LIGHT EMITTING DEVICES FOR LIGHT EMITTING DIODES (LEDS)

• US 20140097453A1
• Filed: 10/01/2013
• Published: 04/10/2014
• Est. Priority Date: 11/22/2010
• Status: Active Grant

• Current Assignee: Creeled Incorporated
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Hussell, Christopher P., Andrews, Peter Scott, Reiherzer, Jesse Colin, Emerson, David T.
• Granted Patent: US 9,203,004 B2
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

Light emitting devices for light emitting diodes (LEDs) are disclosed. In one embodiment a light emitting device can include a substrate, one or more LEDs disposed over the substrate, and the LEDs can include electrical connectors for connecting to an electrical element. A light emitting device can further include a retention material disposed over the substrate and the retention material can be disposed over at least a portion of the electrical connectors. The LEDs can be connected in a pattern that is non-linear.

Claims

1. A light emitting device, comprising:

a substrate;

one or more light emitting diodes (LEDs) disposed over the substrate comprising electrical connectors;

a solder mask disposed over at least a portion of the substrate; and

a retention material disposed over the substrate, wherein the retention material is disposed over at least a portion of the electrical connectors, and also over at least a portion of the solder mask.

2. The light emitting device of claim 1, further comprising at least two electrical elements disposed on the substrate in an annular configuration with at least one space between ends of the electrical elements and at least one electrostatic discharge device (ESD) disposed on the substrate and positioned in the space between the ends of the electrical elements, wherein the retention material is at least partially disposed over the at least one ESD.

3. The light emitting device of claim 1, wherein the retention material forms a dam.

4. The light emitting device of claim 1, wherein the electrical connectors comprise wirebonds.

5. The light emitting device of claim 1, wherein the one or more LEDs are arranged at least partially in a checkerboard configuration.

6. The light emitting device of claim 1, wherein the one or more LEDs are electrically connected in series as a string of LEDs.

8. A light emitting device, comprising:

a substrate;

at least two electrical elements disposed on the substrate and disposed in an annular configuration between ends of the electrical elements;

at least one electrostatic discharge device (ESD) disposed on the substrate and positioned between the ends of the electrical elements; and

a retention material disposed over the substrate and at least partially disposed over the electrical elements and the at least one ESD.

7. The light emitting device of claim 9, wherein the first string of LEDs comprises LEDs configured in at least a first non-linear pattern, at least a second non-linear pattern that is different from the first non-linear pattern, and at least a third linear pattern.

9. The light emitting device of claim 8, wherein the at least one ESD is covered by the retention material.

10. The light emitting device of claim 8, further comprising two ESDs that are connected in series and positioned in a space between the ends of the electrical elements.

11. The light emitting device of claim 10, wherein the two ESDs are completely covered by the retention material.

12. The light emitting device of claim 8, wherein the ESD is a Zener diode.

13. A light emitting device, comprising:

a substrate;

a retention material disposed over the substrate and forming an area for containing an encapsulant at least one electrostatic discharge device (ESD) disposed on the substrate, with the retention material at least partially covering the ESD.

14. The light emitting device of claim 13, wherein the at least one ESD is completely covered by the retention material.

15. The light emitting device of claim 14, comprising at least two electrical elements disposed on the substrate and disposed in an annular configuration.

16. The light emitting device of claim 15, further comprising at least two ESDs connected in series and positioned between ends of the electrical elements.

17. The light emitting device of claim 16, wherein the two ESDs are completely covered by the retention material.

18. The light emitting device of claim 13, wherein the ESD is a Zener diode.

19. The light emitting device of claim 13, comprising one or more light emitting diodes (LEDs) disposed over the substrate.

20. A light emitting device, comprising:

a substrate; and

at least one string of light emitting diodes (LEDs) disposed over the substrate and electrically connected in series,

the first string of LEDs comprising LEDs configured in;

at least a first non-linear pattern, at least a second non-linear pattern that is different from the first non-linear pattern, and at least a third linear pattern.

21. The light emitting device of claim 20, wherein the first and second non-linear patterns comprise at least one of the following arrangements:

a checkerboard arrangement; and

a grid arrangement wherein the LEDs are substantially aligned in at least two directions.

22. A light emitting device, comprising:

a substrate; and

a plurality of strings of light emitting diodes (LEDs), each string comprising LEDs electrically connected in series and disposed over the substrate,

at least one string of LEDs comprising LEDs configured in at least a first pattern and LEDS configured in at least a second pattern that is different from the first pattern.

23. The light emitting device of claim 22, wherein the first pattern and the second pattern comprise at least two of the following arrangements:

a straight-line arrangement;

a checkerboard arrangement; and

a grid arrangement wherein the LEDs are substantially aligned in at least two directions.

24. The light emitting device of claim 22, wherein the at least one string of LEDs comprises LEDs configured in at least the first pattern, LEDs configured in at least the second pattern that is different from the first pattern, and LEDs configured in at least a third pattern that is different from both the first pattern and the second pattern.

25. The light emitting device of claim 24, wherein the first pattern, the second pattern, and the third pattern are all different and comprise at least two of the following arrangements:

a straight-line arrangement;

a checkerboard arrangement; and

a grid arrangement wherein the LEDs are substantially aligned in at least two directions.