POLING STRUCTURES AND METHODS FOR PHOTONIC DEVICES EMPLOYING ELECTRO-OPTICAL POLYMERS
First Claim
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1. A photonic device comprising:
- a first and second optical waveguide;
a first EOP region optically coupled to the first optical waveguide;
a second EOP region optically coupled to the second optical waveguide,a first electrode laterally spaced apart from a second electrode with the first EOP region disposed there between; and
a third electrode laterally spaced apart from a fourth electrode with the second EOP region disposed there between, wherein the second EOP region has an in-plane pole direction opposite that of the first EOP region.
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Abstract
EOP-based photonic devices employing coplanar electrodes and in-plane poled chromophores and methods of their manufacture. In an individual EOP-based photonic device, enhanced performance is achieved through in-plane poled chromophores having opposing polarities, enabling, for example, a push-pull optical modulator with reduced operational voltage and switching power relative to a conventional MZ modulator. For a plurality of EOP-based photonic devices, enhanced manufacturability is achieved through a sacrificial interconnect enabling concurrent in-plane poling of many EOP regions disposed on a substrate.
16 Citations
27 Claims
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1. A photonic device comprising:
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a first and second optical waveguide; a first EOP region optically coupled to the first optical waveguide; a second EOP region optically coupled to the second optical waveguide, a first electrode laterally spaced apart from a second electrode with the first EOP region disposed there between; and a third electrode laterally spaced apart from a fourth electrode with the second EOP region disposed there between, wherein the second EOP region has an in-plane pole direction opposite that of the first EOP region. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A photonic integrated circuit (PIC), comprising:
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n optical modulators, wherein each optical modulator includes an optical waveguide passing between a pair of coplanar electrodes and optically coupled to an EOP region disposed between the pair of electrodes; at least two poling probe pads; and at least two bifurcated metal leads, wherein each of the bifurcated metal leads includes at least one segment that is electrically connected by a via to one of the electrodes, and is electrically isolated from the poling probe pads. - View Dependent Claims (9, 10, 11, 12, 13)
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14. A photonic device comprising:
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a first and second optical waveguide; a first EOP region optically coupled to the first optical waveguide; a second EOP region optically coupled to the second optical waveguide, a first electrode laterally spaced apart from a second electrode with the first EOP region disposed there between; a third electrode laterally spaced apart from a fourth electrode with the second EOP region disposed there between, wherein the first, second, third, and fourth electrodes are coplanar; a first bifurcated metal lead comprising first metal lead segments, wherein a first of the first segments is electrically coupled to the first electrode, a second of the first segments is electrically coupled to the third electrode, and a third of the first segments is electrically coupled to a first poling probe pad. - View Dependent Claims (15, 16, 17)
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18. A method of fabricating a photonic device, the method comprising:
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receiving the photonic device disposed on a substrate, wherein the photonic device comprises; a first electrode laterally spaced apart from a second electrode with a first EOP region disposed there between; and a third electrode laterally spaced apart from a fourth electrode with a second EOP region disposed there between; and applying a voltage to the second and third electrodes relative to the first and fourth electrodes to generate an in-plane field across the first EOP region that opposes an in-plane field across the second EOP region. - View Dependent Claims (19, 20, 21, 22)
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23. A method of fabricating a plurality of photonic devices, the method comprising:
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receiving the plurality of photonic devices disposed over a substrate, each device comprising first and second electrodes spaced apart with an EOP region disposed there between, wherein the first electrodes are coupled to a first poling probe pad by a first metal lead, and wherein the second electrodes are coupled to a second poling probe pad by a second metal lead; applying a voltage between a first and second poling probe pads to induce an electric field across EOP regions of the plurality of EOP devices concurrently; curing the plurality of poled EOP regions; and bifurcating the first and second metal leads to separate the first and second electrodes from the first and second poling probe pads. - View Dependent Claims (24, 25, 26, 27)
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Specification