THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE, METAL FOIL-CLAD LAMINATE, AND CIRCUIT BOARD

• US 20140087614A1
• Filed: 04/27/2012
• Published: 03/27/2014
• Est. Priority Date: 05/02/2011
• Status: Active Grant

• Current Assignee: Panasonic Intellectual Property Management Co., Ltd. (Panasonic Holdings Corporation)
• Original Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Inventors: Matsuda, Takashi, Nishino, Mitsuyoshi, Komori, Kiyotaka
• Granted Patent: US 9,718,941 B2
• Time in Patent Office: Days
• US Class Current: 442/59
• CPC Class Codes: B32B 15/092 comprising epoxy resins
• CPC Class Codes: B32B 2264/102 Oxide or hydroxide
• CPC Class Codes: B32B 2311/12 Copper
• CPC Class Codes: B32B 2363/00 Epoxy resins
• CPC Class Codes: B32B 2457/08 PCBs, i.e. printed circuit boards
• CPC Class Codes: C08J 2363/00 Characterised by the use of epoxy resins; Derivatives of epoxy resins
• CPC Class Codes: C08J 5/244 using glass fibres
• CPC Class Codes: C08J 5/249 characterised by the additives used in the prepolymer mixture
• CPC Class Codes: C08K 2003/222 Magnesia, i.e. magnesium oxide
• CPC Class Codes: C08K 2003/2224 Magnesium hydroxide
• CPC Class Codes: C08K 2003/2227 of aluminium
• CPC Class Codes: C08K 2003/265 Calcium, strontium or barium carbonate
• CPC Class Codes: C08K 2201/003 Additives being defined by their diameter
• CPC Class Codes: C08K 2201/005 Additives being defined by their particle size in general
• CPC Class Codes: C08K 2201/014 Additives containing two or more different additives of the same subgroup in C08K
• CPC Class Codes: C08K 3/013 Fillers, pigments or reinforcing additives
• CPC Class Codes: C08K 3/22 of metals
• CPC Class Codes: C08K 3/26 Carbonates; Bicarbonates
• CPC Class Codes: C08L 63/00 Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• CPC Class Codes: H05K 1/0366 reinforced, e.g. by fibres, fabrics H05K1/036 takes precedence
• CPC Class Codes: H05K 1/0373 : containing additives, e.g. fillers H05K1/036 takes precedence
• CPC Class Codes: H05K 2201/0209 : Inorganic, non-metallic particles
• CPC Class Codes: H05K 2201/0266 : Size distribution
• CPC Class Codes: Y10T 442/20 : Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
• CPC Class Codes: Y10T 442/3431 : Plural fabric layers
• CPC Class Codes: Y10T 442/3472 : Woven fabric including an additional woven fabric layer

Abstract

Provided is a thermosetting resin composition that contains 40 to 80 parts by volume of an inorganic filler with respect to 100 parts by volume of thermosetting resin solids and the inorganic filler. The inorganic filler contains (A) at least one type of particles selected from among gibbsite-type aluminum hydroxide particles and magnesium hydroxide particles having an average particle size (D₅₀) of 1 to 15 μm; (B) aluminum oxide particles having an average particle size (D₅₀) of 1.5 μm or less; and (C) a molybdenum compound, and the blending ratios (by volume) of the component (A), the component (B) and the component (C) with respect to 100% as the total amount of inorganic filler are component (A): 30 to 70%, component (B): 1 to 40%, and component (C): 1 to 10%.

Claims

1. A thermosetting resin composition, containing 40 to 80 parts by volume of an inorganic filler with respect to 100 parts by volume of thermosetting resin solids and the inorganic filler,

wherein the inorganic filler contains:

(A) at least one type of particles selected from among gibbsite-type aluminum hydroxide particles and magnesium hydroxide particles having an average particle size (D₅₀) of 1 to 15 μ

m;

(B) aluminum oxide particles having an average particle size (D₅₀) of 1.5 μ

m or less; and

(C) a molybdenum compound, and

blending ratios (by volume) of the component (A), the component (B) and the component (C) with respect to 100% as the total amount of inorganic filler are component (A);

30 to 70%, component (B);

1 to 40%, and component (C);

1 to 10%.

2. The thermosetting resin composition according to claim 1, further containing, as an inorganic filler, (D) boehmite particles having an average particle size (D₅₀) of 0.1 to 3 μ

m,

wherein blending ratios (by volume) of the component (A), the component (B), the component (C) and the component (D) with respect to 100% as the total amount of inorganic filler are component (A);

30 to 70%, component (B);

1 to 30%, component (C);

1 to 10% and component (D);

10 to 30%.

3. The thermosetting resin composition according to claim 1, further containing, as an inorganic filler, (E) inorganic particles having an average particle size (D₅₀) of 0.1 to 15 μ

m and having a thermal conductivity of 9 W/mK or higher.

4. The thermosetting resin composition according to claim 3, wherein the inorganic microparticles (E) are magnesium oxide having an average particle size (D₅₀) of 1 to 15 μ

m and satisfying the formula below;

1≦

BET/S≦

5 

 

(Formula

     1)

(where BET denotes a BET specific surface area, and S denotes a theoretical calculated value of specific surface area, in spherical conversion, represented by 6/(average particle size)(density)).

5. The thermosetting resin composition according to claim 3, wherein blending ratios (by volume) of the component (A), the component (B), the component (C), the component (D) and the component (E) with respect to 100% as the total amount of inorganic filler are component (A):

30 to 50%, component (B);

1 to 20%, component (C);

1 to 10%, component (D);

10 to 30% and component (E);

10 to 50%.

6. A prepreg obtained by impregnating a woven fabric base material with the thermosetting resin composition according to claim 1.

7. A prepreg obtained by impregnating a nonwoven fabric base material with the thermosetting resin composition according to claim 1.

8. The prepreg according to claim 6, wherein a volume ratio of the thermosetting resin composition ranges from 50 to 90 vol %.

9. A laminate obtained by layering and molding of one or a plurality of sheets of the prepreg according to claim 6.

10. A metal foil-clad laminate, wherein at least one surface of the laminate according to claim 9 is clad with a metal foil.

11. A circuit board obtained by forming a circuit on the metal foil-clad laminate according to claim 10.