PROXIMITY SENSOR AND CIRCUIT LAYOUT METHOD THEREOF

• US 20140097451A1
• Filed: 09/27/2013
• Published: 04/10/2014
• Est. Priority Date: 10/04/2012
• Status: Abandoned Application

• Current Assignee: uPI Semiconductor Corporation (ASUSTek Computer, Inc.)
• Original Assignee: uPI Semiconductor Corporation (ASUSTek Computer, Inc.)
• Inventors: Lin, Ping-Yuan
• Application Number:
  US14/038,818
• Publication Number:
  US 20140097451A1
• Time in Patent Office: Days
• US Class Current: 257/82
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A proximity sensor and a circuit layout method thereof are disclosed. The proximity sensor includes a light sensor and a light emitting unit. The light sensor includes a semiconductor substrate and a bonding pad. The semiconductor substrate has a first circuit region. At least one semiconductor device is disposed in the first circuit region. The bonding pad is disposed above the first circuit region and a gap is existed between the bonding pad and the at least one semiconductor device. The bonding pad is connected to the semiconductor substrate out of the first circuit region. The light emitting unit is disposed on the bonding pad of the light sensor.

Claims

1. A proximity sensor, comprising:

a light sensor, comprising;

a semiconductor substrate, having a first circuit region, at least one semiconductor device being disposed in the first circuit region; and

a bonding pad, disposed above the first circuit region and a gap being existed between the bonding pad and the at least one semiconductor device;

a control circuit; and

a light emitting unit, disposed on the bonding pad, the light emitting unit being electrically connected to the control circuit through the bonding pad.

2. The proximity sensor of claim 1, wherein the bonding pad comprises:

a flat portion, the light emitting unit being disposed on the flat portion; and

at least one supporting portion, disposed under the flat portion, for connecting to a region of the semiconductor substrate outside the first circuit region and supporting the flat portion, wherein the flat portion is located above the first circuit region and the gap is existed between the flat portion and the at least one semiconductor device.

3. The proximity sensor of claim 1, wherein the control circuit is disposed in the light sensor and used to control the operation of the light sensor and the light emitting unit.

4. The proximity sensor of claim 1, wherein the control circuit is disposed in the light sensor, the bonding pad has a metal layer, a pin of the light emitting unit is electrically connected to the control circuit through the metal layer.

5. The proximity sensor of claim 1, wherein the light sensor and the light emitting unit are dies.

6. The proximity sensor of claim 1, further comprising:

an epoxy, for encapsulating the light sensor and the light emitting unit.

7. The proximity sensor of claim 1, wherein the light sensor has a light sensing area, and the light sensing area is located outside the first circuit region and the connecting location of the substrate and the bonding pad.

8. The proximity sensor of claim 1, wherein a light emitting surface of the light emitting unit and a light sensing area on the light sensor are located on different planes respectively.

9. A circuit layout method for a proximity sensor circuit, comprising steps of:

(a) providing a semiconductor substrate and disposing at least one semiconductor device in a first circuit region of the semiconductor substrate;

(b) disposing a bonding pad above the first circuit region and a gap being existed between the bonding pad and the at least one semiconductor device;

(c) providing a control circuit; and

(d) disposing a light emitting unit on the bonding pad, and electrically connecting the light emitting unit to the control circuit through the bonding pad.

10. The circuit layout method of claim 9, wherein the bonding pad comprises a flat portion and at least one supporting portion, the step (b) further comprises steps of:

disposing the at least one supporting portion under the flat portion;

connecting the at least one supporting portion to a region of the semiconductor substrate outside the first circuit region and supporting the flat portion and supporting the flat portion; and

disposing the light emitting unit on the flat portion.

11. The circuit layout method of claim 9, further comprising the step of:

using the control circuit disposed in the light sensor to control the operation of the light sensor and the light emitting unit.

12. The circuit layout method of claim 9, further comprising the step of:

electrically connecting a pin of the light emitting unit to the control circuit disposed in the light sensor through a metal layer of the bonding pad.

13. The circuit layout method of claim 9, further comprising the step of:

using an epoxy to encapsulate the light sensor and the light emitting unit.

14. The circuit layout method of claim 9, further comprising the step of:

forming a light sensing area located outside the first circuit region and the connecting location of the substrate and the bonding pad, wherein the light sensing area and a light emitting surface of the light emitting unit are located on different planes respectively.