MEMS Device and Method of Manufacturing a MEMS Device
1 Assignment
0 Petitions
Accused Products
Abstract
A method for manufacturing a MEMS device is disclosed. Moreover a MEMS device and a module including a MEMS device are disclosed. An embodiment includes a method for manufacturing MEMS devices includes forming a MEMS stack on a first main surface of a substrate, forming a polymer layer on a second main surface of the substrate and forming a first opening in the polymer layer and the substrate such that the first opening abuts the MEMS stack.
9 Citations
28 Claims
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1-10. -10. (canceled)
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11. A MEMS device comprising:
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a polymer layer; a substrate disposed on the polymer layer; a MEMS stack disposed on the substrate; a first opening disposed in the polymer layer; and a second opening disposed in the substrate such that the second opening abuts the MEMS stack and the first opening. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18)
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19. A module comprising:
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a MEMS device carrier; a MEMS device comprising; a polymer layer; a substrate disposed on the polymer layer; a MEMS stack disposed on the substrate; an opening through the polymer layer and the substrate connecting the MEMS stack; and an adhesive connecting the MEMS device carrier and the MEMS device. - View Dependent Claims (20, 21, 22)
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23. A MEMS device comprising:
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a polymer layer; a substrate disposed on the polymer layer, the substrate comprising a thickness of 100 μ
m to 200 μ
m;a MEMS stack disposed on the substrate, the MEMS stack comprising a thickness of 100 μ
m to 200 μ
m; andan opening disposed in the polymer layer and the substrate, the opening exposing the MEMS stack. - View Dependent Claims (24, 25, 26, 27, 28)
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Specification