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PROXIMITY SENSOR AND CIRCUIT LAYOUT METHOD THEREOF

  • US 20140097451A1
  • Filed: 09/27/2013
  • Published: 04/10/2014
  • Est. Priority Date: 10/04/2012
  • Status: Abandoned Application
First Claim
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1. A proximity sensor, comprising:

  • a light sensor, comprising;

    a semiconductor substrate, having a first circuit region, at least one semiconductor device being disposed in the first circuit region; and

    a bonding pad, disposed above the first circuit region and a gap being existed between the bonding pad and the at least one semiconductor device;

    a control circuit; and

    a light emitting unit, disposed on the bonding pad, the light emitting unit being electrically connected to the control circuit through the bonding pad.

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