Printed circuit board with compact groups of devices
First Claim
1. Apparatus, comprising:
- a printed circuit board having printed circuit board contacts; and
an electrical component formed from a plurality of stacked surface mount technology components on the printed circuit board, wherein the plurality of stacked surface mount technology components includes at least a first surface mount technology component having first component contacts and a second surface mount technology component having second component contacts, wherein the first surface mount technology component is mounted to the printed circuit board so that at least one of the first component contacts is coupled to at least one of the printed circuit board contacts and wherein the second surface mount technology component is mounted on the first surface mount technology component so that none of the second component contacts are coupled to the printed circuit board contacts.
1 Assignment
0 Petitions
Accused Products
Abstract
Electronic devices may contain electrical systems in which electrical components are mounted on a substrate such as a printed circuit board. The electrical components may include surface mount technology components. Multiple surface mount technology components may be stacked on top of each other and beside each other to form an electrical component that minimizes the amount of area that is consumed on a printed circuit board. Noise suppression circuits and other circuits may be implemented using stacked surface mount technology components. Surface mount technology components placed on the printed circuit board may be pushed together and subsequently injection molded to form packed component groups. An integrated circuit may be mounted to the printed circuit board via an interposer and may cover components mounted to the printed circuit board. An integrated circuit may be mounted over a recessed portion of the printed circuit board on which components are mounted.
27 Citations
36 Claims
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1. Apparatus, comprising:
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a printed circuit board having printed circuit board contacts; and an electrical component formed from a plurality of stacked surface mount technology components on the printed circuit board, wherein the plurality of stacked surface mount technology components includes at least a first surface mount technology component having first component contacts and a second surface mount technology component having second component contacts, wherein the first surface mount technology component is mounted to the printed circuit board so that at least one of the first component contacts is coupled to at least one of the printed circuit board contacts and wherein the second surface mount technology component is mounted on the first surface mount technology component so that none of the second component contacts are coupled to the printed circuit board contacts. - View Dependent Claims (2, 3, 4, 5, 6)
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7. Apparatus, comprising:
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a printed circuit board having printed circuit board contacts; and an electrical component formed from a plurality of stacked surface mount technology components on the printed circuit board, wherein the plurality of stacked surface mount technology components includes at least a first surface mount technology component having first component contacts, a second surface mount technology component having second component contacts, and a third surface mount technology component having third component contacts, wherein the electrical component has first, second, and third terminals coupled to the printed circuit board contacts, wherein the first terminal is formed from one of the component contacts of the first surface mount technology component, wherein the second terminal is formed from one of the component contacts of the second surface mount technology component, and wherein the third terminal is formed form one of the component contacts of the third surface mount technology component. - View Dependent Claims (8, 9, 10, 11, 12)
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13. Apparatus, comprising:
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a printed circuit board having printed circuit board contacts; and an electrical component formed from a plurality of horizontally stacked surface mount technology components on the printed circuit board, wherein the plurality of stacked surface mount technology components includes at least a first surface mount technology component having first component contacts, a second surface mount technology component having second component contacts, a third surface mount technology component having third component contacts, and a fourth surface mount technology component having fourth component contacts, wherein the electrical component has first, second, and third terminals coupled to the printed circuit board contacts, wherein the first terminal is formed from a first of the component contacts of the first surface mount technology component, wherein the third terminal is formed from a second of the component contacts of the first surface mount technology component, and wherein the second terminal is formed from one of the component contacts of the second surface mount technology component. - View Dependent Claims (14, 15, 16, 17)
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18. Apparatus, comprising:
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a printed circuit board having printed circuit board contacts; and an electrical component formed from a plurality of horizontally stacked surface mount technology components on the printed circuit board, wherein the plurality of stacked surface mount technology components includes at least a first surface mount technology component having first component contacts, a second surface mount technology component having second component contacts, and a third surface mount technology component having third component contacts, wherein the electrical component has first, second, and third terminals coupled to the printed circuit board contacts, wherein the first terminal is formed from a first of the component contacts of the first surface mount technology component and wherein the second terminal is formed from one of the component contacts of the third surface mount technology component. - View Dependent Claims (19, 20, 21)
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22. Apparatus, comprising:
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a printed circuit board; a component mounted to the printed circuit board; an interposer mounted to the printed circuit board; and an integrated circuit mounted to the interposer, wherein the integrated circuit covers at least a portion of the component. - View Dependent Claims (23, 24, 25, 26, 27)
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28. Apparatus, comprising:
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a printed circuit substrate having a recessed portion; at least one component mounted on the recessed portion of the printed circuit substrate; and an integrated circuit mounted over the recessed portion of the printed circuit substrate and the component. - View Dependent Claims (29, 30, 31, 32)
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33. A method of mounting components to a printed circuit board, the method comprising:
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with component placement tools, placing a first component on the printed circuit board; with the component placement tools, placing a second component on the printed circuit board; with component positioning tools, pushing the first and second components to contact each other; and depositing a dielectric layer over the first and second components. - View Dependent Claims (34, 35, 36)
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Specification