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COMBINED PRESSURE AND HUMIDITY SENSOR

  • US 20140116122A1
  • Filed: 10/25/2013
  • Published: 05/01/2014
  • Est. Priority Date: 10/25/2012
  • Status: Active Grant
First Claim
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1. A semiconductor package comprising:

  • a substrate having an upper surface and a lower surface;

    a housing cover having a sidewall portion attached to the substrate and an outer wall portion extending over the upper surface of the substrate, the substrate and the housing cover forming a housing that surrounds and defines an interior volume;

    a pressure sensor device supported within the interior volume, the pressure sensor having a top side with including a flexible membrane;

    a humidity sensor device supported within the interior volume and including a moisture-sensitive material;

    an evaluation circuit device supported within the interior volume and electrically connected to the pressure sensor and the humidity sensor;

    a media opening in the housing that enables gas exchange between the interior volume and an exterior of the housing;

    wherein the media opening is positioned closer to the moisture-sensitive material of the humidity sensor than the flexible membrane of the pressure sensor, andwherein the media opening is positioned in the housing at a location that is offset laterally from the pressure sensor device and below the top side of the pressure sensor device with respect to vertical.

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