Semiconductor Package and Method of Mounting Semiconductor Die to Opposite Sides of TSV Substrate
First Claim
1. A method of making a semiconductor device, comprising:
- providing a substrate;
disposing a first semiconductor die over a first surface of the substrate;
depositing a first encapsulant over the first semiconductor die;
disposing a second semiconductor die over a second surface of the substrate opposite the first surface; and
forming a first interconnect structure over the second surface of the substrate.
4 Assignments
0 Petitions
Accused Products
Abstract
A semiconductor device includes a wafer level substrate having a plurality of first conductive vias formed through the wafer level substrate. A first semiconductor die is mounted to the wafer level substrate. A first surface of the first semiconductor die includes contact pads oriented toward a first surface of the wafer level substrate. A first encapsulant is deposited over the first semiconductor die. A second semiconductor die is mounted to the wafer level substrate. A first surface of the second semiconductor die includes contact pads oriented toward a second surface of the wafer level substrate opposite the first surface of the wafer level substrate. A second encapsulant is deposited over the second semiconductor die. A plurality of bumps is formed over the plurality of first conductive vias. A second conductive via can be formed through the first encapsulant and connected to the first conductive via. The semiconductor packages are stackable.
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Citations
25 Claims
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1. A method of making a semiconductor device, comprising:
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providing a substrate; disposing a first semiconductor die over a first surface of the substrate; depositing a first encapsulant over the first semiconductor die; disposing a second semiconductor die over a second surface of the substrate opposite the first surface; and forming a first interconnect structure over the second surface of the substrate. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method of making a semiconductor device, comprising:
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providing a substrate; disposing a first semiconductor die over a first surface of the substrate; depositing a first encapsulant over the first semiconductor die; and disposing a second semiconductor die over a second surface of the substrate opposite the first surface. - View Dependent Claims (8, 9, 10, 11, 12, 13)
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14. A semiconductor device, comprising:
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a substrate; a first semiconductor die disposed over a first surface of the substrate; a first encapsulant deposited over the first semiconductor die; and a second semiconductor die disposed over a second surface of the substrate. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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21. A semiconductor device, comprising:
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a substrate; a first semiconductor die disposed over the substrate; an interconnect structure formed over the substrate; and a first encapsulant deposited over the first semiconductor die and around the interconnect structure. - View Dependent Claims (22, 23, 24, 25)
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Specification