LIQUID-COOLED HEAT DISSIPATING DEVICE AND METHOD OF MAKING THE SAME

• US 20140090825A1
• Filed: 11/12/2013
• Published: 04/03/2014
• Est. Priority Date: 06/03/2009
• Status: Abandoned Application

• Current Assignee: Tong Hsing Electronic Industries, Ltd.
• Original Assignee: Tong Hsing Electronic Industries, Ltd.
• Inventors: CHIANG, Wen-Chung
• Application Number:
  US14/077,430
• Publication Number:
  US 20140090825A1
• Time in Patent Office: Days
• US Class Current: 165/170
• CPC Class Codes: F28F 21/04 of ceramic; of concrete; of natural stone
• CPC Class Codes: F28F 21/085 from copper or copper alloys
• CPC Class Codes: F28F 2255/18 sintered
• CPC Class Codes: F28F 3/12 Elements constructed in the shape of a hollow panel, e.g. with channels F28D1/02, F28D1/03 take precedence
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 29/4935 Heat exchanger or boiler making

Abstract

A liquid-cooled heat dissipating device includes a chamber-confining body confining a liquid chamber adapted to receive a liquid coolant, and having a surrounding wall that surrounds the liquid chamber, a cover plate covering the liquid chamber and sinter-bonded to the surrounding wall, a liquid inlet spatially communicating with the liquid chamber, and a liquid outlet spatially communicating with the liquid chamber. A method of making the liquid-cooled heat dissipating device is also disclosed.

Claims

1. A liquid-cooled heat dissipating device comprising:

a chamber-confining body confining a liquid chamber adapted to receive a liquid coolant, and having a surrounding wall that surrounds said liquid chamber;

a cover plate covering said liquid chamber and eutectic-bonded to said surrounding wall;

a liquid inlet spatially communicating with said liquid chamber; and

a liquid outlet spatially communicating with said liquid chamber;

wherein said surrounding wall of said chamber-confining body has a top open end eutectic-bonded to said cover plate, and a bottom open end opposite to said top open end, said chamber-confining body further having a base plate connected integrally to said bottom open end of said surrounding wall as one piece;

wherein said chamber-confining body is made of copper, said cover plate being a ceramic-copper plate that includes a ceramic substrate and two copper layers formed on two opposite surfaces of said ceramic substrate.

2. The liquid-cooled heat dissipating device of claim 1, wherein said chamber-confining body further has a plurality of dividing walls connected to said surrounding wall and dividing said liquid chamber into a plurality of channels that are interconnected.

3. The liquid-cooled heat dissipating device of claim 2, further comprising a plurality of thermally conductive elements disposed in said channels.

4. The liquid-cooled heat dissipating device of claim 3, wherein said thermally conductive elements are copper balls.