THROUGH SUBSTRATE VIA INDUCTORS
First Claim
1. A device comprising:
- a substrate, at least a portion of the substrate including a glass, a cavity and at least two vias being defined in the substrate, a metal being disposed in the vias; and
a metal trace connecting the metal disposed in a first via and the metal disposed in a second via, the metal trace being disposed over a surface of the substrate, the metal disposed in the first via and the second via and the metal trace defining borders with respect to the cavity.
2 Assignments
0 Petitions
Accused Products
Abstract
This disclosure provides systems, methods, and apparatus for through substrate via inductors. In one aspect, a cavity is defined in a glass substrate. At least two metal bars are in the cavity. A first end of each metal bar is proximate a first surface of the substrate, and a second end of each metal bar is proximate a second surface of the substrate. A metal trace connects a first metal bar and a second metal bar. In some instances, one or more dielectric layers can be disposed on surfaces of the substrate. In some instances, the metal bars and the metal trace define an inductor. The inductor can have a degree of flexibility corresponding to a variable inductance. Metal turns can be arranged in a solenoidal or toroidal configuration. The toroidal inductor can have tapered traces and/or thermal ground planes. Transformers and resonator circuitry can be realized.
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Citations
46 Claims
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1. A device comprising:
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a substrate, at least a portion of the substrate including a glass, a cavity and at least two vias being defined in the substrate, a metal being disposed in the vias; and a metal trace connecting the metal disposed in a first via and the metal disposed in a second via, the metal trace being disposed over a surface of the substrate, the metal disposed in the first via and the second via and the metal trace defining borders with respect to the cavity. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
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26. A method comprising:
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forming a concave recess in each of a bottom glass substrate and a top glass substrate; attaching the bottom glass substrate to the top glass substrate to form a composite substrate, the concave recesses in each of the bottom glass substrate and the top glass substrate defining a cavity in the composite substrate; forming at least two vias in the composite substrate; and depositing a metal layer, the metal layer at least partially filling a first via and a second via and forming a trace connecting metals of the first via and the second via, the first via, the second via, and the trace defining borders with respect to the cavity. - View Dependent Claims (27, 28, 29, 30, 31, 32, 33, 34, 35)
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36. A method comprising:
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forming an open region in a cavity substrate; attaching a bottom glass substrate to a bottom surface of the cavity substrate; attaching a top glass substrate to a top surface of the cavity substrate, the bottom glass substrate, the cavity substrate, and the top glass substrate forming a composite substrate defining a cavity; forming at least two vias in the composite substrate; and depositing a metal layer, the metal layer at least partially filling a first via and a second via and forming a trace connecting metals of the first via and the second via. - View Dependent Claims (37, 38, 39, 40, 41, 42, 43, 44, 45, 46)
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Specification