FINGERPRINT SENSOR AND BUTTON COMBINATIONS AND METHODS OF MAKING SAME

• US 20140103943A1
• Filed: 10/09/2013
• Published: 04/17/2014
• Est. Priority Date: 10/14/2012
• Status: Active Grant

• Current Assignee: Synaptics Incorporated
• Original Assignee: Synaptics Incorporated
• Inventors: WICKBOLDT, Paul, DUNLAP, Brett
• Granted Patent: US 9,651,513 B2
• Time in Patent Office: Days
• US Class Current: 324/663
• CPC Class Codes: G01N 27/221 by investigating the dielectric properties using microwaves G01N22/00; measuring loss factors or dielectric constants per se G01R27/26
• CPC Class Codes: G06F 1/1692 the I/O peripheral being a secondary touch screen used as control interface, e.g. virtual buttons or sliders
• CPC Class Codes: G06F 3/0445 using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
• CPC Class Codes: G06F 3/0446 using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
• CPC Class Codes: G06V 40/1306 non-optical, e.g. ultrasonic or capacitive sensing
• CPC Class Codes: G06V 40/1329 Protecting the fingerprint sensor against damage caused by the finger
• CPC Class Codes: H01L 21/4857 Multilayer substrates multilayer metallisation on monolayer substrate H01L21/4846
• CPC Class Codes: H01L 21/486 Via connections through the substrate with or without pins
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 1/036 Multilayers with layers of different types
• CPC Class Codes: H05K 1/112 directly combined with via connections
• CPC Class Codes: H05K 1/145 Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
• CPC Class Codes: H05K 1/184 Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
• CPC Class Codes: H05K 1/186 manufactured by mounting on or connecting to patterned circuits before or during embedding
• CPC Class Codes: H05K 2201/10151 Sensor

Abstract

It will be understood by those skilled in the art that there is disclosed in the present application a biometric sensor that may comprise a plurality of a first type of signal traces formed on a first surface of a first layer of a multi-layer laminate package; at least one trace of a second type, formed on a second surface of the first layer or on a first surface of a second layer of the multi-layer laminate package; and connection vias in at least the first layer electrically connecting the signal traces of the first type or the signal traces of the second type to respective circuitry of the respective first or second type contained in an integrated circuit physically and electrically connected to one of the first layer, the second layer or a third layer of the multilayer laminate package.

Claims

1. A biometric sensor comprising;

a plurality of a first type of signal traces formed on a first surface of a first layer of a multi-layer laminate package;

at least one signal trace of a second type, formed on a second surface of the first layer or on a first surface of a second layer of the multi-layer laminate package;

connection vias in at least the first layer electrically connecting the signal traces of the first type or the signal traces of the second type to respective circuitry of the respective first or second type contained in an integrated circuit physically and electrically connected to one of the first layer, the second layer or a third layer of the multi-layer laminate package.

2. The biometric sensor of claim 1 further comprising:

the first type of signal trace comprising drive signal traces and the second type of traces comprising at least one receive signal trace or the first type of traces comprising receive signal traces and the second type of traces comprising at least one drive signal trace.

3. The biometric sensor of claim 1 further comprising:

the at least one trace of the second type comprising one trace of the second type and the sensor comprising a one dimensional linear array capacitive gap biometric sensor.

4. The biometric sensor of claim 1 further comprising:

the at least one trace of the second type comprising a plurality of traces of the second type and the sensor comprising a two dimensional array capacitive biometric sensor.

5. The biometric sensor of claim 1 further comprising:

the first layer comprising a circuit board layer and the second layer comprising a core layer attached to one side of the circuit board layer.

6. The biometric sensor of claim 5 further comprising:

a third layer comprising a circuit board layer attached to another side of the core layer.

7. The biometric sensor of claim 1 further comprising:

the biometric sensor encapsulated on all sides except for a top finger sensing side and attached to a substrate.

9. The biometric sensor of claim 7 further comprising:

the biometric sensor is encapsulated by moldable plastic material formed around the package by a molding process.

10. The biometric sensor of claim 9 further comprising:

the molding process forming an encapsulation molded with rounded edges and corners.

11. The biometric sensor of claim 1 further comprising:

the biometric sensor comprising a biometric sensor mounted on a portable electronic device.

12. The biometric sensor of claim 11 further comprising:

the biometric sensor cooperating mechanically with elements of a switch within the portable computing device to operate the switch.

8. The biometric sensor of claim b further comprising:

the biometric sensor encapsulated on all sides.

13. A method of operating a biometric sensor comprising;

providing a plurality of a first type of signal traces formed on a first surface of a first layer of a multi-layer laminate package;

providing at least one signal trace of a second type, formed on a second surface of the first layer or on a first surface of a second layer of the multi-layer laminate package;

providing connection vias in at least the first layer electrically connecting the signal traces of the first type or the signal traces of the second type to respective circuitry of the respective first or second type contained in an integrated circuit physically and electrically connected to one of the first layer, the second layer or a third layer of the multi-layer laminate package.

14. The method of claim 13 further comprising:

the first type of signal trace comprising drive signal traces and the second type of traces comprising at least one receive signal trace or the first type of traces comprising receive signal traces and the second type of traces comprising at least one drive signal trace.

15. The method of claim 13 further comprising:

the at least one trace of the second type comprising a plurality of traces of the second type and the sensor comprising a two dimensional array capacitive biometric sensor.

16. The method of claim 13 further comprising:

the first layer comprising a circuit board layer and the second layer comprising a core layer attached to one side of the circuit board layer.

17. The method of claim 16 further comprising:

a third layer comprising a circuit board layer attached to another side of the core layer.

18. The method of claim 13 further comprising:

the biometric sensor encapsulated on all sides except for a top finger sensing side and attached to a substrate.

19. The method of claim 18 further comprising:

the biometric sensor encapsulated on all sides.

20. The method of claim 18 further comprising:

the biometric sensor is encapsulated by moldable plastic material formed around the package by a molding process.

21. The method of claim 13 further comprising:

the at least one trace of the second type comprising one trace of the second type and the sensor comprising a one dimensional linear array capacitive gap biometric sensor.