PNP APPARATUS WITH PICK-UP TIP AND RELATED METHODS

• US 20140105717A1
• Filed: 10/15/2012
• Published: 04/17/2014
• Est. Priority Date: 10/15/2012
• Status: Active Grant

• Current Assignee: STMicroelectronics International N.V. (STMicroelectronics NV)
• Original Assignee: STMicroelectronics Asia Pacific Pte Limited (STMicroelectronics NV)
• Inventors: LOOI, Hk, CHEH, Cheng-hai, TOH, HaiKin
• Granted Patent: US 9,003,644 B2
• Time in Patent Office: Days
• US Class Current: 414/752.1
• CPC Class Codes: B25J 15/0616 with vacuum
• CPC Class Codes: H05K 13/0409 Sucking devices
• CPC Class Codes: H05K 13/0413 with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
• CPC Class Codes: Y10S 901/40 Vacuum or mangetic
• CPC Class Codes: Y10T 29/53178 Chip component
• CPC Class Codes: Y10T 29/53191 Means to apply vacuum directly to position or hold work part

Abstract

A PNP apparatus may include a robotic arm, and a PNP tool head carried by the robotic arm. The PNP tool head may include a body configured to apply bonding pressure to a first area of an electronic device, and a pick-up tip movable between an extended position and a retracted position relative to the body as the pick-up tip rests against a second area of the electronic device. The pick-up tip may define a vacuum passageway therethrough to couple a vacuum source to the second area of the electronic device.

Claims

1. A pick-and-place (PNP) apparatus comprising:

a robotic arm; and

a PNP tool head carried by said robotic arm comprising

a body configured to apply bonding pressure to a first area of an electronic device, and

a pick-up tip movable between an extended position and a retracted position relative to said body as said pick-up tip rests against a second area of the electronic device, said pick-up tip defining at least one vacuum passageway therethrough to couple a vacuum source to the second area of the electronic device.

2. The PNP apparatus of claim 1 wherein said body has a tip receiving passageway therein;

and wherein said pick-up tip is slidably received within the tip receiving passageway.

3. The PNP apparatus of claim 1 further comprising:

a bond head coupled to said robotic arm; and

at least one bias member coupled between said bond head and said body.

4. The PNP apparatus of claim 3 wherein said bond head has a recess therein configured to receive said pick-up tip when in the retracted position.

5. The PNP apparatus of claim 1 wherein said pick-up tip has a tubular shape with a distal open end defining the at least one vacuum passageway, and a vacuum source port coupled in fluid communication with the distal open end.

6. The PNP apparatus of claim 1 further comprising a controller coupled to said robotic arm.

7. The PNP apparatus of claim 1 wherein the electronic device has a rectangular shape with four upper corner portions defining the first area.

8. The PNP apparatus of claim 1 wherein the electronic device has a rectangular shape with an upper medial portion defining the second area;

and wherein the at least one vacuum passageway comprises a single vacuum passageway aligned with the upper medial portion of the electronic device.

9. The PNP apparatus of claim 1 wherein the electronic device comprises an image sensor housing defining the first area, and a lens barrel carried by the image sensor housing defining the second area.

10. A pick-and-place (PNP) apparatus comprising:

a robotic arm;

a controller coupled to said robotic arm; and

a PNP tool head carried by said robotic arm comprising

a body configured to apply bonding pressure to a first area of an electronic device, and having a tip receiving passageway therein, and

a pick-up tip slidably received within the tip receiving passageway and movable between an extended position and a retracted position relative to said body as said pick-up tip rests against a second area of the electronic device, said pick-up tip defining at least one vacuum passageway therethrough to couple a vacuum source to the second area of the electronic device.

11. The PNP apparatus of claim 10 further comprising:

a bond head coupled to said robotic arm; and

at least one bias member coupled between said bond head and said body.

12. The PNP apparatus of claim 11 wherein said bond head has a recess therein configured to receive said pick-up tip when in the retracted position.

13. The PNP apparatus of claim 10 wherein said pick-up tip has a tubular shape with a distal open end defining the at least one vacuum passageway, and a vacuum source port coupled in fluid communication with the distal open end.

14. A pick-and-place (PNP) tool head comprising:

a body configured to apply bonding pressure to a first area of an electronic device; and

a pick-up tip movable between an extended position and a retracted position relative to said body as said pick-up tip rests against a second area of the electronic device, said pick-up tip defining at least one vacuum passageway therethrough to couple a vacuum source to the second area of the electronic device.

15. The PNP tool head of claim 14 wherein said body has a tip receiving passageway therein;

and wherein said pick-up tip is slidably received within the tip receiving passageway.

16. The PNP tool head of claim 14 further comprising:

a bond head coupled to said robotic arm; and

at least one bias member coupled between said bond head and said body.

17. The PNP tool head of claim 16 wherein said bond head has a recess therein configured to receive said pick-up tip when in the retracted position.

18. The PNP tool head of claim 14 wherein said pick-up tip has a tubular shape with a distal open end defining the at least one vacuum passageway, and a vacuum source port coupled in fluid communication with the distal open end.

19. A method of positioning an electronic device with a pick-and-place (PNP) apparatus comprising a robotic arm, and a PNP tool head carried by the robotic arm comprising a body to apply bonding pressure to a first area of an electronic device, and a pick-up tip to be movable between an extended position and a retracted position relative to the body as the pick-up tip rests against a second area of the electronic device, the pick-up tip defining at least one vacuum passageway therethrough to couple a vacuum source to the second area of the electronic device, the method comprising:

engaging the pick-up tip adjacent the second area of the electronic device; and

subsequently engaging the body adjacent the first area of the electronic device.

20. The method of claim 19 wherein the body has a tip receiving passageway therein;

and wherein the pick-up tip is slidably received within the tip receiving passageway.

21. The method of claim 19 further comprising receiving the pick-up tip in a recess of the bond head when the pick-up tip is in the retracted position.

22. The method of claim 19 wherein the pick-up tip has a tubular shape with a distal open end defining the at least one vacuum passageway, and a vacuum source port coupled in fluid communication with the distal open end.

23. The method of claim 19 further comprising using the vacuum source coupled in fluid communication with the PNP tool head.

24. The method of claim 19 wherein the electronic device has a rectangular shape with four upper corner portions defining the first area.

25. The method of claim 19 wherein the electronic device has a rectangular shape with an upper medial portion defining the second area;

and wherein the at least one vacuum passageway comprises a single vacuum passageway aligned with the upper medial portion of the electronic device.