COOLING DEVICE AND SEMICONDUCTOR DEVICE

• US 20140091453A1
• Filed: 09/27/2013
• Published: 04/03/2014
• Est. Priority Date: 10/02/2012
• Status: Abandoned Application

• Current Assignee: Kabushiki Kaisha Toyota Jidoshokki (Toyota Motor Corporation)
• Original Assignee: Kabushiki Kaisha Toyota Jidoshokki (Toyota Motor Corporation)
• Inventors: MORI, Shogo, NISHI, Shinsuke, HIRANO, Tomoya, OTOBE, Yuri, KATO, Naoki, MATSUSHIMA, Seiji
• Application Number:
  US14/040,019
• Publication Number:
  US 20140091453A1
• Time in Patent Office: Days
• US Class Current: 257/712
• CPC Class Codes: F28F 13/06 by affecting the pattern of flow of the heat-exchange media F28F13/003 takes precedence; static flow control means in header boxes F28F9/026
• CPC Class Codes: F28F 2250/02 Streamline-shaped elements
• CPC Class Codes: F28F 3/02 Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations F28F3/08 takes precedence
• CPC Class Codes: F28F 3/022 the means being wires or pins
• CPC Class Codes: F28F 3/12 Elements constructed in the shape of a hollow panel, e.g. with channels F28D1/02, F28D1/03 take precedence
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A cooling device includes a base and a plurality of radiator fins. The base includes an exterior, an interior, an inlet, and an outlet. A heat generation element is connected to the exterior of the base. The radiator fins are located near the heat generation element in the interior of the base. The radiator fins are arranged from the inlet to the outlet. Each radiator fin has a sidewise cross-section with a dimension in a flow direction of the cooling medium and a dimension in a lateral direction orthogonal to the flow direction of the cooling medium. The dimension in the flow direction is longer than the dimension in the lateral direction. The radiator fins are separated from one another by a predetermined distance in the lateral direction.

Claims

1. A cooling device comprising:

a base including an exterior, an interior, an inlet, and an outlet, wherein a heat generation element is connected to the exterior; and

a plurality of pin-shaped radiator fins located in the interior of the base at a portion near the heat generation element, wherein the radiator fins are arranged from the inlet to the outlet, wherein

the cooling device cools the heat generation element with a cooling medium flowing in the interior of the base from the inlet to the outlet,

each of the radiator fins includes a sidewise cross-section having a dimension in a flow direction of the cooling medium and a dimension in a lateral direction orthogonal to the flow direction of the cooling medium, and the dimension in the flow direction is longer than the dimension in the lateral direction, and

the radiator fins are separated from one another by a predetermined distance in the lateral direction.

2. The cooling device according to claim 1, wherein the sidewise cross-section includes an outline including two sides, the two sides are directed from an upstream side to a downstream side in the flow direction of the cooling medium and extended away from each other in the lateral direction of the corresponding radiator fin, and the two sides intersect at a section facing the upstream side in the flow direction of the cooling medium.

3. The cooling device according to claim 2, wherein the section at which the two sides intersect is a corner.

4. The cooling device according to claim 2, wherein each of the radiator fins has a rhombic sidewise cross-section.

5. The cooling device according to claim 2, wherein each of the radiator fins includes

a first portion located at an upstream side in the flow direction of the cooling medium and including the section at which the two sides intersect;

and

a second portion located at a downstream side in the flow direction of the cooling medium and excluding the section at which the two sides intersect.

6. The cooling device according to claim 1, wherein each of the radiator fins has an ellipsoidal sidewise cross-section.

7. The cooling device according to claim 1, wherein the radiator fins are arranged in a staggered manner.

8. The cooling device according to claim 1, wherein the predetermined distance is shorter than or equal to the dimension in the flow direction of each of the radiator fins.

9. The cooling device according to claim 1, wherein the radiator fins include a first radiator fin and a second radiator fin arranged in the flow direction of the cooling medium, and a downstream portion of the first radiator fin overlaps with an upstream portion of the second radiator fin in the lateral direction.

10. A semiconductor device comprising:

the cooling device according to claim 1;

an insulation substrate; and

a semiconductor element serving as the heat generation element and connected to the base by the insulation substrate.