GAS ISOLATION CHAMBER AND PLASMA DEPOSITION APPARATUS THEREOF

• US 20140102368A1
• Filed: 05/31/2013
• Published: 04/17/2014
• Est. Priority Date: 10/12/2012
• Status: Abandoned Application

• Current Assignee: Institute Of Nuclear Energy Research Atomic Energy Council Executive Yuan
• Original Assignee: Institute Of Nuclear Energy Research Atomic Energy Council Executive Yuan
• Inventors: HSIEH, CHENG-CHANG, LIN, DENG-LAIN, TSENG, CHING-PEI, WU, JIN-YU, CHEN, JIUN-SHEN, AI, CHI-FONG
• Application Number:
  US13/906,462
• Publication Number:
  US 20140102368A1
• Time in Patent Office: Days
• US Class Current: 118/723.R
• CPC Class Codes: C23C 14/541 Heating or cooling of the substrates
• CPC Class Codes: C23C 14/562 for coating elongated substrates
• CPC Class Codes: C23C 16/4409 characterised by sealing means
• CPC Class Codes: C23C 16/46 characterised by the method used for heating the substrate C23C16/48, C23C16/50 take precedence
• CPC Class Codes: C23C 16/545 for coating elongated substrates

Abstract

A gas isolation chamber comprises a vacuum chamber, a first body module, a second body module and a first temperature modulator. The vacuum chamber comprises a first chamber part, a second chamber part and at least one first gas valve unit. The first body module is disposed on the inner wall of the first chamber part and has a first gas hole corresponding to the position of the first gas valve unit. The first gas hole is connected to the first gas valve unit. The second body module is disposed on the inner wall of the second chamber part such that a slit channel can be formed between the second and the first body modules. The first temperature modulator is disposed in the first body module. The gas isolation chamber is further combined with the vacuum film process chambers to form a plasma deposition apparatus for proceeding continuous deposition process.

Claims

1. A gas isolation chamber, comprising:

a vacuum chamber, further comprising;

a first chamber part;

a second chamber part, arranged corresponding to the first chamber part while allowing a first opening and a second opening to be formed between the first chamber part and the second chamber part; and

at least one first gas valve unit, disposed on the first chamber part;

a first body module, disposed on the inner wall of the first chamber part, having a first gas hole arranged at a position corresponding to the at least one first gas valve unit while allowing the first gas hole to be connected to the at least one first gas valve unit;

a second body module, disposed on the inner wall of the second chamber part at a position corresponding to the first body part for allowing a slit channel to be formed between the second and the first body modules in a manner that the slit channel is connected respectively to the first opening, the second opening and the first gas hole; and

a first temperature modulator, disposed in the first body module.

2. The gas isolation chamber of claim 1, wherein each of the at least one first gas valve unit further comprises:

a first gas uniform distributor.

3. The gas isolation chamber of claim 1, wherein the vacuum chamber further comprises at least one second gas valve unit, and the at least one second gas valve unit is disposed on the second chamber part.

4. The gas isolation chamber of claim 3, wherein the second body module further has a second gas hole arranged at a position corresponding to the at least one second gas valve unit while allowing the second gas hole to be connected to the at least one second gas valve unit.

5. The gas isolation chamber of claim 4, wherein the slit channel is connected respectively to the first opening, the second opening and the second gas hole.

6. The gas isolation chamber of claim 1, further comprising:

a second temperature modulator, disposed on the second body module.

7. The gas isolation chamber of claim 3, wherein each of the second valve unit further comprises:

a second gas uniform distributor.

8. The gas isolation chamber of claim 6, wherein each of the first and the second temperature modulator is a device selected from the group consisting of:

a heating strip, a device composed of a plurality of heating tubes, and a device composed of a plurality of cooling tubes.

9. A plasma deposition apparatus, comprising:

a material feeding chamber;

a first process chamber, connected to the material feeding chamber;

a first gas isolation chamber, further comprising;

a vacuum chamber, further comprising;

a first chamber part;

a second chamber part, arranged corresponding to the first chamber part while allowing a first opening and a second opening to be formed between the first chamber part and the second chamber part; and

at least one first gas valve unit, disposed on the first chamber part;

a first body module, disposed on the inner wall of the first chamber part, having a first gas hole arranged at a position corresponding to the at least one first gas valve unit while allowing the first gas hole to be connected to the at least one first gas valve unit

a second body module, disposed on the inner wall of the second chamber part at a position corresponding to the first body part for allowing a slit channel to be formed between the second and the first body modules in a manner that the slit channel is connected respectively to the first opening, the second opening and the first gas hole; and

a first temperature modulator, disposed in the first body module;

a second process chamber, connected to the first gas isolation chamber; and

a material collecting chamber, connected to the second process chamber;

wherein, the first gas isolation chamber is arranged at a position between the first process chamber and the second process chamber while allowing the first opening to connect to the first process chamber and the second opening to connect to the second process chamber.

10. The plasma deposition apparatus of claim 9, wherein each of the at least one first gas valve unit further comprises:

a first gas uniform distributor.

11. The plasma deposition apparatus of claim 9, wherein the vacuum chamber further comprises at least one second gas valve unit, and the at least one second gas valve unit is disposed on the second chamber part.

12. The plasma deposition apparatus of claim 11, wherein the second body module further has a second gas hole arranged at a position corresponding to the at least one second gas valve unit while allowing the second gas hole to be connected to the at least one second gas valve unit.

13. The plasma deposition apparatus of claim 12, wherein the slit channel is connected respectively to the first opening, the second opening and the second gas hole.

14. The plasma deposition apparatus of claim 9, further comprising:

a second temperature modulator, disposed on the second body module.

15. The plasma deposition apparatus of claim 11, wherein each of the second valve unit further comprises:

a second gas uniform distributor.

16. The plasma deposition apparatus of claim 14, wherein each of the first and the second temperature modulators is a device selected from the group consisting of:

a heating strip, a device composed of a plurality of heating tubes, and a device composed of a plurality of cooling tubes.

17. The plasma deposition apparatus of claim 9, wherein each of the first and the second process chambers is enabled to perform a process selected from the group consisting:

a plasma-enhanced chemical vapor deposition (PECVD) process, a physical vapor deposition (PVD) process, and other plasma-enhanced deposition processes.

18. The plasma deposition apparatus of claim 9, wherein each of the first and the second process chambers is enabled to perform a process selected from the group consisting:

a pretreatment process of plasma-enhanced chemical vapor deposition (PECVD), a pretreatment process of physical vapor deposition (PVD), and other plasma-enhanced pretreatment processes.

19. The plasma deposition apparatus of claim 11, further comprises:

a plurality of gas supplying systems, respectively connected to their corresponding first gas valve unit and second gas valve unit.

20. The plasma deposition apparatus of claim 9, further comprising:

a buffer pump; and

a second gas isolation chamber, structured the same as the first gas isolation chamber;

wherein, the buffer pump and the second gas isolation chamber are disposed at a position between the first gas isolation chamber and the second process chamber while allowing the buffer pump to connected to the first gas isolation chamber and the second gas isolation chamber to connected respectively to the buffer pump and the second process chamber.

21. The plasma deposition apparatus of claim 9, further comprising:

a third gas isolation chamber, structured the same as the first gas isolation chamber, disposed at a position between the material feeding chamber and the first process chamber while allowing the third gas isolation chamber to connected respectively to the material feeding chamber and the first process chamber.

22. The plasma deposition apparatus of claim 20, further comprising:

a third gas isolation chamber, structured the same as the first gas isolation chamber, disposed at a position between the material feeding chamber and the first process chamber while allowing the third gas isolation chamber to connected respectively to the material feeding chamber and the first process chamber.

23. The plasma deposition apparatus of claim 9, further comprising:

a fourth gas isolation chamber, structured the same as the first gas isolation chamber, disposed at a position between the second process chamber and the material collecting chamber while allowing the fourth gas isolation chamber to connected respectively to the second process chamber and the material collecting chamber.

24. The plasma deposition apparatus of claim 20, further comprising:

a fourth gas isolation chamber, structured the same as the first gas isolation chamber, disposed at a position between the second process chamber and the material collecting chamber while allowing the fourth gas isolation chamber to connected respectively to the second process chamber and the material collecting chamber.

25. The plasma deposition apparatus of claim 9, further comprising:

a fifth gas isolation chamber, structured the same as the first gas isolation chamber, disposed at a position between the material feeding chamber and the first process chamber while allowing the fifth gas isolation chamber to connected respectively to the material feeding chamber and the first process chamber; and

a sixth gas isolation chamber, structured the same as the first gas isolation chamber, disposed at a position between the second process chamber and the material collecting chamber while allowing the sixth gas isolation chamber to connected respectively to the second process chamber and the material collecting chamber.

26. The plasma deposition apparatus of claim 20, further comprising:

a fifth gas isolation chamber, structured the same as the first gas isolation chamber, disposed at a position between the material feeding chamber and the first process chamber while allowing the fifth gas isolation chamber to connected respectively to the material feeding chamber and the first process chamber; and

a sixth gas isolation chamber, structured the same as the first gas isolation chamber, disposed at a position between the second process chamber and the material collecting chamber while allowing the sixth gas isolation chamber to connected respectively to the second process chamber and the material collecting chamber.