SEMICONDUCTOR DEVICE
First Claim
1. A semiconductor device comprising:
- an oxide insulating film;
an oxide semiconductor layer over the oxide insulating film;
a first source electrode layer and a first drain electrode layer in contact with the oxide semiconductor layer;
a second source electrode layer and a second drain electrode layer covering the first source electrode layer and the first drain electrode layer, respectively, and being in contact with the oxide semiconductor layer;
a gate insulating film over the oxide insulating film, the oxide semiconductor layer, the second source electrode layer, and the second drain electrode layer;
a gate electrode layer over the gate insulating film and overlapping with the oxide semiconductor layer; and
a protective insulating film over the gate insulating film and the gate electrode layer,wherein the gate insulating film is partly in contact with the oxide insulating film in an exterior region of the second source electrode layer and the second drain electrode layer.
1 Assignment
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Accused Products
Abstract
A semiconductor device in which an increase in oxygen vacancies in an oxide semiconductor layer can be suppressed is provided. A semiconductor device with favorable electrical characteristics is provided. A highly reliable semiconductor device is provided. A semiconductor device includes an oxide semiconductor layer in a channel formation region, and by the use of an oxide insulating film below and in contact with the oxide semiconductor layer and a gate insulating film over and in contact with the oxide semiconductor layer, oxygen of the oxide insulating film or the gate insulating film is supplied to the oxide semiconductor layer. Further, a conductive nitride is used for a metal film of a source electrode layer and a drain electrode layer, whereby diffusion of oxygen to the metal film is suppressed.
40 Citations
12 Claims
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1. A semiconductor device comprising:
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an oxide insulating film; an oxide semiconductor layer over the oxide insulating film; a first source electrode layer and a first drain electrode layer in contact with the oxide semiconductor layer; a second source electrode layer and a second drain electrode layer covering the first source electrode layer and the first drain electrode layer, respectively, and being in contact with the oxide semiconductor layer; a gate insulating film over the oxide insulating film, the oxide semiconductor layer, the second source electrode layer, and the second drain electrode layer; a gate electrode layer over the gate insulating film and overlapping with the oxide semiconductor layer; and a protective insulating film over the gate insulating film and the gate electrode layer, wherein the gate insulating film is partly in contact with the oxide insulating film in an exterior region of the second source electrode layer and the second drain electrode layer. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A semiconductor device comprising:
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an oxide insulating film; an oxide semiconductor layer over the oxide insulating film; a first source electrode layer and a first drain electrode layer in contact with the oxide semiconductor layer; a second source electrode layer and a second drain electrode layer in contact with the first source electrode layer and the first drain electrode layer, respectively, and in contact with the oxide semiconductor layer; a gate insulating film over the oxide insulating film, the oxide semiconductor layer, the first source electrode layer, the first drain electrode layer, the second source electrode layer, and the second drain electrode layer; a gate electrode layer over the gate insulating film and overlapping with the oxide semiconductor layer; and a protective insulating film over the gate insulating film and the gate electrode layer, wherein the gate insulating film is partly in contact with the oxide insulating film in an exterior region of the first source electrode layer and the first drain electrode layer. - View Dependent Claims (8, 9, 10, 11, 12)
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Specification