Two Terminal Packaging

• US 20140110727A1
• Filed: 10/22/2013
• Published: 04/24/2014
• Est. Priority Date: 10/22/2012
• Status: Active Grant

• Current Assignee: Sensor Electronic Technology Incorporated (Seoul Semiconductor Co., Ltd.)
• Original Assignee: Sensor Electronic Technology Incorporated (Seoul Semiconductor Co., Ltd.)
• Inventors: Bilenko, Yuri, Shur, Michael, Gaska, Remigijus
• Granted Patent: US 9,117,983 B2
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/06102 the bonding areas being at different heights
• CPC Class Codes: H01L 2224/1403 Bump connectors having different sizes, e.g. different diameters, heights or widths
• CPC Class Codes: H01L 2224/16245 the item being metallic
• CPC Class Codes: H01L 2224/81 using a bump connector
• CPC Class Codes: H01L 2224/81191 wherein the bump connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/94 at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 24/94 at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
• CPC Class Codes: H01L 27/15 including semiconductor components having potential barriers, specially adapted for light emission
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A solution for packaging a two terminal device, such as a light emitting diode, is provided. In one embodiment, a method of packaging a two terminal device includes: patterning a metal sheet to include a plurality of openings; bonding at least one two terminal device to the metal sheet, wherein a first opening corresponds to a distance between a first contact and a second contact of the at least one two terminal device; and cutting the metal sheet around each of the least one two terminal device, wherein the metal sheet forms a first electrode to the first contact and a second electrode to the second contact.

Claims

1. A method of packaging a two terminal device, the method comprising:

patterning a metal sheet to include a plurality of openings;

bonding at least one two terminal device to the metal sheet, wherein a first opening corresponds to a distance between a first contact and a second contact of the at least one two terminal device; and

cutting the metal sheet around each of the least one two terminal device, wherein the metal sheet forms a first electrode to the first contact and a second electrode to the second contact.

2. The method of claim 1, wherein a second opening corresponds to a distance between a first two terminal device and a second two terminal device.

3. The method of claim 1, further comprising encapsulating each at least one two terminal device.

4. The method of claim 1, further comprising depositing a dielectric layer within the first opening between the first electrode and the second electrode of the at least one two terminal device.

5. The method of claim 4, further comprising depositing a dielectric layer within the first opening between two terminal devices.

6. The method of claim 1, wherein patterning the metal sheet includes imprinting a three-dimensional depression for the at least one two terminal device.

7. The method of claim 6, further comprising depositing a reflective coating within the three-dimensional depression.

8. The method of claim 6, wherein the two terminal device comprises a light emitting diode, the method further comprising depositing a fluorescent material within the three-dimensional depression, wherein the fluorescent material indicates an on/off state of the at least one two terminal device.

9. A method of packaging a two terminal light emitting diode (LED) device, the method comprising:

patterning a metal sheet to include a plurality of openings;

bonding a plurality of LED devices to the metal sheet, wherein a first opening corresponds to a distance between a first contact and a second contact of at least one of the LED devices, and a second opening corresponds to a distance between a first LED device and a second LED device; and

cutting the metal sheet around each of the LED devices, wherein the metal sheet forms a first electrode to the first contact and a second electrode to the second contact.

10. The method of claim 9, further comprising encapsulating each of the LED devices.

11. The method of claim 9, wherein the patterning the metal sheet includes imprinting a three-dimensional depression for each of the LED devices.

12. The method of claim 11, further comprising depositing a dielectric layer within the first opening between the first electrode and the second electrode of each of the LED devices.

13. The method of claim 12, further comprising depositing a dielectric layer within the first opening between two LED devices.

14. The method of claim 11, further comprising depositing a reflective coating within the three-dimensional depression.

15. The method of claim 14, further comprising depositing a fluorescent material adjacent to the reflective coating, wherein the fluorescent material indicates an on/off state for each of the LED devices.

16. A two terminal light emitting diode (LED) package array, comprising:

a wafer including a plurality of two terminal LED devices; and

a metal sheet patterned to include a plurality of openings, wherein the metal sheet is bonded to the plurality of two terminal LED devices to form a first electrode and a second electrode for each of the plurality of two terminal LED devices, such that a first opening of the metal sheet corresponds to a distance between a first contact and a second contact of at least one of the LED devices and a second opening corresponds to a distance between a first LED device and a second LED device.

17. The two terminal LED package array of claim 16, wherein the metal sheet further comprises a plurality of three-dimensional depressions for each of the plurality of LED devices.

18. The two terminal LED package array of 17, further comprising a reflective coating within at least one of the plurality of three-dimensional depressions.

19. The two terminal LED package array of 16, further comprising an encapsulant surrounding each of the plurality of two terminal LED devices.

20. The two terminal LED package array of 16, further comprising a dielectric layer within the first opening between the first electrode and the second electrode of each of the plurality of LED devices.