ELECTRONIC DEVICE HOUSING AND METHOD FOR MANUFACTURING SAME

• US 20140113089A1
• Filed: 04/30/2013
• Published: 04/24/2014
• Est. Priority Date: 10/18/2012
• Status: Active Grant

• Current Assignee: FIH (Hong Kong) Limited (Hon Hai Precision Industry Co., Ltd.), Shenzhen Futaihong Precision Industrial Company Limited (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: FIH (Hong Kong) Limited (Hon Hai Precision Industry Co., Ltd.), Shenzhen Futaihong Precision Industrial Company Limited (Hon Hai Precision Industry Co., Ltd.)
• Inventors: LIU, XU, NA, LI-HONG
• Granted Patent: US 9,243,317 B2
• Time in Patent Office: Days
• US Class Current: 428/34.6
• CPC Class Codes: C23C 14/0015 characterized by the colour of the layer
• CPC Class Codes: C23C 14/20 on organic substrates
• CPC Class Codes: Y10T 428/1317 Multilayer [continuous layer]
• CPC Class Codes: Y10T 428/1355 Elemental metal containing [e.g., substrate, foil, film, coating, etc.]

Abstract

A electronic device housing includes a substrate, and the electronic device housing further includes a first color layer, a metallic coating, a second color layer, and a second metallic coating formed directly on the substrate in that order. The first color layer is disposed on the substrate and covering portions of the internal surface. The first metallic coating is formed on the first color layer and completely covers the first color layer. The second color layer is formed on the first metallic coating and directly covers the portions of the internal surface which is uncovered by the first color layer. The second color layer and the first color layer have different colors. The second color layer and the first color layer are transparent or translucent. A method for manufacturing the electronic device housing is also provided.

Claims

1. An electronic device housing comprising:

a substrate, the substrate being transparent, the substrate comprising an external surface and an internal surface opposite to the external surface;

a first color layer disposed on the substrate and covering portions of the internal surface;

a first metallic coating disposed on the first color layer and completely covering the first color layer; and

a second color layer formed on the first metallic coating and directly covering the portions of the internal surface which is uncovered by the first color layer, the second color layer and the first color layer having different colors, the second color layer and the first color layer being transparent or translucent.

2. The electronic device housing of claim 1, wherein the second color layer further comprise portions which are directly formed on the first metallic coating.

3. The electronic device housing of claim 1, wherein the substrate is made of plastic or glass.

4. The electronic device housing of claim 1, wherein the first color layer and the second color layer are made of colored paint.

5. The electronic device housing of claim 1, wherein the first metallic coating and the second metallic coating are silvery white.

6. The electronic device housing of claim 1, wherein the first metallic coating and the second metallic coating are made of at least one metal/metal alloy selected from the group consisting of indium, tin, indium tin alloy, stainless steel, and aluminum.

7. The electronic device housing of claim 6, wherein the first metallic coating and the second metallic coating are non-conductive vacuum metalizing coatings.

8. The electronic device housing of claim 7, wherein the first metallic coating or the second metallic coating has a thickness of about 0.1 μ

m to about 0.5 μ

m.

9. The electronic device housing of claim 1, wherein the second color layer has a thickness of about 6 μ

m to about 12 μ

m.

10. The electronic device housing of claim 1, further comprising a protecting layer formed on the second metallic coating.

11. The electronic device housing of claim 10, wherein the protecting layer has a thickness of about 15 μ

m to about 20 μ

m.

12. The electronic device housing of claim 10, wherein the protecting layer is made of paint or ink.

13. A method for manufacturing a electronic device housing, comprising:

providing a substrate, the substrate being transparent, the substrate comprising an external surface and an internal surface opposite to the external surface;

forming a first color layer on the internal surface by painting or spraying, the first color layer being transparent or translucent;

depositing a first metallic coating on the first color layer by physical vapor deposition;

laser engraving portions of the first metallic coating and portions of the first color layer corresponding to the portions of the first metallic coating;

forming a second color layer on the first metallic coating by painting or spraying, the second color layer being transparent or translucent, the second color layer and the first color layer having different colors; and

depositing a second metallic coating on the second color layer by physical vapor deposition.

14. The method of claim 13, wherein the first metallic coating and the second metallic coating are formed by vacuum evaporation using indium, tin, indium tin alloy, stainless steel and/or aluminum as a target.

15. The method of claim 13, further comprising a step of forming a protecting layer on the second metallic coating by painting or spraying.