Semiconductor Housing for Smart Cards

• US 20140091450A1
• Filed: 09/24/2013
• Published: 04/03/2014
• Est. Priority Date: 09/25/2012
• Status: Abandoned Application

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Pueschner, Frank, Hoegerl, Juergen, Scherl, Peter, Spoettl, Thomas
• Application Number:
  US14/035,579
• Publication Number:
  US 20140091450A1
• Time in Patent Office: Days
• US Class Current: 257/679
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 23/5388 for flat cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/18161 of a flip chip

Abstract

A semiconductor housing includes a front side with a semiconductor chip and a first metallization on a substrate, and a rear side with a second metallization. The rear side is situated opposite the front side of the semiconductor housing. The semiconductor housing further includes a first compensation layer applied on the front side of the semiconductor housing.

Claims

1. A semiconductor housing, comprising:

a front side with a semiconductor chip and a first metallization on a substrate;

a rear side with a second metallization, the rear side being situated opposite the front side; and

a first compensation layer applied on the front side of the semiconductor housing.

2. The semiconductor housing of claim 1, wherein the first compensation layer has a thickness such that a top side of the chip forms a planar surface with the first compensation layer.

3. The semiconductor housing of claim 1, further comprising a second compensation layer on the rear side of the semiconductor housing.

4. The semiconductor housing of claim 3, wherein the second compensation layer has a thickness such that the second metallization forms a planar surface with the second compensation layer.

5. The semiconductor housing of claim 1, wherein the semiconductor housing is a contactless smart card module, wherein the first and second metallizations are embodied in continuous coil form, and wherein the semiconductor chip is fixed using FCOS technology.

6. A semiconductor housing, comprising:

a substrate with a first metallization at a first side of the substrate and a second metallization at a second side of the substrate opposite the first side;

a semiconductor chip attached to the first side of the substrate and electrically connected to the first and second metallizations; and

a first compensation layer disposed on the first side of the substrate.

7. The semiconductor housing of claim 6, wherein the first compensation layer forms a planar surface with a side of the semiconductor chip facing away from the substrate.

8. The semiconductor housing of claim 6, further comprising a second compensation layer disposed on the second side of the substrate.

9. The semiconductor housing of claim 8, wherein the second compensation layer forms a planar surface with a side of the second metallization facing away from the substrate.

10. A smart card module, comprising:

a smart card body with opposing planar surfaces;

a semiconductor housing disposed in the smart card body and comprising;

a substrate with a first metallization at a first side of the substrate and a second metallization at a second side of the substrate opposite the first side;

a semiconductor chip attached to the first side of the substrate and electrically connected to the first and second metallizations; and

a first compensation layer disposed on the first side of the substrate and laminated into the smart card body; and

a contactless antenna disposed in the smart card body.

11. The smart card module of claim 10, wherein the first compensation layer forms a planar surface with a side of the semiconductor chip facing away from the substrate.

12. The smart card module of claim 10, wherein the semiconductor housing further comprises a second compensation layer disposed on the second side of the substrate and laminated into the smart card body.

13. The smart card module of claim 12, wherein the second compensation layer forms a planar surface with a side of the second metallization facing away from the substrate.

14. The smart card module of claim 10, wherein the smart card body comprises a first core layer and a second core layer.

15. The smart card module of claim 14, wherein one of the core layers has a cutout that receives the semiconductor housing.

16. The smart card module of claim 14, wherein one of the core layers has a cutout that receives a side of the semiconductor housing with the semiconductor chip and the other core layer has a cutout that receives a side of the semiconductor housing with the second metallization.

17. The smart card module of claim 14, wherein only one of the core layers has a cutout that receives the entire semiconductor housing.