CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
First Claim
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1. A method for manufacturing a semiconductor device, the method comprising steps of:
- forming a first electrode on a base; and
forming a solder ball composed of lead free solder on the first electrode,wherein the step of forming the first electrode comprises steps of;
forming a first layer containing copper as a main component on the base;
forming a second layer containing nickel as a main component on the first layer;
forming a third layer containing tin as a main component on the second layer; and
forming a alloy layer of the second layer and the third layer by a heat treatment after the step of forming the third layer.
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Abstract
There is provided a circuit board to which a solder ball composed of a lead (Pb)-free solder is to be connected, a semiconductor device including an electrode and a solder ball composed of a lead (Pb)-free solder disposed on the electrode, and a method of manufacturing the semiconductor device, in which mounting reliability can be improved by enhancing the bonding strength (adhesion strength) between the solder ball composed of a lead (Pb)-free solder and the electrode.
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9 Claims
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1. A method for manufacturing a semiconductor device, the method comprising steps of:
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forming a first electrode on a base; and forming a solder ball composed of lead free solder on the first electrode, wherein the step of forming the first electrode comprises steps of; forming a first layer containing copper as a main component on the base; forming a second layer containing nickel as a main component on the first layer; forming a third layer containing tin as a main component on the second layer; and forming a alloy layer of the second layer and the third layer by a heat treatment after the step of forming the third layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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Specification