface, The first surface comprises a recess or a protrusion, The second surface forms an angle with a direction perpendicular to the lateral surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 12, 13, 14, 16, 17, 18, 19, 20)
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11. A bump connection comprising
a contact pad, The contact pad comprises a lateral surface; -
a substrate; a bump connector electrically connecting the contact pad and the substrate, The bump connector is coupled to the lateral surface of the contact pad, The bump connector comprises a first extended portion and a second extended portion, The first and second extended portions are at least partially embedded in the substrate, The second extended portion at least partially surrounds the first extended portion, The first or the second extended portion comprises a recess or a protrusion, The first and second extended portions are at least partially embedded in the substrate passing the recess or the protrusion, The first or the second extended portion facing the recess or the protrusion forms an angle with a direction perpendicular to the lateral surface, which is operable to push the material of the substrate to mate with the recess or protrusion.
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15. A method for forming a bump interconnect between a first contact pad and a substrate, the method comprising
pressing a bump connector on the substrate, The bump connector is coupled to a lateral surface of the first contact pad, The bump connector comprises a first extended portion having a first surface and a second extended portion having a second surface, The first surface faces the second surface, The first surface comprises a recess or a protrusion, The second surface forms an angle with a direction perpendicular to the lateral surface, The pressing is operable to displace the material in the substrate to interlock with the recess or protrusion of the bump connector.
Specification