HEATED SUBSTRATE SUPPORT RING

• US 20140103027A1
• Filed: 10/17/2013
• Published: 04/17/2014
• Est. Priority Date: 10/17/2012
• Status: Active Grant

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: MILLER, KEITH A.
• Granted Patent: US 10,727,092 B2
• Time in Patent Office: Days
• US Class Current: 219/444.1
• CPC Class Codes: H01L 21/67103 mainly by conduction
• CPC Class Codes: H01L 21/68735 characterised by edge profile or support profile

Abstract

Embodiments of substrate support rings are provided herein. In some embodiments, an apparatus for processing substrates includes, a ring configured to be disposed about a peripheral edge of a substrate support to support at least a portion of a substrate disposed atop the substrate support, wherein the ring comprises a heater; and a power supply coupled to the heater to provide power to the heater.

Claims

1. An apparatus for processing substrates, comprising:

a ring configured to be disposed about a peripheral edge of a substrate support to support at least a portion of a substrate disposed atop the substrate support, wherein the ring comprises a heater; and

a power supply coupled to the heater to provide power to the heater.

2. The apparatus of claim 1, wherein the heater is a resistive heating element embedded in the ring.

3. The apparatus of claim 1, wherein the heater is an electrically conductive coating disposed atop at least one of a bottom surface or a peripheral edge of the ring.

4. The apparatus of claim 1, wherein the ring further comprises:

a channel formed in a bottom surface of the ring to interface with an electrical feedthrough to electrically couple power from the power supply to the heater.

5. The apparatus of claim 4, wherein the electrical feedthrough is at least partially embedded in a body of the substrate support.

6. The apparatus of claim 4, wherein the channel comprises a conductive coating disposed within the channel.

7. The apparatus of claim 1, wherein the ring comprises a through hole configured to receive a fastener, the through hole electrically coupled to the heater, wherein the fastener is electrically coupled to the power supply.

8. The apparatus of claim 7, further comprising:

a block disposed beneath the ring, the block having a hole configured to interface with a threaded portion of the fastener when the fastener is disposed in the through hole of the ring to couple the ring to the block, wherein the power supply is coupled to the fastener between the ring and the block.

9. The apparatus of claim 8, wherein a portion of the block extends beneath a portion of the substrate support.

10. The apparatus of claim 9, wherein each of the ring and the block comprise one or more protrusions configured to contact the substrate support when the block is coupled to the ring.

11. The apparatus of claim 1, wherein the substrate support comprises an electrostatic chuck.

12. A process chamber, comprising:

a chamber body;

a substrate support disposed within the chamber body;

a ring disposed about a peripheral edge of a substrate support to support at least a portion of a substrate disposed atop the substrate support, wherein the ring comprises a heater; and

a power supply coupled to the heater to provide power to the heater.

13. The process chamber of claim 12, wherein the heater is a resistive heating element embedded in the ring.

14. The process chamber of claim 12, wherein the heater is an electrically conductive coating disposed atop at least one of a bottom or outer peripheral edge of the ring.

15. The process chamber of claim 12, wherein the ring further comprises:

a channel formed in a bottom surface of the ring and electrically coupled to the heater, the channel configured to interface with an electrical feedthrough, wherein the electrical feedthrough is electrically coupled to the power supply.

16. The process chamber of claim 15, wherein the electrical feedthrough is at least partially embedded in a body of the substrate support.

17. The process chamber of claim 15, wherein the channel comprises a conductive coating disposed within the channel.

18. The process chamber of claim 12, wherein the ring comprises a through hole configured to receive a fastener, the through hole electrically coupled to the heater, wherein the fastener is coupled to the power supply.

19. The process chamber of claim 18, further comprising:

a block disposed beneath the ring, the block having a hole configured to interface with a threaded portion of the fastener when the fastener is disposed in the through hole of the ring to couple the ring to the block, wherein the power supply is coupled to the fastener between the ring and the block.

20. The process chamber of claim 19, wherein a portion of the block extends beneath a portion of the substrate support.