LINKED SEMICONDUCTOR MODULE UNIT AND ELECTRONIC CIRCUIT-INTEGRATED MOTOR DEVICE USING SAME
First Claim
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1. An electronic circuit-integrated motor device comprising:
- a tubular motor case;
a stator positioned on a radially inside part of the motor case and wound with a multiple-phase coil;
a rotor positioned in a radially inside part of the stator;
a shaft fit in the rotor to be rotatable the rotor;
a plurality of semiconductor modules, each having a switching element for changing a coil current flowing to the multiple-phase coil; and
a linking member linking the plurality of semiconductor modules to form a linked semiconductor module unit,wherein each of the semiconductor modules includes at least one semiconductor chip that forms the switching element, a land on which the semiconductor chip is mounted, and a resin part that encapsulates the semiconductor chip and embeds the land therein,wherein the linking member is comprised of embedded portions, each embedded in a respective said resin part, and exposed portions that extend between the embedded portions and are exposed from the resin parts, said embedded portions and said exposed portions being formed integrally and continuously in one piece,wherein the linking member includes a bent portion that is bent at the exposed portion, andfurther comprising a heat sink mounted on an axial end wall of the motor case in a raised manner, wherein the linked semiconductor module unit is bent at a radially inside part of the heat sink along the heat sink, and positioned around a rotation axis of the motor.
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Abstract
A linked semiconductor module unit links a plurality of semiconductor modules by a first bus bar and a second bus bar, which are embedded in resin parts. The linked semiconductor module unit is disposed in a place other than on a printed circuit board. The semiconductor module linking structure is implemented readily by molding the bus bars together with semiconductor chips and lands to form the resin parts.
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Citations
7 Claims
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1. An electronic circuit-integrated motor device comprising:
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a tubular motor case; a stator positioned on a radially inside part of the motor case and wound with a multiple-phase coil; a rotor positioned in a radially inside part of the stator; a shaft fit in the rotor to be rotatable the rotor; a plurality of semiconductor modules, each having a switching element for changing a coil current flowing to the multiple-phase coil; and a linking member linking the plurality of semiconductor modules to form a linked semiconductor module unit, wherein each of the semiconductor modules includes at least one semiconductor chip that forms the switching element, a land on which the semiconductor chip is mounted, and a resin part that encapsulates the semiconductor chip and embeds the land therein, wherein the linking member is comprised of embedded portions, each embedded in a respective said resin part, and exposed portions that extend between the embedded portions and are exposed from the resin parts, said embedded portions and said exposed portions being formed integrally and continuously in one piece, wherein the linking member includes a bent portion that is bent at the exposed portion, and further comprising a heat sink mounted on an axial end wall of the motor case in a raised manner, wherein the linked semiconductor module unit is bent at a radially inside part of the heat sink along the heat sink, and positioned around a rotation axis of the motor. - View Dependent Claims (2, 3, 4, 5, 7)
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6. An electronic circuit-integrated motor device comprising:
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a tubular motor case; a stator positioned on a radially inside part of the motor case and wound with a multiple-phase coil; a rotor positioned in a radially inside part of the stator; a shaft fit in the rotor to be rotatable with the rotor; a heat sink mounted on an axial end wall of the motor case in a raised manner to extend in a direction of rotation axis of the shaft in a form of a tubular metal block, which has an outer wall surface and an inner wall surface surrounding the rotation axis of the shaft; a plurality of semiconductor modules, each of which has a switching element for changing a coil current flowing to the multiple-phase coil; and a linking member linking the plurality of semiconductor modules to form a linked semiconductor module unit, the linking member being made of a conductive member to electrically connect the semiconductor modules and bent between adjacent two of the semiconductor modules in a shape, which surrounds the rotation axis of the shaft, and fixed to either one of the outer surface and the inner surface of the heat sink, wherein the heat sink and all of the plurality of semiconductor modules are provided at one axial end side and within a diameter of the motor case.
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Specification