Apparatus and Method for Forming Semiconductor Contacts
First Claim
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1. An apparatus comprising:
- a substrate formed of a first material;
an isolation region formed in a substrate;
a fin structure formed over the substrate, wherein the fin structure is formed of a second material, and wherein the fin structure protrudes above a top surface of the isolation region, and wherein the fin structure comprises;
a channel connected between a first drain/source region and a second drain/source region;
a gate electrode wrapping the channel of the fin structure;
a first barrier-less contact region formed over the first drain/source region; and
a first metal contact formed over the first barrier-less contact region.
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Abstract
A method for forming semiconductor contacts comprises forming a germanium fin structure over a silicon substrate, depositing a doped amorphous silicon layer over the first drain/source region and the second drain/source region at a first temperature, wherein the first temperature is lower than a melting point of the germanium fin structure and performing a solid phase epitaxial regrowth process on the amorphous silicon layer at a second temperature, wherein the second temperature is lower than the melting point of the germanium fin structure.
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Citations
20 Claims
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1. An apparatus comprising:
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a substrate formed of a first material; an isolation region formed in a substrate; a fin structure formed over the substrate, wherein the fin structure is formed of a second material, and wherein the fin structure protrudes above a top surface of the isolation region, and wherein the fin structure comprises; a channel connected between a first drain/source region and a second drain/source region; a gate electrode wrapping the channel of the fin structure; a first barrier-less contact region formed over the first drain/source region; and a first metal contact formed over the first barrier-less contact region. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method comprising:
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forming a germanium fin structure over a silicon substrate, wherein the germanium fin structure comprises; a channel connected between a first drain/source region and a second drain/source region; depositing an N+ amorphous silicon layer over the first drain/source region and the second drain/source region at a first temperature, wherein the first temperature is lower than a melting point of the germanium fin structure; and performing a solid phase epitaxial regrowth process on the amorphous silicon layer at a second temperature, wherein the second temperature is lower than the melting point of the germanium fin structure. - View Dependent Claims (10, 11, 12, 13, 14)
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15. A method comprising:
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forming a germanium fin over a silicon substrate, wherein the germanium fin comprises; a first drain/source region; a second drain/source region; and a channel coupled between the first drain/source region and the second drain/source region; forming a gate structure over the channel, wherein the gate structure comprises; a gate dielectric layer; and a gate electrode layer formed over the gate dielectric layer; depositing a first amorphous silicon layer over the first drain/source region at a first temperature; depositing a second amorphous silicon layer over the second drain/source region at a second temperature; and performing a solid phase epitaxial regrowth process on the first amorphous silicon layer and the second amorphous silicon layer at a third temperature. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification