Display Device

• US 20140085169A1
• Filed: 03/01/2012
• Published: 03/27/2014
• Est. Priority Date: 04/07/2011
• Status: Active Grant

• Current Assignee: OSRAM OLED GMBH (Ams-Osram AG)
• Original Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG)
• Inventors: Illek, Stefan, von Malm, Norwin, Ruegheimer, Tilman
• Granted Patent: US 10,062,320 B2
• Time in Patent Office: Days
• US Class Current: 345/82
• CPC Class Codes: G09G 3/32 semiconductive, e.g. using light-emitting diodes [LED]
• CPC Class Codes: G09G 3/3208 organic, e.g. using organic light-emitting diodes [OLED]
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other

Abstract

A display device includes a multiplicity of pixels, at least one connection carrier, and a multiplicity of inorganic light-emitting diode chips. The connection carrier includes a multiplicity of switches. Each pixel contains at least one light-emitting diode chip. Each light-emitting diode chip is mechanically fixed and electrically connected to the connection carrier. Each switch is designed for driving at least one light-emitting diode chip and the light-emitting diode chips are imaging elements of the display device.

Claims

1-15. -15. (canceled)

16. A display device comprising:

a multiplicity of pixels;

a connection carrier comprising a multiplicity of switches; and

a multiplicity of inorganic light-emitting diode chips, each pixel contains at least one of the light-emitting diode chips;

wherein each light-emitting diode chip is mechanically fixed and electrically connected to the connection carrier;

wherein each switch is designed to drive at least one light-emitting diode chip and/or each switch is assigned one-to-one to a light-emitting diode chip; and

wherein the light-emitting diode chips are imaging elements of the display device.

17. The display device according to claim 16, comprising:

a contact layer electrically conductively connecting at least two light-emitting diode chips to one another; and

an optical body disposed downstream of at least one portion of the light-emitting diode chips;

wherein radiation passage areas are formed at that side of the light-emitting diode chips which faces away from the connection carrier;

wherein the contact layer is embodied in a radiation-transmissive fashion in places;

wherein the contact layer is formed in places with a material that is reflective to electromagnetic radiation generated by the light-emitting diode chips during operation;

wherein the electromagnetic radiation generated by the light-emitting diode chips during operation at least partly passes through the optical body;

wherein the electromagnetic radiation is optically expanded upon passing through the optical body;

wherein the optical body comprises radiation-nontransmissive separating structures, which optically separate adjacent pixels from one another;

wherein the separating structures extend from that side of the main body of the optical body which faces the light-emitting diode chips in the direction of that side of the main body which faces away from the light-emitting diode chips, and do not completely penetrate through the main body; and

wherein the separating structures are formed by cutouts in a main body of the optical body which are filled with at least one of the following materials;

TiO₂, Al₂O₃.

18. The display device according to claim 16, comprising a contact layer, which electrically conductively connects at least two light-emitting diode chips to one another.

19. The display device according to claim 18,

wherein the contact layer is embodied in a radiation-transmissive fashion at least in places;

and

wherein the contact layer covers at least in places radiation passage areas of the light-emitting diode chips electrically conductively connected to one another by the contact layer.

20. The display device according to claim 19, wherein the radiation passage areas are formed at that side of the light-emitting diode chips which faces away from the connection carrier.

21. The display device according to claim 18,

wherein the contact layer is embodied in a radiation-transmissive fashion at least in places;

and

wherein the contact layer is formed at least in places with a material that is reflective to electromagnetic radiation generated by the light-emitting diode chips during operation.

22. The display device according to claim 18, wherein the contact layer is formed in places with a transparent conductive oxide.

23. The display device according to claim 18, wherein the contact layer is formed in places with a reflective metal such as silver or aluminum.

24. The display device according to claim 16, further comprising:

an optical body disposed downstream of at least a portion of the light-emitting diode chips, wherein electromagnetic radiation generated by the light-emitting diode chips during operation at least partly passes through the optical body.

25. The display device according to claim 24, wherein the electromagnetic radiation is optically expanded upon passing through the optical body.

26. The display device according to claim 25, wherein the optical body comprises radiation-nontransmissive separating structures that optically separate adjacent pixels from one another.

27. The display device according to claim 26,

wherein the optical body comprises scattering structures for scattering the electromagnetic radiation passing through;

and

wherein the separating structures are formed by diffusely reflective regions.

28. The display device according to claim 25, wherein the optical body comprises scattering structures for scattering the electromagnetic radiation passing through.

29. The display device according to claim 26, wherein the separating structures are formed by cutouts in a main body of the optical body which are filled with at least one of the following materials:

TiO₂, Al₂O₃.

30. The display device according to claim 26, wherein the separating structures extend from that side of a main body of the optical body which faces the light-emitting diode chips in the direction of that side of the main body which faces away from the light-emitting diode chips, and do not completely penetrate through the main body.

31. The display device according to any of claim 24, wherein a contact layer at least in places directly adjoins the light-emitting diode chips, the contact layer electrically conductively connecting the light-emitting diode chips to one another and to the optical body.

32. The display device according to claim 16,

wherein a p-type side and an n-type side of each of the light-emitting diode chips are contact-connected from the side of the connection carrier;

wherein the light-emitting diode chip comprises an n-conducting region, a p-conducting region and an active region provided for generating radiation, said active region being arranged between the two regions; and

wherein the p-conducting region is contact-connected via at least one plated-through hole in the n-conducting region.

33. The display device according to claim 16, wherein each switch is designed to drive at least one light-emitting diode chip.

34. The display device according to claim 33, wherein switch is assigned one-to-one to a light-emitting diode chip.

35. The display device according to claim 16, wherein switch is assigned one-to-one to a light-emitting diode chip.