FEMTOSESCOND LASER SYSTEM FOR THE EXACT MANIPULATION OF MATERIAL AND TISSUES

• US 20140088574A1
• Filed: 10/23/2013
• Published: 03/27/2014
• Est. Priority Date: 01/18/2002
• Status: Active Grant

• Current Assignee: Carl Zeiss Meditec AG (Carl-Zeiss-Stiftung)
• Original Assignee: Carl Zeiss Meditec AG (Carl-Zeiss-Stiftung)
• Inventors: DICK, Manfred, BERGT, Michael
• Granted Patent: US 10,123,906 B2
• Time in Patent Office: Days
• US Class Current: 606/4
• CPC Class Codes: A61F 2009/00844 Feedback systems
• CPC Class Codes: A61F 2009/00865 Sclera
• CPC Class Codes: A61F 2009/00868 Ciliary muscles or trabecular meshwork
• CPC Class Codes: A61F 2009/0087 Lens
• CPC Class Codes: A61F 2009/00872 Cornea
• CPC Class Codes: A61F 2009/00874 Vitreous
• CPC Class Codes: A61F 2009/00895 Presbyopia
• CPC Class Codes: A61F 9/008 using laser
• CPC Class Codes: A61F 9/00827 Refractive correction, e.g. lenticle
• CPC Class Codes: A61F 9/00831 Transplantation
• CPC Class Codes: A61F 9/00836 Flap cutting
• CPC Class Codes: A61F 9/0084 Laser features or special beam parameters therefor
• CPC Class Codes: A61F 9/009 Auxiliary devices making contact with the eyeball and coupling in laser light, e.g. goniolenses apparatus for eye examination A61B3/0008
• CPC Class Codes: B23K 2103/32 Material from living organisms, e.g. skins
• CPC Class Codes: B23K 26/0006 taking account of the properties of the material involved B23K26/32, B23K26/40 take precedence
• CPC Class Codes: B23K 26/04 Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
• CPC Class Codes: B23K 26/06 Shaping the laser beam, e.g. by masks or multi-focusing
• CPC Class Codes: B23K 26/0624 using ultrashort pulses, i.e. pulses of 1ns or less
• CPC Class Codes: B23K 26/08 Devices involving relative movement between laser beam and workpiece
• CPC Class Codes: B23K 26/082 Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
• CPC Class Codes: H01S 3/10046 : Pulse repetition rate control H01S3/11 takes precedence
• CPC Class Codes: H01S 3/1103 : Cavity dumping

Abstract

A device for the exact manipulation of material, especially of organic material, includes a pulsed laser system with a radiation source, said radiation source being a cavity-dumped fs oscillator.

Claims

1. A device for precise machining of a material, comprising:

a pulsed laser system having a beam source,

wherein the beam source includes a cavity-dumped fs oscillator.

2. The device as recited in claim 1, wherein the material is an organic material.

3. The device as recited in claim 1, further comprising a beam apparatus for at least one of a beam formation, a beam guidance, a beam deflection and a beam focussing.

4. The device as recited in claim 3, wherein the beam apparatus is programmable.

5. The device as recited in claim 1, further comprising a holding device configured to one of position and fix the material.

6. The device as recited in claim 1, wherein the cavity-dumped fs oscillator is configured to provide laser pulses having a pulse energy of 100 nJ to 100 μ

J.

7. The device as recited in claim 6, wherein the pulse energy is 1 μ

J.

8. The device as recited in claim 1, wherein the cavity-dumped fs oscillator is configured to provide laser pulses with repetition rates from 10 kHz to 10 MHz.

9. The device as recited in claim 1, wherein the beam apparatus is configured to apply a working beam of the beam source to the material in a geometrically predeterminable form and in a chronologically predeterminable course.

10. The device as recited in claim 9, wherein the beam apparatus includes a beam deflection device and wherein the a repetition rate of the working beam is changeable during application of the working beam to the material.

15. The device as recited in claim 1, wherein the material includes the eye of a human patient.

11. A method for applying a laser beam to a material, the method comprising:

providing a laser beam having fs pulses using a cavity-dumped fs oscillator beam source;

directing the laser beam on the material so as to destroy a cohesion of the material in a focus of the laser beam using photodismption.

12. The method as recited in claim 11, wherein the material is an organic material.

13. The method as recited in claim 11, further comprising guiding the pulsed laser beam onto the material using a deflection apparatus and modifying a repetition rate of the fs pulses in relation to a spot pattern produced on the material.

14. The method as recited in claim 12, further comprising performing refractive surgers using the laser beam.